Processing method of three-dimensional implantable microelectrode array

A micro-electrode array, electrode array technology, applied in electrodes, internal electrodes, printed circuit manufacturing, etc., can solve the complex and expensive processing process, the difficulty of promoting and using electrodes, limiting the pace of brain-computer interface and neural prosthesis research, etc. problem, to achieve the effect of low cost, promotion of wide application, and short production cycle

Inactive Publication Date: 2007-08-01
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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Problems solved by technology

At present, the most common three-dimensional needle-type microelectrode array is based on silicon material as the substrate, such as Normann et al. [P.K.Campbell, K.E.Jones, R.J.Huber, et al. "A Silicon-Based, Three-Dimensional Neural Interface : Manufacturing Processes for an Intracortical Electrode Array," IEEE Trans.Biomed.Eng.1991, 38(8): 758-68.] and Wise et al. [Q.Bai, K.D.Wise, D.J.Anderson. "A High -Yield Microassembly Structure forThree-Dimensional Microelectrode Arrays,” IEEE Trans.Biomed.Eng.2000, 47(3): 281-289.] three-dimensio

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  • Processing method of three-dimensional implantable microelectrode array
  • Processing method of three-dimensional implantable microelectrode array
  • Processing method of three-dimensional implantable microelectrode array

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Embodiment 1

[0017] The manufacturing method of the three-dimensional implanted micro-electrode array of the present invention will be further described below by taking the process of manufacturing a three-dimensional micro-electrode array based on tungsten wire electrode material and glass mold substrate as an example in conjunction with the accompanying drawings.

[0018] 1. First, place the glass substrate in acetone and alcohol for 10 minutes respectively, and clean it with deionized water, and then place it in concentrated H 2 SO 4 Boil in medium for 15 minutes, rinse with deionized water, blow dry with nitrogen gas, and bake in an oven at 200°C for 30 minutes.

[0019] 2. Spin-coat AZ4620 photoresist on the surface of the prepared glass substrate (3000 rpm), and place it in an oven at 80°C for 30 minutes for soft drying, then expose and develop to obtain the desired etching mask layer. graphics, and finally place the developed glass substrate in an oven at 130°C for hard baking for ...

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Abstract

The invention discloses a making method of three-dimensional plant-typed micro-electrode array, which is characterized by the following: adopting metal yarn as electrode material directly; inserting metal yarn into fine flute of mould base; locating to break metal yarn through micro-fine pipe on the mould base by chemical erosion; forming point at breaking part; casting polydimethylsiloxane on the mould base; utilizing polymerized PDMS to form chassis support part to chuck metal yarn; stripping PDMS with metal yarn out of mould base; bombarding through oxygen ion to overlap and bond together; assembling three-dimensional micro-electrode array.

Description

technical field [0001] The invention relates to a manufacturing method of a three-dimensional implanted microelectrode array, which can be applied to the fields of neurological disease treatment and rehabilitation, neurobiological basic research and the like. Background technique [0002] Neural engineering system is currently a very active and rapidly developing research field, such as brain-computer interface, neural prosthesis and other issues have received more and more attention. Microelectrodes have become an important tool for revealing the working mechanism of the nervous system, treating neurological diseases and neurorehabilitation. Whether it is a brain-computer interface or a neural prosthesis, electrodes are usually implanted in animals or patients, and electrical signals are loaded through the electrodes to stimulate or inhibit neural activity to achieve functional electrical stimulation (FES), or use micro Electrodes convert neural activity into electrical si...

Claims

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Application Information

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IPC IPC(8): A61B5/04A61N1/05H01L21/00H05K3/00
Inventor 李刚程建功姚源周洪波孙晓娜赵建龙
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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