10results about "Amplifiers with transit-time effect" patented technology

The present disclosure relates to a TWPA device (1) for a quantum computer, which has a two-band dispersion relation and is configured to perform three-wave mixing. The TWPA device (1) comprises a chain of unit cells (φ), each comprising a non-linear inductance element (5) and a capacitor (6) connected to its ground (7). The unit cell (φ) further comprises a resonator circuit (8) and one of the periodically modulated input parameters. The two-band dispersion relation is composed of a lower frequency band and a higher frequency band, sandwiching a frequency gap. Further, the TWPA device (1) is configured to receive an amplified signal and a pump signal at the input (2). The pump signal is in the higher frequency band described above and has a frequency that is at least 2 / 3 of the cut-off frequency of the TWPA device (1) described above, or the pump signal described above is in the lower frequency band described above and its second harmonic has a frequency within the frequency gap described above.

A system and associated method transfer power between a DC source and a variable load. Two power signals are extracted from the DC source at HF frequency via two self-synchronous radio frequency rectifiers / amplifiers switched by two corresponding HF switching signals having between them either a frequency difference or a phase difference controlled by a duty cycle and overlap controller. The two HF power signals are mixed in a wired, wireless, or bimodal wireless HF power link system to produce a transferred power signal based on the mixing and on manipulating the phase difference when present. A power signal conversion circuit in communication with the HF power link system produces an unfolded output power signal from the transferred power signal. The system and method allow transfer to the load of at least one of an adjustable DC power signal and an AC power signal phase locked to an existing power signal in the load.

A system and associated method transfer power between a DC source and a variable load. Two power signals are extracted from the DC source at an HF frequency via two self-synchronous radio frequency rectifiers / amplifiers switched by two corresponding HF switching signals having between them a phase difference controlled by a duty cycle and overlap controller. The two HF power signals are mixed in a wired, wireless, or bimodal wireless HF power link system to produce a transferred power signal based on the mixing and on manipulating the phase difference. An unfolded output power signal is created from the transferred power signal by means of a power signal conversion circuit in communication with the HF power link system. The system and method allow transfer to the load of at least one of an adjustable DC power signal and an AC power signal phase locked to an existing power signal in the load.

The power module comprises a high-frequency switching electronic power regulator including a plurality of stacked rectifiers / filters, wherein the plurality of stacked rectifiers / filters generate a plurality of stacked DC output voltages, and a vacuum electronic device coupled to the high-frequency switching electronic power regulator, wherein the vacuum electronic device includes a plurality of components, each component receiving a corresponding DC output voltage from the plurality of stacked DC output voltages.

This disclosure relates to a frequency multiplexer (1) comprising a first port (2a), a plurality of second ports (2b), each associated with a specific frequency band, and a plurality of signal filtering sections (30, 40, 50, 60) connecting each of the second ports (2b) to the first port (2a). Each signal filtering section (30, 40, 50, 60) is one of a high-pass signal filtering section (30), a low-pass signal filtering section (40), a band-pass signal filtering section (50), and a band-stop signal filtering section (60). Furthermore, each signal filtering section (30, 40, 50, 60) comprises a chain of superconducting junctions (35, 45, 55, 65).

To create a VED having a plurality of two-dimensional layers formed of different materials which are joined together to form at least one vacuum electronic device (VED) at the same time.SOLUTION: A two-dimensional material layer is mechanically processed to include features necessary for device operations to form features of a three-dimension when the two-dimensional material is assembled and is joined and becomes a three-dimensional structure. The two-dimensional layers are joined together using techniques such as brazing, diffusion bonding, assisted diffusion bonding, solid-state bonding, cold welding, and ultrasonic welding. This manufacturing step makes it possible to built in a metal material, a magnetic material, and a ceramic material which are necessary to manufacture a VED while maintaining a required positional accuracy and a large number of devices for a batch capacity. The thus formed VED includes a combination of a magnetic lens and an electrostatic lens for controlling electron beams.SELECTED DRAWING: Figure 1

The application discloses a space traveling wave tube amplifier power module based on FPGA and a control method thereof. Control logics of original sub-circuits are realized through FPGA software, the number of circuit components, the circuit area and weight are effectively reduced under the premise of realizing the same control circuit function, the production debugging difficulty and period are greatly reduced, the consistency of products in the production process is improved, meanwhile, the conversion efficiency and power density of the power module are improved by adopting the method, and the performance of the product is improved.

A power amplifier module includes a module substrate, a power transistor die, and a heat spreader. The module substrate has first, second, and third module pads exposed at a mounting surface. The power transistor die has an input / output surface that faces the mounting surface, an opposed ground surface, an input pad electrically coupled to the first module pad, an output pad electrically coupled to the second module pad, and an integrated power transistor. In an embodiment, the power transistor is a field effect transistor with a gate terminal coupled to the input pad, a drain terminal coupled to the output pad, and a source terminal coupled to the ground surface. The heat spreader has a thermal contact surface that is physically and electrically coupled to the ground surface of the power transistor die. An electrical ground contact structure is connected between the thermal contact surface and the third module pad.

The system and associated method transmit power between a DC power source and a variable load. Two power signals are extracted from the DC power source at HF ​​frequencies via two self-synchronous high-frequency rectifiers / amplifiers, which are switched by two corresponding HF switching signals with a phase difference controlled by a duty cycle and overlap controller. The two HF power signals are mixed in a wired, wireless, or bimodal wireless HF power link system to generate a transferred power signal based on the mixing and phase difference operations. The unfolded output power signal is generated from the transferred power signals by a power signal conversion circuit that communicates with the HF power link system. This system and method allows for the transfer of a phase-locked adjustable DC power signal and an AC power signal to at least one load, with the power signal already present in the load.

A power amplifier module includes a module substrate, a power transistor die, and a heat spreader. The module substrate has first, second, and third module pads exposed at a mounting surface. The power transistor die has an input / output surface that faces the mounting surface, an opposed ground surface, an input pad electrically coupled to the first module pad, an output pad electrically coupled to the second module pad, and an integrated power transistor. In an embodiment, the power transistor is a field effect transistor with a gate terminal coupled to the input pad, a drain terminal coupled to the output pad, and a source terminal coupled to the ground surface. The heat spreader has a thermal contact surface that is physically and electrically coupled to the ground surface of the power transistor die. An electrical ground contact structure is connected between the thermal contact surface and the third module pad.