Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for preparing high-inoxidability sphere-like copper powder

An oxidizing, spherical-like technology, applied in the field of copper powder preparation, can solve the problems of poor reproducibility, huge equipment investment, and high manufacturing cost.

Inactive Publication Date: 2009-12-02
GUANGDONG FENGHUA ADVANCED TECH HLDG
View PDF1 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the most widely used in the electronics industry is the spherical copper powder produced by the atomization method. The disadvantages of this method are: huge investment in equipment, high manufacturing cost, high requirements for equipment, high energy consumption, and a wide range of particle size distribution. , highly dependent on operator experience, poor reproducibility between batches, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for preparing high-inoxidability sphere-like copper powder
  • Method for preparing high-inoxidability sphere-like copper powder
  • Method for preparing high-inoxidability sphere-like copper powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Weigh 100g copper sulfate pentahydrate, add 500ml deionized water, stir and dissolve for later use, called A solution;

[0021] Weigh 25g of sodium hydroxide, add 200ml of deionized water, stir and dissolve for later use, called B solution;

[0022] Weigh 40g of Vc, add 300ml of deionized water, stir and dissolve for later use, called C solution;

[0023] Weigh 5g of PVA, add 100ml of deionized water, stir and dissolve for later use, called D solution

[0024] Weigh 0.25g of polymerized liquid resin, add 25ml of deionized water, stir at high speed and emulsify until it is in the form of an emulsion, which is called E solution.

[0025] Heat the four solutions of A, B, C, and D to 50°C respectively, and add the D, C, and B solutions to the A solution in turn under the condition of stirring (the adding time of each solution is ≤5 minutes). Stir one solution for 10 minutes, then add the latter solution until the addition is complete; stir and keep warm for 2 hours, raise...

Embodiment 2

[0027] As in Example 1, the copper sulfate pentahydrate was changed to copper nitrate trihydrate, and the consumption was 97g, and the others were unchanged. The properties of the obtained copper powder are shown in Table 1. Electron microscope analysis SEM (2500 times) of quasi-spherical copper powder such as figure 1 Shown; the laser particle size distribution VPSD diagram of spherical copper powder is shown in figure 2 Shown; The X-ray diffraction analysis XRD of quasi-spherical copper powder is as image 3 Shown; thermal analysis STA diagram of spherical copper powder Figure 4 shown. These four test and analysis methods are commonly used particle analysis methods by those skilled in the art.

Embodiment 3

[0029] As in Example 1, copper sulfate pentahydrate was changed to copper chloride dihydrate, and the consumption was 68.5 g, and the others were unchanged. The properties of the obtained copper powder are shown in Table 1. Electron microscope analysis SEM (2500 times) of quasi-spherical copper powder such as figure 1 Shown; the laser particle size distribution VPSD diagram of spherical copper powder is shown in figure 2 Shown; The X-ray diffraction analysis XRD of quasi-spherical copper powder is as image 3 Shown; thermal analysis STA diagram of spherical copper powder Figure 4 shown. These four test and analysis methods are commonly used particle analysis methods by those skilled in the art.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for preparing high-inoxidability sphere-like copper powder, which comprises the steps of reduction reaction, washing, surface chemical treatment and drying treatment, wherein the reduction reaction is to dissolve a reducing agent and a copperish initiator material into solvent and perform the reduction reaction under the action of an auxiliary agent, the reaction temperature is between 40 and 100 DEG C, and the reduction reaction time is between 2 and 5 hours. The reducing agent is vitamin C (C6H806, Vc,). The copperish initiator material is a substance which can be ionized into Cu2+ in aqueous solution and comprises one or several of hydrated copper sulfate, hydrated copper nitrate and hydrated copper chloride; the solvent is deionized water; and the auxiliary agent comprises an inorganic salt or an alkaline substance for adjusting the pH value and a water soluble polymer material for a surfactant. The obtained copper powder has the advantages of good dispersity, no agglomeration, small specific area, high tap density, controllable granule size, narrow grain size distribution range, and strong antioxygenic property.

Description

technical field [0001] The invention relates to a preparation method of copper powder, in particular to a liquid-phase chemical precipitation preparation method of spherical copper powder with high oxidation resistance. Background technique [0002] In the electrical and electronic industry, for conductive metal materials, the main choice is spherical or nearly spherical powder with good dispersibility, high oxidation resistance, and moderate particle size, which can make the slurry have good rheological properties and effectively control electrodes. The thickness of the layer is thin, which improves the flatness of the electrode surface. After drying, the electrode has excellent compactness, small sintering shrinkage, and good electrical conductivity. Copper powder is the most widely used base metal conductive material. At present, the most widely used in the electronics industry is the spherical copper powder produced by the atomization method. The disadvantages of this m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24
Inventor 陆进辉孟淑媛唐元勋吴海斌余龙华
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com