The invention discloses an
electroplating bottom plate
nickel plating device which comprises a
nickel plating table, a plurality of working pools and a conveying mechanism are arranged on the
nickel plating table, the conveying mechanism is used for driving a hanging frame to move to the designated working pools, a
closed space is formed in the nickel plating table, and all the working pools and the conveying mechanism are located in the
closed space to work; a door plate is arranged at the opening of each working
pool, and the door plates are configured to seal the working pools when the hanging rack is completely arranged in the working pools; a flow guide channel is formed in the position, close to an opening, in each working
pool,
waste gas treatment equipment is arranged in the nickel plating table and communicates with the flow guide channels, the whole nickel plating work is completed in a
closed space, and full-automatic closed production is achieved.
Waste gas in the working
pool and overflowing out of the working pool is guided and treated in all directions, so that zero-
pollution emission is realized, and the safety of a
working environment is improved.