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Epoxy/organosilicon hybrid material, and preparation method and application thereof

A hybrid material and silicone technology, applied in the direction of epoxy resin coating, application, epoxy resin glue, etc., can solve the problems of difficult reaction, difficult solvent purification, complicated process, etc., and achieve good transparency and processability Good, good adhesion effect

Inactive Publication Date: 2009-09-09
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of the chemical modification method is that the process is complicated, and solvents are usually used to make purification difficult, and it is difficult to control the degree of reaction

Method used

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  • Epoxy/organosilicon hybrid material, and preparation method and application thereof
  • Epoxy/organosilicon hybrid material, and preparation method and application thereof
  • Epoxy/organosilicon hybrid material, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Epoxy / Silicone Hybrid Material Formulation 1

[0051] Composition Dosage (parts)

[0052] Hydrogenated bisphenol A epoxy resin 100

[0053] Hydroxypolyphenylsilsesquioxane 70

[0054] Epoxysilane 20

[0055] Methylhexahydrophthalic anhydride 2

[0056] UV absorber 3

[0057] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin (EPONEX 1510), 70 parts of hydroxyl polyphenylsilsesquioxane with an average molecular weight of 5000, stir for 5 hours, add 20 parts of epoxy silane (GF- 82), continue to stir for 0.5 hours to obtain component A, set aside.

[0058] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin (EPONEX 1510), 2 parts of methyl hexahydrophthalic anhydride, stir for 2 hours, add component A, continue stirring for 1 hour, then add 3 parts of UV absorber ( 2-hydroxy-4-n-octyloxybenzophenone), stirred for 1 hour to obtain epoxy / organosilicon hybrid material.

[0059] The epoxy / organosilicon hybrid material was heated at 15...

Embodiment 2

[0061] Epoxy / Silicone Hybrid Material Formulation 2

[0062] Composition Dosage (parts)

[0063] Hydrogenated bisphenol A epoxy resin 100

[0064] Hydroxypolyphenylsilsesquioxane 2

[0065] Hydroxy silicone oil 5

[0066] Epoxysilane 2

[0067] Tin octoate 0.6

[0068] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin (GEST3000), 2 parts of hydroxyl polyphenylsilsesquioxane with an average molecular weight of 3500, and 5 parts of hydroxyl silicone oil with an average molecular weight of 10000, stir for 1 hour, and add 2 Part epoxy silane (GLYMO), continue to stir for 1 hour to get A component, stand-by.

[0069] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin (GEST3000), 0.6 parts of tin octoate, stir for 5 hours, add component A, and continue stirring for 5 hours to obtain an epoxy / organosilicon hybrid material.

[0070] The epoxy / organosilicon hybrid material was heated at 180° C. for 0.5 hour, and cured in situ to obtain the epo...

Embodiment 3

[0072] Epoxy / Silicone Hybrid Material Formulation 3

[0073] Composition Dosage (parts)

[0074] Cycloaliphatic epoxy resin 100

[0075] Hydroxy silicone oil 100

[0076] Zirconium acetylacetonate 0.01

[0077] In the reactor, add 70 parts of cycloaliphatic epoxy resin (ERL-4221), 100 parts of hydroxyl silicone oil with an average molecular weight of 2000, and stir for 15 hours to obtain component A, which is ready for use.

[0078] In the reactor, add 30 parts of cycloaliphatic epoxy resin (ERL-4221), 0.01 part of zirconium acetylacetonate, and stir for 10 hours to obtain component B.

[0079] Mix the above components A and B evenly, heat at 50°C for 5 hours, and cure in situ to obtain the epoxy / organosilicon hybrid material.

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Abstract

The invention belongs to the technical field of chemical engineering, more specifically relates to an epoxy / organosilicon hybrid material and the preparation method thereof. The epoxy / organosilicon hybrid material is made from epoxy resin, organosilicon resin, an acidic curing agent, unnecessary organic epoxy silane, an unnecessary adjuvant and the like. The components are hybridized and cured in situ under catalytic action of the acidic curing agent by simple physical mixing to obtain the epoxy / organosilicon hybrid material. The production and preparation processes are environment-friendly, energy-saving, simple and easy for control, and no solvent is used in the processes. The epoxy / organosilicon hybrid material prepared by the method has the characteristics of good bonding property, high mechanical strength, high shear strength and excellent machinability of the epoxy resin, and has the characteristics of strong heat resistance, good insulativity, strong elasticity, strong ageing resistance and good transparence of the organosilicon resin. The epoxy / organosilicon hybrid material can be taken as an adhesive, an insulating material, printing ink, a coating material, a solder mask material of a printed circuit, an optical protection material, an LED encapsulation material, an optoelectronic conversion material and the like.

Description

technical field [0001] The invention belongs to the technical field of chemical industry, and in particular relates to an epoxy / organosilicon hybrid material and its preparation method and application. Background technique [0002] Silicone resin has the advantages of good thermal stability, oxidation resistance, weather resistance, low temperature performance, low surface energy, low dielectric constant, low stress, shock absorption and low noise, environmental protection and low toxicity, flame retardant or non-combustible, etc., and is widely used in Adhesives, coating materials, optical, electronic protection materials, etc. However, silicone resin has poor adhesion to the substrate, poor resistance to organic solvents, low hardness, and the surface is prone to adhesion of dust at high temperature, which is expensive. Epoxy resin has the advantages of excellent mechanical properties, electrical properties, adhesive properties, heat resistance, solvent resistance, easy m...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08L83/04C08K13/02C08K5/09C08K5/098C08K5/07C09D163/00C09J163/00C09D11/10C08J3/24C09D183/04C09J183/04H01L33/00H01L21/56C09D11/102
Inventor 游波唐勇
Owner FUDAN UNIV
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