Protogenic diamond fine particle for precisio machining and production method thereof

Abstract

The invention relates to a protogenic diamond fine particle for precision machining and a production method thereof. The diamond particle is 1-30 microns in size, is of the shape of hexahedron, octahedron or hexahedron-octahedron and has a nitrogen content of 200-500 ppm. The production method comprises the steps of: mixing graphite powder, a metal catalyst and a nitrogenous substance at a proportion of 0.4-1: 0.6-1.0: 0.01-0.05 for an isostatic cool pressing treatment; pressing the mixed material into a cylindrical synthesis column for vacuum sintering; then filling pyrophyllite synthetic block and performing a high-temperature and high-pressure treatment in a cubic press; the crushing the synthesis column and separating the crushed synthesis column by a swing bed to obtain the protogenic diamond fine particle for precision machining. The protogenic diamond fine particle has the advantages of being applicable for machining tools, such as fretsaws, ultra-thin saw blades and electroplated grinding wheels, being suitable for efficient precision machining of glass, monocrystalline silicon, polycrystalline silicon, sapphires and silicon carbide crystals and having high machining efficiency as well as long service life. The method, disclosed by the invention, has the advantages of being green, environment-friendly and energy-saving and having steady product performance, low cost and good application performance.

Description

[0001] technical field [0002] The invention relates to a diamond for precision machining, in particular to a primary fine-grain diamond for precision machining and a production method thereof. Background technique [0003] In recent years, with the vigorous development of new semiconductor materials, solar photovoltaic industry and LED industry, how to reduce costs and improve efficiency has become a difficult problem in the processing of monocrystalline silicon, polycrystalline silicon, sapphire, silicon carbide and glass-ceramic. The traditional method adopts the cutting method of silicon carbide free blade and steel wire, adding silicon carbide free abrasive in ethylene glycol solution to make a suspension, and then spraying the suspension between the steel wire and the gap between the processing object to cut the above raw materials processing. This method has obvious disadvantages: (1) Since ethylene glycol is toxic, it will cause harm to the environment and human bo...

AI Technical Summary

Problems solved by technology

[0005] In the field of sapphire and silicon carbide cutting, the advantages of diamond wire saws are more obvious. Diamond wire saws will play a big role in the field of crystal processing in the future. The method mostly uses the "crushing method" to produce silicon carbide and diamond powder. These crushed materials have the following disadvantages: (1) Different degrees of cracks and internal stress will be left inside the particles during the production process, resulting in large abrasive particles during processing Broken and falling off, the products produced have a shorter service life; (2) The shape of the particles is not ideal, mostly irregular, with sharp protrusions in some parts; the grinding material produced by the improved process has no complete crystal planes and edges. The sharpness of the processing tools is poor, and the processing efficiency is not high

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