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Halogen-phosphorus-free flame retardant epoxy resin composition and application thereof in bonding sheet and copper-clad plate

A technology of epoxy resin and group phenyl epoxy resin, which is applied in the field of halogen-free and phosphorus-free flame-retardant epoxy resin composition, can solve the problems of aquatic environment hazards, etc., and achieve high cross-linking density, good flame retardancy, excellent The effect of symmetry

Inactive Publication Date: 2011-06-15
力森诺科电子材料(广州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, there are two main approaches to flame retardancy in this industry: one is still to add a large amount of inorganic fillers; the other is to use phosphorus-containing epoxy resin or curing agent system, and at the same time assist a certain amount of inorganic or organic fillers. However, recently people It has been found that phosphorus-based flame retardant systems also produce toxic gases (such as methylphosphine) or harmful (carcinogenic) substances (such as triphenylphosphine) when they are burned at high temperatures, and their wastes also have potential hazards to the aquatic environment. harm

Method used

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  • Halogen-phosphorus-free flame retardant epoxy resin composition and application thereof in bonding sheet and copper-clad plate
  • Halogen-phosphorus-free flame retardant epoxy resin composition and application thereof in bonding sheet and copper-clad plate
  • Halogen-phosphorus-free flame retardant epoxy resin composition and application thereof in bonding sheet and copper-clad plate

Examples

Experimental program
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Effect test

Embodiment 1

[0036] Benzoxazine epoxy resin A100 parts by weight (this weight is pure resin weight, the same below); 30 parts by weight of modified phenolic resin curing agent; 0.06 parts by weight of 2-methylimidazole; 5 parts by weight of tetrafunctional phenyl epoxy resin share. Dissolve the above resin with a mixed solvent of propylene glycol monomethyl ether and cyclohexanone, add 50 parts by weight of silicon dioxide and 15 parts by weight of aluminum hydroxide after it is completely dissolved, stir at a high speed, and disperse strongly until the equilibrium is reached. The mixed solvent adjusts the solid content of the glue solution to be about 65%.

Embodiment 2

[0038] 100 parts by weight of benzoxazine epoxy resin A; 30 parts by weight of nitrogen-containing phenolic resin curing agent; 0.06 parts by weight of 2-methylimidazole; 5 parts by weight of tetrafunctional phenyl epoxy resin. Dissolve the above resin with a mixed solvent of propylene glycol monomethyl ether and cyclohexanone, add 40 parts by weight of silicon dioxide, 15 parts by weight of nano-sized montmorillonite and 15 parts by weight of aluminum hydroxide after it is completely dissolved, stir at high speed and forcefully disperse to reach equilibrium At the same time, adjust the solid content of the glue solution to about 65% with the same mixed solvent that dissolves the resin system.

Embodiment 3

[0040] 100 parts by weight of benzoxazine epoxy resin A; 40 parts by weight of nitrogen-containing phenolic resin curing agent; 0.08 parts by weight of 2-ethyl 4-methylimidazole; 10 parts by weight of tetrafunctional phenyl epoxy resin. Dissolve the above resin with a mixed solvent of propylene glycol methyl ether acetate and cyclohexanone, add 30 parts by weight of silicon micropowder, 25 parts by weight of nano-level montmorillonite and the main components are zinc, molybdenum, magnesium silicate talcum powder after being completely dissolved. 15 parts by weight, high-speed stirring and strong dispersion until the equilibrium is reached, and at the same time, the same mixed solvent that dissolves the resin system is used to adjust the solid content of the glue to about 65%.

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Abstract

The invention relates to a halogen-phosphorus-free flame retardant epoxy resin composition, which comprises inorganic fillers such as benzoxazine epoxy resin, a modified phenolic resin curing agent, imvite and the like, an inorganic auxiliary flame retardant material and the like, wherein the modified phenolic resin curing agent is nitrogen-containing phenolic resin; a resin condensate system has higher flame retardancy due to the self-extinguishment of the nitrogen-containing phenolic resin during combustion; and the glass-transition temperature of a condensate can be improved further by a unique structure formed by nano-level imvite and condensate molecules, and particularly the condensate has a lower thermal expansion coefficient. The resin composition does not contain halogen and phosphorus elements, and does not generate harmful substances, so a bonding sheet and a copper-clad foil layer, which are produced by the composition, for a printed circuit board have higher heat resistance and flame retardance, and are environmentally-friendly.

Description

technical field [0001] The invention relates to a halogen-free and phosphorus-free flame-retardant epoxy resin composition and the application of the composition in manufacturing printed circuit board (PCB) bonding sheets and copper-clad boards. Background technique [0002] In recent years, the world's electronic information industry represented by electronic computers and mobile phones has developed rapidly, and electronic products have become one of the largest industries in the world in recent years. However, with the development of electronic products towards miniaturization, multi-functionality, high performance and high reliability, the requirements for copper clad laminates of printed circuit boards used to assemble electronic products are also increasing: higher mechanical properties, durability High temperature, excellent power-saving performance, and environmental protection and greening, etc.; correspondingly, the requirements for the matrix-resin used in the man...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/04C08G59/62C08G59/32C08G59/02C08K13/06C08K9/00C08K3/34C08K3/22C08K3/36B32B15/092H05K1/03
Inventor 张奎关大任曾广朋张国乾章星
Owner 力森诺科电子材料(广州)有限公司
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