Processing method of three-dimensional implantable microelectrode array

Abstract

The invention discloses a making method of three-dimensional plant-typed micro-electrode array, which is characterized by the following: adopting metal yarn as electrode material directly; inserting metal yarn into fine flute of mould base; locating to break metal yarn through micro-fine pipe on the mould base by chemical erosion; forming point at breaking part; casting polydimethylsiloxane on the mould base; utilizing polymerized PDMS to form chassis support part to chuck metal yarn; stripping PDMS with metal yarn out of mould base; bombarding through oxygen ion to overlap and bond together; assembling three-dimensional micro-electrode array.

Description

technical field [0001] The invention relates to a manufacturing method of a three-dimensional implanted microelectrode array, which can be applied to the fields of neurological disease treatment and rehabilitation, neurobiological basic research and the like. Background technique [0002] Neural engineering system is currently a very active and rapidly developing research field, such as brain-computer interface, neural prosthesis and other issues have received more and more attention. Microelectrodes have become an important tool for revealing the working mechanism of the nervous system, treating neurological diseases and neurorehabilitation. Whether it is a brain-computer interface or a neural prosthesis, electrodes are usually implanted in animals or patients, and electrical signals are loaded through the electrodes to stimulate or inhibit neural activity to achieve functional electrical stimulation (FES), or use micro Electrodes convert neural activity into electrical si...

AI Technical Summary

Problems solved by technology

At present, the most common three-dimensional needle-type microelectrode array is based on silicon material as the substrate, such as Normann et al. [P.K.Campbell, K.E.Jones, R.J.Huber, et al. "A Silicon-Based, Three-Dimensional Neural Interface : Manufacturing Processes for an Intracortical Electrode Array," IEEE Trans.Biomed.Eng.1991, 38(8): 758-68.] and Wise et al. [Q.Bai, K.D.Wise, D.J.Anderson. "A High -Yield Microassembly Structure forThree-Dimensional Microelectrode Arrays,” IEEE Trans.Biomed.Eng.2000, 47(3): 281-289.] three-dimensional needle-type microelectrode array, wherein the Utah-type electrode has been commercialized, usually in the form of The processing process of the three-dimensional needle microelectrode array based on silicon material is very complicated and expensive, which makes it difficult to widely promote and use this type of microelectrode, and it is difficult for the majority of neuroelectrophysiological scientists and medical workers to benefit from it, which greatly limits the brain-computer interface. and the pace of research in neuroprosthetics

Images