16results about "Amplifiers with transit-time effect" patented technology

A traveling-wave parametric amplifier (TWPA) transmission line having an improved bandwidth includes one or more unit cells. Each unit cell includes a capacitor and a Josephson junction connected in series and leading to ground, configured to provide inductance and non-linearity. One or more distributed resonators are coupled to the transmission line. The distributed resonators are configured to (i) use a first harmonic mode of the resonator for resonance phase matching in the transmission line and (ii) prevent the second mode of the resonator from interacting with the intermodulation product of the transmission line.

The present disclosure relates to a TWPA device (1) for a quantum computer, which has a two-band dispersion relation and is configured to perform three-wave mixing. The TWPA device (1) comprises a chain of unit cells (φ), each comprising a non-linear inductance element (5) and a capacitor (6) connected to its ground (7). The unit cell (φ) further comprises a resonator circuit (8) and one of the periodically modulated input parameters. The two-band dispersion relation is composed of a lower frequency band and a higher frequency band, sandwiching a frequency gap. Further, the TWPA device (1) is configured to receive an amplified signal and a pump signal at the input (2). The pump signal is in the higher frequency band described above and has a frequency that is at least 2 / 3 of the cut-off frequency of the TWPA device (1) described above, or the pump signal described above is in the lower frequency band described above and its second harmonic has a frequency within the frequency gap described above.

A system and associated method transfer power between a DC source and a variable load. Two power signals are extracted from the DC source at HF frequency via two self-synchronous radio frequency rectifiers / amplifiers switched by two corresponding HF switching signals having between them either a frequency difference or a phase difference controlled by a duty cycle and overlap controller. The two HF power signals are mixed in a wired, wireless, or bimodal wireless HF power link system to produce a transferred power signal based on the mixing and on manipulating the phase difference when present. A power signal conversion circuit in communication with the HF power link system produces an unfolded output power signal from the transferred power signal. The system and method allow transfer to the load of at least one of an adjustable DC power signal and an AC power signal phase locked to an existing power signal in the load.

A system and associated method transfer power between a DC source and a variable load. Two power signals are extracted from the DC source at an HF frequency via two self-synchronous radio frequency rectifiers / amplifiers switched by two corresponding HF switching signals having between them a phase difference controlled by a duty cycle and overlap controller. The two HF power signals are mixed in a wired, wireless, or bimodal wireless HF power link system to produce a transferred power signal based on the mixing and on manipulating the phase difference. An unfolded output power signal is created from the transferred power signal by means of a power signal conversion circuit in communication with the HF power link system. The system and method allow transfer to the load of at least one of an adjustable DC power signal and an AC power signal phase locked to an existing power signal in the load.

The power module comprises a high-frequency switching electronic power regulator including a plurality of stacked rectifiers / filters, wherein the plurality of stacked rectifiers / filters generate a plurality of stacked DC output voltages, and a vacuum electronic device coupled to the high-frequency switching electronic power regulator, wherein the vacuum electronic device includes a plurality of components, each component receiving a corresponding DC output voltage from the plurality of stacked DC output voltages.

This disclosure relates to a frequency multiplexer (1) comprising a first port (2a), a plurality of second ports (2b), each associated with a specific frequency band, and a plurality of signal filtering sections (30, 40, 50, 60) connecting each of the second ports (2b) to the first port (2a). Each signal filtering section (30, 40, 50, 60) is one of a high-pass signal filtering section (30), a low-pass signal filtering section (40), a band-pass signal filtering section (50), and a band-stop signal filtering section (60). Furthermore, each signal filtering section (30, 40, 50, 60) comprises a chain of superconducting junctions (35, 45, 55, 65).

This application provides a travelling-wave tube, an electron gun, and a power amplification system, to improve electronic efficiency of the travelling-wave tube when the travelling-wave tube performs linear amplification on a radio frequency signal, thereby effectively reducing power consumption of the travelling-wave tube. The travelling-wave tube includes an input apparatus, a control circuit, an electron gun, a slow-wave circuit, and an output apparatus. The input apparatus may be configured to: receive a radio frequency signal, and feed the radio frequency signal into the slow-wave circuit. The control circuit may be configured to: determine a quantity N of electron beams and currents of the N electron beams, and control the electron gun to emit the N electron beams. Further, the slow-wave circuit may perform beam-wave interaction with the N electron beams, to amplify power of the radio frequency signa, and because the slow-wave circuit works in a saturation region, electronic efficiency of the travelling-wave tube can be greater than or equal to a first threshold. The output apparatus may output an amplified radio frequency signal.

