Polyamide-imide copper-clad plate and preparation method thereof
A technology of polyamide-imide and polyamide-imide layer, which is applied in the field of material science, can solve the problem that the mechanical properties of polyimide copper-clad foil are difficult to meet the processing and application process, and the stretching orientation of the film forming process cannot be implemented. It is difficult to meet the requirements of high performance and other issues, and achieve the effects of excellent dimensional stability, low thermal expansion coefficient, and improved polarity
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Embodiment 1
[0067] In a 100mL three-necked flask equipped with electromagnetic stirring, a thermometer and an inert gas protection device, add 2.28g (10.0mmol) 4,4'-diaminobenzanilide, add 27mL N,N-dimethylformamide, Dissolve the diamine. Then drop into 3.2039g (9.95mmol) 3 in batches, 3 ', 4, the 4-benzophenone tetraacid dianhydride, add time interval more than 10 minutes each time, guarantee its sufficient reaction. After the addition, start timing, stir and react at room temperature for 4.5 hours, stop stirring, and obtain the corresponding polyamic acid solution.
[0068] Coat the amic acid solution evenly on a clean copper foil, then place it in a high-temperature vacuum oven, and carry out the thermal imidization reaction with a gradient temperature rise. , heating up 0.45h) → 200°C (holding temperature for 0.15h, heating up 0.45h) → 350°C (holding temperature for 0.15h). After the reaction is finished, a polyamide-imide copper-clad single-layer board with a chemical structure of ...
Embodiment 2
[0070] In a 100mL three-necked flask equipped with electromagnetic stirring, a thermometer and an inert gas protection device, add 2.28g (10.0mmol) 4,4'-diaminobenzanilide, add 27mL N,N-dimethylformamide, Dissolve the diamine. Then drop into 2.9275g (9.95mmol) 3 in batches, 3 ', 4, the 4-biphenyltetraacid dianhydride, add time interval more than 10 minutes each time, guarantee its sufficient reaction. After the addition, start timing, stir and react at room temperature for 8 hours, stop stirring, and obtain the corresponding polyamic acid solution.
[0071] Coat the amic acid solution evenly on a clean copper foil, place it in an oven at 70°C for 10 minutes to remove some solvent, then place it in a high-temperature vacuum oven, raise the temperature to 350°C within 2 hours, and then keep it warm After 20 minutes, the thermal imidization reaction was carried out, and the corresponding polyamide-imide copper-clad laminate was obtained after the reaction. The polymer has good ...
Embodiment 3
[0073] Use 50% 4,4`-diaminodiphenyl ether and 50% 4,4`-diaminobenzoanilide mixed diamine instead of 4,4`-diaminobenzoanilide, other implementation methods are the same example 1. The initial decomposition temperature of the obtained polymer in a nitrogen atmosphere is 558°C; the glass transition temperature measured by DMA is 366.2°C; the tensile strength of the film is 140MPa, and the tensile modulus is 4.2GPa.
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