The application discloses a high-temperature-resistant
silicon-modified
epoxy sealing primer, and relates to the technical field of anticorrosive primers. The high-temperature-resistant
silicon-modified
epoxy sealing primer comprises components A and B in a weight ratio of 88-93:7-12. The component A comprises, by weight, 25-35 parts of modified
epoxy resin, 15-18 parts of composite
solvent, 55-65 parts of
zinc powder, 2-4 parts of
graphene paste, 4-6 parts of
calcium sulfate, 0.3-0.7 parts of
fumed silica, 1.2-1.8 parts of a compounded
silane coupling agent and 0.8-1.4 parts of an additive. The component B comprises, by weight, 7-12 parts of a modified curing agent. The modified epoxy resin is obtained by
grafting modification of an amino-terminated polyether-
isocyanate prepolymer. The modified curing agent is prepared by
grafting modification of a
polyamide curing agent with HTPB. The modified epoxy resin and the modified curing agent are obtained by
grafting modification of an amino-terminated polyether-
isocyanate prepolymer, and the modified epoxy resin and the modified curing agent are synergistic. After the siliconization treatment of the compounded
silane coupling agent, the high-
temperature resistance, the
toughness and the
interfacial adhesion are significantly improved, and the high stability and the
adaptation to complex working conditions are achieved.