4results about How to "Realize automatic closing" patented technology

This invention discloses a high-strength, slag-resistant embedded slag-blocking wall, comprising a tundish and a slag-blocking wall body. The slag-blocking wall body is inclinedly disposed in the middle of the tundish. A bottom groove is provided at the bottom of the tundish body, and side grooves symmetrically arranged on the front and rear side walls of the tundish to connect with the bottom groove for accommodating the slag-blocking wall body are provided. The slag-blocking wall body includes a hollow bottom beam abutting against the inside of the bottom groove, and a laterally extending sedimentation bottom plate is fixed to the top of the hollow bottom beam. The beneficial effects are: this invention reduces the dead zone problem caused by poor steel flow at the contact point between the bottom side of the slag-blocking wall and the tundish, promotes the flow of molten steel along the guide holes of the inclined impact-resistant back plate, thereby promoting the floating of slag inclusions and improving the cleanliness of the molten steel; the slag-blocking wall body utilizes its own weight to achieve a seal at the contact point between its outer edge and the tundish, eliminating the need for additional mortar coating for sealing, improving the convenience of replacing the slag-blocking wall inside the tundish and the sealing efficiency, and increasing production efficiency.

This invention relates to the field of wafer loading technology, and more particularly to a loading platform with high-precision wafer warpage detection capabilities. The technical solution includes a wafer tray fixed above the loading platform, with vertical slots inside for placing wafers; a tray detection sensor is located below the loading platform to detect the tray's positioning status. A lifting and positioning mechanism is fixed to the platform mounting plate via a mounting base, and its electric lifting mechanism drives a connecting plate and lifting frame to move vertically; laser sensors are installed at both ends of the top of the lifting frame in a staggered V-shaped layout, located on the front and rear sides of the wafer tray respectively, forming a front-to-back scanning optical path. During scanning, the lifting frame moves the sensors upward, and the controller calculates the warpage of each wafer based on the upward and downward signals generated by the sensors combined with the lifting speed. This invention significantly improves wafer warpage detection accuracy through V-shaped through-beam scanning, effectively preventing the risk of wafer collisions in automated operations, and improving production efficiency and safety.

This invention discloses a low-resistance water circuit assembly with an integrated water pump, relating to the field of liquid chiller water circuit technology. It includes an integrated module and a pump head, inlet pipe, plate heat exchanger, PTC heater, and outlet pipe installed on the outside of the integrated module. By using an integrally cast integrated module and pump head, the water circuit piping is directly constructed within the integrated module through a one-piece molding process. This achieves water circuit connectivity between the water pump, plate heat exchanger, and PTC heater components, while solving the safety hazards associated with external piping in traditional technologies. Furthermore, it effectively reduces the production cost and weight of the water circuit assembly, facilitating its application.

The utility model relates to the technical field of high-voltage power distribution cabinets, in particular to closing equipment, which comprises a ball spline shaft assembly, a front-back driving mechanism, a rotary driving mechanism and a tool head, the driving end of the front-back driving mechanism is connected with one end of the ball spline shaft assembly and used for controlling the ball spline shaft assembly to reciprocate in the axis direction of the ball spline shaft assembly. The driving end of the rotation driving mechanism is connected with the other end opposite to one end of the ball spline shaft assembly and is used for controlling the ball spline shaft assembly to circumferentially rotate along the axis direction of the ball spline shaft assembly, so that when switching-on operation needs to be carried out, only the position of the pressing button or the rotation button needs to be in butt joint with a tool head of the equipment; after butt joint is completed, the personnel evacuate from the high-voltage power distribution cabinet to reach a safe distance, and then the front-back driving mechanism and the rotary driving mechanism can be controlled by equipment such as an industrial tablet computer to drive the ball spline shaft assembly to rotate, advance and retreat, so that automatic closing is realized.