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Double-component epoxy adhesive for bonding ceramics, preparation method and using method thereof

An epoxy adhesive, a two-component technology, applied in the direction of adhesives, epoxy resin adhesives, carboxyl rubber adhesives, etc., can solve the problems of large difference in linear expansion coefficient and large interface stress, etc., to achieve a good bonding interface and reduce Effect of internal stress, apparent mechanical fit

Inactive Publication Date: 2011-10-19
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention solves the technical problem of excessive interface stress caused by the large difference in linear expansion coefficient of the existing epoxy adhesive when bonding ceramics; and provides a two-component epoxy adhesive for bonding ceramics and its preparation method and use method

Method used

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  • Double-component epoxy adhesive for bonding ceramics, preparation method and using method thereof

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specific Embodiment approach 1

[0012] Embodiment 1: The two-component epoxy adhesive for bonding ceramics in this embodiment is composed of component A and component B, wherein component A is composed of 60 to 100 parts of E-44 epoxy resin, 60-100 parts of E-51 epoxy resin, 15-35 parts of liquid carboxyl-terminated nitrile rubber (toughening agent), 40-60 parts of quartz powder, 1-10 parts of carbon fiber (reinforcing agent), 0.1-0.2 parts of carbon nano Tube, 1-10 parts of SiC whisker (filler) and 0.1-1 part of ultraviolet absorber UV-531 (anti-aging agent), component B is composed of 20-50 parts of 3-diethylaminopropylamine according to the ratio of parts by mass (DEAPA, as a curing agent), 1~3 parts of silane coupling agent KH-550, 0.5~1.5 parts of accelerator DMP-30 and 10~20 parts of quartz powder (filler), mix A component and B component According to the mass ratio of 100:20~25, mix evenly under heating conditions and then sizing.

specific Embodiment approach 2

[0013] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the first component is composed of 70-90 parts of E-44 epoxy resin, 70-80 parts of E-51 epoxy resin, 20-30 parts of liquid-terminated carboxylated nitrile rubber, 45-55 parts of quartz powder, 2-8 parts of carbon fiber, 0.12-0.18 parts of carbon nanotubes, 4-7 parts of SiC whiskers and 0.4-0.8 parts of ultraviolet absorber UV-531 production. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0014] Specific embodiment three: the difference between this embodiment and specific embodiment one is: the first component is composed of 80 parts of E-44 epoxy resin, 75 parts of E-51 epoxy resin, 25 parts of liquid end Carboxylated nitrile rubber, 50 parts of quartz powder, 5 parts of carbon fiber, 0.15 parts of carbon nanotubes, 5 parts of SiC whiskers and 0.6 parts of ultraviolet absorber UV-531. Others are the same as in the first embodiment.

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Abstract

The invention relates to a double-component epoxy adhesive for bonding ceramics, a preparation method and using method thereof, belonging to the adhesive field, and aiming at solving the technical problem that the interfacial stress is overhigh owning to great difference of linear expansion coefficients when the existing epoxy adhesive is used for bonding the ceramics. The component A of the double-component epoxy adhesive is prepared by E-44 epoxy resin, E-51 epoxy resin, carboxy terminal butadiene-acrylonitrile, ground quartz, carbon fiber, carbon nano tube, SiC crystal whisker and ultraviolet absorber UV-531, the component B of the double-component epoxy adhesive is prepared by 3-diethylin propylamine, silane coupling agent KH-550, accelerating agent DMP-30 and ground quartz, and the double-component epoxy adhesive is prepared by a mixing method. When the adhesive is used, the adhesive is coated on a surface to be adhered for superimposition and solidification; and the shearing strength of the adhesive can reach more than 60MPa when the adhesive is used for bonding SiC ceramic; the bonding interface is good, an obvious mechanical embedding function is realized between an adhesive layer and a parent metal, and the defects such as cracks, air holes and the like do not exist in the adhesive layer.

Description

technical field [0001] The invention belongs to the field of adhesives; in particular, it relates to a two-component epoxy adhesive for bonding ceramics and a preparation method and application method thereof. Background technique [0002] Due to its low density, low coefficient of linear expansion, high elastic modulus, high thermal conductivity, high hardness, non-toxicity, good dimensional stability, and especially excellent thermal shock resistance, SiC ceramic materials are in the forefront of various materials in terms of comprehensive performance. In recent years, it has been widely used in aerospace, machinery industry, electronics and other fields. However, due to the limitation of preparation and processing technology, it is difficult to produce large-sized SiC ceramics. Therefore, in practical applications, it is usually necessary to connect ceramics and ceramics or ceramics and metals. When connecting SiC ceramics by welding, the connection temperature is high, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J113/00C09J11/04C09J11/06C04B37/00
Inventor 李卓然吴广东王征征冯吉才
Owner HARBIN INST OF TECH
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