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Formaldehyde-inhibiting composite clay adhesive filler

A clay and adhesive technology, applied in the direction of aldehyde/ketone condensation polymer adhesives, adhesives, adhesive types, etc., to improve dispersibility and adhesiveness, facilitate continuous industrial production, and reduce the amount of release.

Active Publication Date: 2012-02-08
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] But so far, the synthesis technology of low-toxic and pollution-free urea-formaldehyde resin adhesives has not really broken through, so urea-formaldehyde resins with high free formaldehyde content are still widely used in my country's wood processing industry.

Method used

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  • Formaldehyde-inhibiting composite clay adhesive filler

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The first step is the preparation of mineral powder

[0033] The dry attapulgite and sepiolite mineral particles are respectively crushed with a jaw crusher, and squeezed into a powder with a particle size of less than 2mm by pair of rollers. The attapulgite mineral involved in the present invention is attapulgite produced in Linze, Gansu, and the sepiolite mineral fiber is sepiolite produced in Xishan, Henan, and the like.

[0034] The second step of clay mineral removal

[0035]Add 100L of aqueous solution containing 2% hydrochloric acid to the two mixing tanks, start the mixer, and add 15kg of attapulgite powder and 15kg of sepiolite powder obtained in the previous step respectively at a stirring speed of about 50rpm, and then adjust Rotate at 1250 rpm, stir for 30 minutes, and let stand for 4 hours. The upper layer of pulp is separated by siphon method, and the solid sediment in the lower layer is discarded. After the pulp is dehydrated by a centrifuge with a rot...

Embodiment 2

[0057] The first step to the third step are completely with embodiment 1. the fourth step

[0058] The fourth step is the surface modification of mineral powder silane coupling agent

[0059] In the 1.0kg urea soaked attapulgite powder and / or sepiolite ore powder prepared in the third step, add an acetone solution (diphenyldimethoxysilane) containing 40g diphenyldimethoxysilane (ZH-1106) The mass percentage of methoxysilane is 5% to 10%), adjust the mixer speed to 1250rpm, disperse for 30 minutes, let stand for more than 4h, dry at 105°C, and ball mill to obtain attapulgite powder modified by silane coupling agent 1.04kg or 1.04kg of sepiolite powder modified by silane coupling agent.

[0060] The fifth step is the preparation of composite modified powder filler

[0061] Add 700g of attapulgite powder modified by silane coupling agent into the ball mill jar, put 150g of sepiolite powder modified by silane coupling agent into the ball mill, add 2400g of ceramic balls, keep t...

Embodiment 3

[0064] The first step to the third step are completely with embodiment 1.

[0065] The fourth step is the surface modification of mineral powder silane coupling agent

[0066] In the 1.0kg urea soaked attapulgite powder and / or sepiolite ore powder prepared in the third step, add an acetone solution (diphenyl dimethoxysilane) containing 30g diphenyl dimethoxysilane (ZH-1106) The mass percentage of methoxysilane is 5% to 10%), adjust the mixer speed to 1250rpm, disperse for 30 minutes, let stand for more than 4h, dry at 105°C, and ball mill to obtain attapulgite powder modified by silane coupling agent 1.03kg or 1.03kg of sepiolite powder modified by silane coupling agent.

[0067] The fifth step is the preparation of composite modified powder filler

[0068] Add 500g of attapulgite powder modified by silane coupling agent into the ball mill jar, put 200g of sepiolite powder modified by silane coupling agent into the ball mill, add 2400g of ceramic balls, keep the speed at 120...

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Abstract

The invention discloses composite silica-magnesia clay urea-formaldehyde resin adhesive filler for inhibiting emission of free formaldehyde. The filler is prepared from 30-70 percent of modified attapulgite powder, 0-50 percent of modified sepiolite powder and 15-30 percent of vegetable protein powder, wherein the total percentage of the components is 100 percent. According to the composite silica-magnesia clay urea-formaldehyde resin adhesive filler disclosed by the invention, natural attapulgite and sepiolite mineral powder with abundant reservation, wide distribution range and low price are used as raw materials; urea with the characteristic of specifically absorbing the formaldehyde is infiltrated; the surface of the powder is modified by using a silane coupling agent with a function of improving the affinity of the filler and a urea-formaldehyde resin adhesive; and when the silane coupling agent is used for organic filler to fill the adhesive, the dispersability and the adhesiveness of the filler can be improved. The processing technique is easy to realize continuous industrial production and avoid three-waste discharge.

Description

technical field [0001] The technical solution of the present invention relates to the preparation technology and application field of the composite powder filler which can effectively reduce the content of free formaldehyde in the adhesive by processing clay minerals modified with urea and silane coupling agent, specifically to improve The non-toxic composite clay mineral powder is used as a filler for urea-formaldehyde resin adhesives to suppress the release of free formaldehyde in plywood, artificial fiberboard, density board and other products. Background technique [0002] Large-scale production of composite panels requires the use of large amounts of adhesives and solid fillers. Due to the excellent performance of urea-formaldehyde resin adhesive, its raw materials are easy to obtain, the price is low, and the synthesis process is simple, so it has become the most widely used wood adhesive. However, the man-made composite panels bonded by urea-formaldehyde resins relea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J11/04C09J11/08C09J161/24C09C1/42C09C3/12C09C3/08C09C3/04C09C3/10
Inventor 汤庆国王群英梁金生
Owner HEBEI UNIV OF TECH
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