Method for manufacturing nickel-cuprum metallic baseband layer of highly oriented double-shaft texture
A technology of copper metal and base belt layer, applied in the field of preparation of metal base belt layer, can solve the problems of unfavorable large-scale production, complicated rolling process, high heat treatment temperature, and achieves good reproducibility and repeatability, low cost, and preparation process. simple effect
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specific Embodiment approach
[0024] A kind of specific embodiment of the present invention is:
[0025] First put the copper sheet into acetone or absolute ethanol for 45 minutes of ultrasonic cleaning.
[0026] a. Annealing: put the copper sheet cleaned in step a into a tube furnace, and feed a hydrogen-argon mixed gas composed of 5% hydrogen and 95% argon by volume, and increase the temperature at a rate of 190°C / h to 600°C, keep warm for 2 hours, then cool naturally.
[0027] After annealing, the polished copper sheet is cleaned in 5% dilute hydrochloric acid to remove oxide impurities on the surface.
[0028] b. Polishing: Mix 20g / L of chromium trioxide, 950ml / L of 85% phosphoric acid, and 50ml / L of 97% sulfuric acid to prepare a polishing solution; then use the annealed copper sheet as the anode and the aluminum sheet in the polishing solution As the cathode, electrochemical polishing was carried out with a current of 300mA for 4 minutes.
[0029] c. Electroplating: According to the ratio of nicke...
Embodiment 2
[0031] This example is basically the same as Example 1, the difference is only:
[0032] Ultrasonic cleaning time is 30 minutes; during annealing, the temperature is raised to 590°C at a rate of 100°C / h and kept for 1.5 hours; the copper sheet is cleaned in 3% dilute hydrochloric acid; chromium trioxide 18g / L, 85% phosphoric acid 940ml / L, 95% sulfuric acid 40ml / L ratio with polishing liquid, polishing current 200mA; polishing time 2 minutes; according to nickel sulfate is 95g / L, nickel chloride is 8g / L, boric acid is 25g / L, dissolved in deionized water A solution is formed, an electroplating solution is prepared, the electroplating time is 5 minutes, and the current is 10mA, and a nickel plating layer with a thickness of about 1 μm can be formed on the surface of the base copper sheet.
Embodiment 3
[0034] This example is basically the same as Example 1, the difference is only:
[0035] Ultrasonic cleaning time is 60 minutes; during annealing, the temperature is raised to 610°C at a rate of 200°C / h and kept for 2.5 hours; the copper sheet is cleaned in 8% dilute hydrochloric acid; L, the proportion of 98% sulfuric acid 60ml / L with polishing fluid, polishing current 400mA; polishing time 5 minutes; according to nickel sulfate is 110g / L, nickel chloride is 15g / L, boric acid is 30g / L, dissolved in deionized water The electroplating solution is prepared, the electroplating time is 15 minutes, and the current is 50mA, and a nickel plating layer with a thickness of about 10.3 μm can be formed on the surface of the base copper sheet.
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