1results about How to "Realize automatic closing" patented technology

This invention relates to the field of wafer loading technology, and more particularly to a loading platform with high-precision wafer warpage detection capabilities. The technical solution includes a wafer tray fixed above the loading platform, with vertical slots inside for placing wafers; a tray detection sensor is located below the loading platform to detect the tray's positioning status. A lifting and positioning mechanism is fixed to the platform mounting plate via a mounting base, and its electric lifting mechanism drives a connecting plate and lifting frame to move vertically; laser sensors are installed at both ends of the top of the lifting frame in a staggered V-shaped layout, located on the front and rear sides of the wafer tray respectively, forming a front-to-back scanning optical path. During scanning, the lifting frame moves the sensors upward, and the controller calculates the warpage of each wafer based on the upward and downward signals generated by the sensors combined with the lifting speed. This invention significantly improves wafer warpage detection accuracy through V-shaped through-beam scanning, effectively preventing the risk of wafer collisions in automated operations, and improving production efficiency and safety.