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Strippable ultrathin transfer carrier metal foil and method of manufacturing the same

A technology for transferring carrier and ultra-thin metal, applied in the field of metal foil, can solve the problems of difficult large-scale production and use of ultra-thin copper foil, unsatisfactory, difficult to produce copper foil, etc., and achieves low production cost, high production efficiency, simple craftsmanship

Inactive Publication Date: 2009-07-22
广州力加电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The rotation speed of the cathode drum determines the thickness of the copper foil, but the electrolytic process is difficult to produce copper foil with a thickness of less than 9 microns
[0005] For ultra-thin copper foil with a thickness of 0.1-9 microns, because it is too thin, manual and machine operations cannot be carried out smoothly with the above conventional methods, so it is difficult to produce and use ultra-thin copper foil on a large scale at present, and cannot meet the current technical production needs

Method used

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  • Strippable ultrathin transfer carrier metal foil and method of manufacturing the same
  • Strippable ultrathin transfer carrier metal foil and method of manufacturing the same
  • Strippable ultrathin transfer carrier metal foil and method of manufacturing the same

Examples

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Effect test

Embodiment 1

[0041] The base layer is made of PET, and the surface of the PET is treated so that the surface tension after treatment is 40-90 dynes. The surface treatment can be corona, chemical treatment and / or ion source treatment. Among them, the process conditions of the ion source treatment can be: in the vacuum degree of 3.0 × 10 -1 ~1.0×10 -3 In the vacuum state of pa, the argon flow rate is 10-1000SCCM, the electron energy range is 100-1500ev, and the processing time is 1-30 minutes. Vacuum roll-to-roll sputtering metal nickel layer on PET surface, the process conditions are: vacuum degree (or absolute pressure value) 0.1 ~ 1Pa, voltage: -300V ~ -600V (DC), current: 50 ~ 200A, argon flow: 100~500sccm, baseband speed: 0.1~1.5m / min, surface conductivity of nickel metal layer is 1 ohm~20 kohm, adhesion is 0.4-0.9 kg. Brightening treatment is carried out on the surface of the metal nickel layer to form a bright metal layer on the surface, making the surface as bright as a mirror, an...

Embodiment 2

[0043]The surface treatment process of PEI, PEN or aluminum foil is the same as that of PET. The preparation of the bright base carrier tape was the same as in Example 1. The difference is the process of electrodepositing ultra-thin copper foil. The process of electrodepositing ultra-thin copper foil is as follows: copper pyrophosphate 50-80g / l, methyl pyrophosphate 250-350g / l, ammonium citrate 20-30g / l electrolyte, pH=8.0-8.5. The working temperature is 30~50℃, and the current density is 0.5~1.0A / dm applied to the bright substrate carrier tape 2 DC current, tape running speed 0.5-15m / h, after at least one level of water washing, after washing, dry with hot air at 50-80°C to form peelable ultra-thin copper foil 4 on the bright substrate carrier tape.

[0044] The invention realizes the large-scale production and use of the 0.1-9 micron ultra-thin copper foil, and has broad market prospects.

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Abstract

The invention relates to a strippable ultra-thin transfer vector metal foil, which comprises an ultra-thin metal foil with a thickness of between 0.1 and 9 microns and a strippable transfer adhesive film, wherein the transfer adhesive film is provided with a low-viscosity adhesive layer; the ultra-thin metal foil can be attached to the strippable transfer adhesive film through the low-viscosity adhesive layer; and the other surface of the ultra-thin metal foil is covered with a protective film. A method for manufacturing the strippable ultra-thin transfer vector metal foil comprises the following steps: (1) forming a bright matrix carrier band; (2) electrodepositing a metal on the bright matrix carrier band so as to form a strippable metal foil; and (3) jointing the transfer adhesive film on the metal foil, and taking off the metal foil and transferring the metal foil to the transfer adhesive film. The strippable ultra-thin transfer vector metal foil achieves the large scale production and use of the ultra-thin metal foil with a thickness of less than 0.1 to 9 microns. Simultaneously, the strippable ultra-thin transfer vector metal foil has the advantages of simple process, high production efficiency, recyclable bright matrix carrier band, low production cost, and broad market prospect.

Description

technical field [0001] The invention relates to the technical field of metal foil used in circuit manufacturing, in particular to a peelable ultra-thin transfer carrier metal foil and a manufacturing method thereof. Background technique [0002] Copper foil, as the basic raw material of copper clad substrate and printed circuit board, is developing rapidly with the worldwide electronics industry. With the development of microelectronics technology, the manufacturing precision of circuits is getting higher and higher. The traditional copper foil manufacturing process can no longer meet the development requirements of current electronic technology. At present, there are two conventional methods for making copper foil as follows: [0003] 1. Calendering annealing method. The copper strands are first heated and then fed through a series of rollers that reduce them to a specified thickness of copper foil. The rotation created grain structures in the copper foil that looked li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/04B32B7/12B32B15/20C23C14/02C23C14/58
Inventor 夏登峰苏陟郑永德杨伟民
Owner 广州力加电子有限公司
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