Method for constituting 3-D structure

A microstructure, three-dimensional technology, applied in the field of building multi-layer three-dimensional microstructure arrays in layers, can solve the problems of high equipment requirements, time-consuming, material limitations, etc., and achieve the effects of good repeatability, simple process and small size

Inactive Publication Date: 2007-08-29
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Although the above-mentioned first two types of methods can construct a three-dimensional microstructure with arbitrary high-resolution structures, they require high equipment, high construction costs, time-consuming, and limited materials.
The cost of the colloidal microsphere method is low, but the repeatability and reliability are not good, and the most serious thing is that it cannot construct a three-dimensional microstructure with a complex structure.

Method used

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  • Method for constituting 3-D structure
  • Method for constituting 3-D structure
  • Method for constituting 3-D structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] Quartz is selected as the base material, and it is treated with an oxygen plasma system for 5 minutes before use to make the surface clean and hydrophilic, which is convenient for the spin coating of photoresist to form a film. The conditions for spin-coating the photoresist are: 1500 rpm / S, spin for 15S, and quench the sample at 80° C. for 30 min after spin-coating. Then control the exposure current 3.5A under the mask exposure machine, expose for 40s, develop in the developer (BP-212 UV positive photoresist developer) for 3s after the exposure, put into distilled water to clean the residual developer, and use Blow dry with nitrogen to obtain a photoresist template with a microstructure period of 13 μm, grooves of 8 μm, and stripes of 5 μm.

[0064] This template is imprinted on the smooth glass substrate coated with PDMS prepolymer, and the pressure of 15 bar is maintained for 10 minutes, so that the PDMS prepolymer is squeezed into the groove between the photoresists...

Embodiment 2

[0066] Quartz is selected as the base material, and it is treated with an oxygen plasma system for 5 minutes before use to make the surface clean and hydrophilic, which is convenient for the spin coating of photoresist to form a film. The conditions for spin-coating the photoresist are as follows: the first layer: 1500 rotations / S, spin for 15S, and the sample is quenched at 80° C. for 30 minutes after spin-coating. Then control the exposure current 3.5A under the mask exposure machine, expose for 40s, develop in the developer solution for 3s after exposure, put the remaining developer solution in distilled water, and dry it with nitrogen gas to obtain the photoresist template. Period 13 μm, groove 8 μm, stripe 5 μm.

[0067] This template is imprinted on the smooth glass substrate that is coated with UV-exposure adhesive precursor (P / N6031 NORLAND OPTICALADHENSIVE, Norland products, Inc. Cranbury, NJ, P / N6031 type photoresist, North Country Products Company, New Jersey, USA),...

Embodiment 3

[0069]Single crystal silicon and ITO glass were selected as substrate materials respectively, and were treated with an oxygen plasma system for 5 minutes before use to make the surface clean and hydrophilic, which is convenient for the spin coating of photoresist to form a film. The conditions for spin-coating photoresist are: 1500 rpm / S, spin for 15S, and quench the sample at 80° C. for 30 min after spinning. Then control the exposure current 3.5A under the mask exposure machine, expose for 40s, develop in the developer solution for 3s after exposure, put the remaining developer solution in distilled water, and dry it with nitrogen gas to obtain the photoresist template. Period 13 μm, groove 8 μm, stripe 5 μm.

[0070] Imprint this template on the smooth glass substrate coated with the UV exposure glue precursor, keep the pressure of 10bar for 8min, squeeze the UV exposure glue precursor into the groove between the photoresists, and then peel off the smooth glass substrate, ...

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Abstract

The invention relates to a method to construct 3D microstructure. It includes the following steps: using photoengraving method to construct 2D microstructure surface, extruding polymer performed polymer or ultraviolet glue precursor into the slot on 2D microstructure surface and taking heat or light polymerization to gain target material; constructing polymer or ultraviolet exposal glue array structure, washing sacrificed material at one time to gain the 3D microstructure. The invention has potential application value in the fields of shape, size, thickness, material, photon crystal, catalyst carrier, etc.

Description

technical field [0001] The invention relates to a method for constructing a three-dimensional microstructure, and in particular provides a method for constructing a multilayer three-dimensional microstructure array step by layer by using sacrificial structural materials as limiting templates. The shape, size, thickness, and material of the microstructure arrays between different layers may be the same or different. Background technique [0002] Three-dimensional microstructures (characteristic sizes ranging from hundreds of microns to hundreds of nanometers) have important scientific significance and application value in the fields of microelectronics, materials science, supramolecular science, and cell biology. Specifically, three-dimensional microstructures can be It is applied to specific aspects such as photonic devices, sensors, microfluidic devices, micro electromechanical systems, photonic crystals, three-dimensional connected waveguides, superprisms, microreactors an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00G03F7/00
Inventor 吕男胡伟吴英迟力峰
Owner JILIN UNIV
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