The present invention discloses a method and an apparatus for supplying high output RF (Radio Frequency) power. According to one embodiment of the present disclosure, an apparatus for supplying high output RF power may include: an LLRF (Low Level Radio Frequency) module for supplying first RF power to a first power amplifier; a first power amplifier that amplifies the first RF power to generate second RF power, and supplies the second RF power to a second power amplifier; a modulator that supplies a high voltage pulse to the second power amplifier; and the second power amplifier that generates a third RF power using the second RF power and the high voltage pulse.

To create a VED having a plurality of two-dimensional layers formed of different materials which are joined together to form at least one vacuum electronic device (VED) at the same time.SOLUTION: A two-dimensional material layer is mechanically processed to include features necessary for device operations to form features of a three-dimension when the two-dimensional material is assembled and is joined and becomes a three-dimensional structure. The two-dimensional layers are joined together using techniques such as brazing, diffusion bonding, assisted diffusion bonding, solid-state bonding, cold welding, and ultrasonic welding. This manufacturing step makes it possible to built in a metal material, a magnetic material, and a ceramic material which are necessary to manufacture a VED while maintaining a required positional accuracy and a large number of devices for a batch capacity. The thus formed VED includes a combination of a magnetic lens and an electrostatic lens for controlling electron beams.SELECTED DRAWING: Figure 1

The application discloses a space traveling wave tube amplifier power module based on FPGA and a control method thereof. Control logics of original sub-circuits are realized through FPGA software, the number of circuit components, the circuit area and weight are effectively reduced under the premise of realizing the same control circuit function, the production debugging difficulty and period are greatly reduced, the consistency of products in the production process is improved, meanwhile, the conversion efficiency and power density of the power module are improved by adopting the method, and the performance of the product is improved.

A power amplifier module includes a module substrate, a power transistor die, and a heat spreader. The module substrate has first, second, and third module pads exposed at a mounting surface. The power transistor die has an input / output surface that faces the mounting surface, an opposed ground surface, an input pad electrically coupled to the first module pad, an output pad electrically coupled to the second module pad, and an integrated power transistor. In an embodiment, the power transistor is a field effect transistor with a gate terminal coupled to the input pad, a drain terminal coupled to the output pad, and a source terminal coupled to the ground surface. The heat spreader has a thermal contact surface that is physically and electrically coupled to the ground surface of the power transistor die. An electrical ground contact structure is connected between the thermal contact surface and the third module pad.

To provide an amplifier circuit capable of temperature compensation using a small circuit.SOLUTION: An amplifier circuit includes a first amplifier 12 that amplifies a high frequency signal, and a load circuit that changes the load impedance of the first amplifier without being controlled by an external circuit such that the saturated power at a first temperature is higher than the saturated power at a second temperature lower than the first temperature, and the efficiency at the first temperature is lower than the efficiency at the second temperature.SELECTED DRAWING: Figure 5

A method for fabricating a traveling wave parametric amplifier (TWPA) includes forming a superconducting junction on a substrate. Trenches are etched through a metal surface and into a layer of dielectric material. The trenches define a plurality of fingers positioned in an interdigitated arrangement of a capacitor defined by the metal and dielectric material remaining from the etched-away metal surface and layer of dielectric material.

Electroplated helical conductors and methods for making the electroplated helical conductors are provided. The electroplated helical conductors are made from pre-formed thermally and electrically conducting nanomembrane ribbons having non-helical or helical configurations. The dimensions and shapes of the pre-formed nanomembrane ribbons are altered and controlled by the electrodeposition of a metal film onto the surfaces of the nanomembrane ribbons.

The system and associated method transmit power between a DC power source and a variable load. Two power signals are extracted from the DC power source at HF ​​frequencies via two self-synchronous high-frequency rectifiers / amplifiers, which are switched by two corresponding HF switching signals with a phase difference controlled by a duty cycle and overlap controller. The two HF power signals are mixed in a wired, wireless, or bimodal wireless HF power link system to generate a transferred power signal based on the mixing and phase difference operations. The unfolded output power signal is generated from the transferred power signals by a power signal conversion circuit that communicates with the HF power link system. This system and method allows for the transfer of a phase-locked adjustable DC power signal and an AC power signal to at least one load, with the power signal already present in the load.

A power amplifier module includes a module substrate, a power transistor die, and a heat spreader. The module substrate has first, second, and third module pads exposed at a mounting surface. The power transistor die has an input / output surface that faces the mounting surface, an opposed ground surface, an input pad electrically coupled to the first module pad, an output pad electrically coupled to the second module pad, and an integrated power transistor. In an embodiment, the power transistor is a field effect transistor with a gate terminal coupled to the input pad, a drain terminal coupled to the output pad, and a source terminal coupled to the ground surface. The heat spreader has a thermal contact surface that is physically and electrically coupled to the ground surface of the power transistor die. An electrical ground contact structure is connected between the thermal contact surface and the third module pad.