Compound cantilever beam needle point used for micro-nano microtechnique and manufacturing method thereof
A technology of composite cantilever beam and microscopic technology, which is applied in the field of composite cantilever beam tip and its production for micro-nano microscopic technology, and can solve problems such as complex structure, small field of view, and difficulty in realization
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[0029] 1. Use a silicon wafer with a diameter of 2 inches, an N-type (001) surface, and a thickness of 1 mm as the substrate. The front surface uses a mask and anisotropic wet etching to produce a needle tip with a height of 7 μm, a base with a length of 3 mm, and a width of 1 mm. 500 μm, 40 μm wide cantilever.
[0030] 2. Fabricate a silicon dioxide insulating dielectric layer on the front and back of the silicon wafer with a thickness of 200nm.
[0031] 3. The first photolithography on the silicon dioxide insulating dielectric layer using nickel-chromium alloy (Ni 80 Cr 20 ) to produce 4 piezoresistors, all of which have a resistance value of 120Ω, 2 are located on the base, and 2 are located on the cantilever beam and parallel to the length direction of the cantilever beam.
[0032] 4. On the prepared piezoresistor, use gold for the second photolithography to make a wire with a thickness of 100nm and a width of 5μm and 4 electrodes I and electrode II with a thickness of 1...
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