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Preparation method of high heat conductive and hight temperature resistant corrugated ceramic-based heat exchanger chip

A ceramic base and heat exchanger technology, applied in ceramic products, other household appliances, household appliances, etc., to achieve the effects of enhancing strength, reducing contact thermal resistance, and high heat exchange efficiency

Inactive Publication Date: 2012-07-18
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a high thermal conductivity and high temperature resistant ceramic heat exchanger with high thermal conductivity, high thermal conductivity, compact structure and continuous heat exchange for the deficiencies in the core structure and performance of the existing high temperature regenerative heat exchanger. Core manufacturing method

Method used

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  • Preparation method of high heat conductive and hight temperature resistant corrugated ceramic-based heat exchanger chip
  • Preparation method of high heat conductive and hight temperature resistant corrugated ceramic-based heat exchanger chip
  • Preparation method of high heat conductive and hight temperature resistant corrugated ceramic-based heat exchanger chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Quantitatively 100g / m 2 The ceramic fiber paper (200mm wide, 0.5mm thick cylindrical roll paper, containing 3% polyvinyl alcohol fiber) is immersed in the glue solution (containing 6% polyvinyl alcohol) with a mass concentration of 30% of silica sol for 30s until completely Soaked and formed by corrugating rollers at 120°C to obtain corrugated surface paper; flat bottom paper, basis weight: 30g / m 2 Ceramic fiber paper (200mm wide, 0.15mm thick cylindrical roll paper, containing 3% by mass polyvinyl alcohol fiber) is bonded to the corrugated surface after being impregnated in the same concentration of silica sol (containing 6% polyvinyl alcohol) On the paper, a corrugated ceramic-based double-sided fiber paper is formed. It should be noted that the corrugated surface paper is relatively thick based on the formation of better single-sided corrugated paper, while the backing paper should be as thin as possible. On the one hand, it can increase the specific surface area of...

Embodiment 2

[0035] Quantitatively 100g / m 2 The ceramic fiber paper (200mm wide, 0.5mm thick cylindrical roll paper, containing 5% wood pulp fiber) was soaked in the glue solution (containing 8% vinyl acetate glue) with a mass concentration of water glass of 30% for 30s and waited to be completely soaked. Corrugated roll 120 ℃ heat forming corrugated face paper, flat bottom paper (weight: 30g / m 2 Ceramic fiber paper, 200mm wide, 0.15mm thick cylindrical roll paper) is impregnated in the same concentration of water glass (containing 5% vinyl acetate glue), and then bonded to corrugated paper to form a corrugated ceramic-based double-sided fiber paper . Using sodium silicate inorganic glue with 3% copper oxide powder as the binder, cut the double-sided corrugated paper into 20×20 squares, stack them alternately at 90° angles along the corrugated paper channels along the square surface, and form a honeycomb shape after bonding Cube (20cm×20cm×20cm), first slowly solidified and bonded (4hr) ...

Embodiment 3

[0038] Quantitatively 100g / m 2 The ceramic fiber paper (200mm wide, 0.5mm thick cylindrical roll paper, containing 5% polyamide fiber) was immersed in the glue solution (containing 5% vinyl acetate glue) with a mass concentration of silica sol of 30% for 30s until completely soaked, and then Corrugated roll 120 ℃ heat forming corrugated face paper, flat bottom paper (weight: 30g / m 2 Ceramic fiber paper, 200mm wide, 0.15mm thick cylindrical roll paper) is impregnated in the same concentration of silica sol, and then bonded to corrugated paper to form a corrugated ceramic-based double-sided fiber paper. Using sodium silicate inorganic glue with 3% copper oxide powder as the binder, cut the double-sided corrugated paper into 20×20 squares, stack them alternately at 90° angles along the corrugated paper channels along the square surface, and form a honeycomb shape after bonding Cube (20cm×20cm×20cm), first slowly solidified and bonded (4hr) in a 90°C blast oven, after cooling, tr...

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Abstract

The invention discloses a preparation method of a high heat conductive and hight temperature resistant corrugated ceramic-based heat exchanger chip. The method comprises the following steps of: first, impregnating a ceramic fiber paper in a sizing agent; carrying out hot-press forming on the ceramic fiber paper by using a corrugated paper machine so as to obtain a single-face corrugated paper; bonding the single-face corrugated paper with the flat-plate ceramic fiber paper impregnated by the sizing agent so as to obtain a double-face corrugated paper; cutting the double-face corrugated paper into square shapes with same sizes; and then overlapping the squares with each other along the square face according to a corrugated paper passage of 90 degrees; bonding the squares with each other soas to obtain the corrugated ceramic-based heat exchanger chip; curing, bonding and sintering the corrugated ceramic-based heat exchanger chip; naturally cooling the corrugated ceramic-based heat exchanger chip to room temperature; impregnating the chip into a suspension consisting of silica gel and a high heat conductive inorganic filler; impregnating, depositing and taking out the chip; drying the chip after blowing the liquid; and drying the chip so as to obtain the high heat conductive and hight temperature resistant corrugated ceramic-based heat exchanger chip. According to the invention,by using the overlapped honeycomb structure, the heat exchanging area of the heat exchanger unit volume is increased, no inference is caused between the heat exchanging passages so that clean heat exchanging airflow is obtained to get the characteristics of heat exchanging continuity, compact structure and the like.

Description

technical field [0001] The invention relates to high-temperature gas heat recovery technology, and intends to propose a method for preparing a heat exchanger core for high-temperature waste gas waste heat recovery, in particular to a method for forming ceramic corrugated paper, sintering the heat exchanger core, and improving the thermal conductivity of the core. Background technique [0002] Commonly used high-temperature flue gas heat recovery devices include: waste heat boilers made of metal or alloys, heat pipe heat exchangers, plate heat exchangers; ceramic heat storage core heat exchangers represented by silicate materials, etc. The former mainly has shortcomings such as corrosion resistance, scaling, thermal stress, and high temperature resistance, and is mostly used in heat energy recovery in the middle and low temperature sections; the latter heat exchanger is often used in regenerative systems for high temperature systems due to its high temperature resistance and c...

Claims

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Application Information

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IPC IPC(8): C04B38/00
Inventor 方玉堂何文祥张正国高学农徐涛王磊
Owner SOUTH CHINA UNIV OF TECH
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