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Ruthenium-vanadium binary alloy high-temperature brazing material

A binary alloy and brazing filler metal technology, applied in the field of alloy brazing filler metals, can solve the problems of high price and limit a large number of applications, and achieve the effects of low corrosion, good fluidity, and improved bonding strength

Active Publication Date: 2010-12-08
NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the expensive raw materials of Pt and Pt-based alloys, the production cost is more than three times that of ruthenium-based alloys, which limits its large-scale application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The brazing material alloy of this embodiment is formulated according to 23wt% V, and the balance is ruthenium and unavoidable trace impurities. The content of Zn, Pb, Bi and Mg elements in the trace impurities shall not exceed 0.001%. Adopt electric arc furnace to smelt into ingots, ingots are processed by mechanical cutting or mechanical crushing, then through high-energy ball mill grinding, finally sieving, reduction, pickling to obtain the ruthenium vanadium binary alloy powder solder of the present invention, and then in H 2 Welding process test of brazing filler metal in gas furnace, its wetting and spreadability on the base metal is good, no corrosion to the base metal, the spreading area of ​​the solder after melting is more than 4 times of the original solder placement area, the wetting angle less than 10°.

Embodiment 2

[0016] The brazing material alloy of this embodiment is formulated according to 26wt% V, and the balance is ruthenium and unavoidable trace impurities. The content of Zn, Pb, Bi and Mg elements in the trace impurities shall not exceed 0.001%. The ingot is smelted into an ingot by an electric arc furnace, and the ingot is machined or crushed by a machine, then ground by a high-energy ball mill, finally screened, reduced, and pickled to obtain the ruthenium-vanadium binary alloy powder solder of the present invention. Then in H 2 The welding process test of brazing material was carried out in the gas furnace. The wetting and spreading of ruthenium vanadium solder on the base metal is good, and there is no corrosion to the substrate. The spreading area of ​​the solder after melting is more than 4 times that of the original solder placement area. The wet angle is less than 10°.

Embodiment 3

[0018] The brazing material alloy of this embodiment is formulated according to 40wt% V, and the balance is ruthenium and unavoidable trace impurities. The content of Zn, Pb, Bi and Mg elements in the trace impurities shall not exceed 0.001%. The ingot is smelted into an ingot by an electric arc furnace, and the ingot is machined or crushed by a machine, then ground by a high-energy ball mill, finally screened, reduced, and pickled to obtain the ruthenium-vanadium binary alloy powder solder of the present invention. Then in H 2 The welding process test of brazing material was carried out in the gas furnace. The wetting and spreading of ruthenium vanadium solder on the base metal is good, and there is no corrosion to the substrate. The spreading area of ​​the solder after melting is more than 4 times that of the original solder placement area. The wet angle is less than 10°.

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Abstract

The invention discloses a high-reliability cathode component for a vacuum electron device, wherein the ruthenium-vanadium binary alloy high-temperature cored solder taking refractory metal tungsten and molybdenum as base materials consists of the following materials in weight percentage: 23 to 40 percent of vanadium, and the balance being ruthenium and inevitable micro impurities; and the contents of Zn, Pb, Bi and Mg elements in the micro impurities are no more than 0.001 percent respectively. The cored solder can be used to braze-solder refractory metal w, Mo and alloy of w or Mo in the H2 or Ar gas atmosphere or in a vacuum state, the cored solder does not absorb hydrogen, can spread over base metal, and has good wettability; the wet angle is less than 10 degrees; and when a soldering piece is soldered under the vacuum working condition with a temperature of between 1,000 and 1,200 DEG C, the vapor pressure of the cored solder is lower than 1x10<-5>Pa; moreover, the cored solder islow in price, and is the first choice of solder replacing the Pt and Pt-based solder for the braze solder of the cathode component for the vacuum electron device, and the melting temperature of the cored solder is between 1,750 and 1,850 DEG C.

Description

technical field [0001] The invention relates to an alloy brazing material, in particular to a high-temperature ruthenium-vanadium binary alloy high-temperature brazing material which is used for high-reliability cathode components in vacuum electronic devices and uses refractory metal tungsten and molybdenum as base materials. Background technique [0002] At present, there are dozens of brazing materials that can braze W and Mo, including Cu-based, Ni-based, Mo-based, Pd-based, Pt-based solders, but the melting temperature is between 1750°C and 1850°C, and the vapor pressure is low. , does not react with hydrogen, and there are very few alloy solders that can braze W and Mo in hydrogen. Currently, only Pt and Pt-based alloys can meet such requirements. However, due to the expensive raw materials of Pt and Pt-based alloys, the production cost is more than three times that of ruthenium-based alloys, which limits its large-scale application. Contents of the invention [00...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/32B23K35/14
Inventor 李银娥马光姜婷郑晶刘啸锋
Owner NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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