Method for preparing graphene composite thin film on surface of silicon slice
A graphene composite and silicon wafer surface technology, applied in the field of thin film preparation, can solve problems such as poor interface bonding performance, achieve low cost, be suitable for large-scale industrial production, and improve photoelectric conversion efficiency
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Embodiment 1
[0024] The raw materials used include: graphene oxide: graphene oxide produced by a certain company; aminosilane: 3-aminopropyl-triethoxysilane (APTES) sold by Shanghai Jingchun Reagent Co., Ltd.; the rare earth solution is prepared according to the following weight percentages :
[0025] Lanthanum Chloride: 0.5%, Ethanol: 99.3%, EDTA 0.05%, Ammonium Chloride: 0.1%, Nitric Acid 0.02%, Urea: 0.03%
[0026] First, pre-treat the silicon wafer, soak the silicon wafer in aqua regia, heat the aqua regia in an electric furnace for 5 hours, cool it naturally at room temperature, take out the silicon wafer, rinse it repeatedly with deionized water, put it in Dry in a desiccator. After drying, soak in Pirahan solution (H 2 SO 4 :H 2 o 2 =70:30, V / V), treated at room temperature for 1 hour, ultrasonically cleaned with deionized water, placed in a dust-proof device, and dried in an oven.
[0027] Next, immerse the treated silicon wafer in the prepared aminosilane solution and let it...
Embodiment 2
[0031]The raw materials used include: graphene oxide: graphene oxide produced by a certain company; aminosilane: 3-aminopropyl-triethoxysilane (APTES) sold by Shanghai Jingchun Reagent Co., Ltd.; the rare earth solution is prepared according to the following weight percentages :
[0032] Lanthanum Chloride: 1%, Ethanol: 98.8%, EDTA 0.05%, Ammonium Chloride: 0.1%, Nitric Acid 0.02%, Urea: 0.03%
[0033] First, pre-treat the silicon wafer, soak the silicon wafer in aqua regia, heat the aqua regia in an electric furnace for 5 hours, cool it naturally at room temperature, take out the silicon wafer, rinse it repeatedly with deionized water, put it in Dry in a desiccator. After drying, soak in Pirahan solution (H 2 SO 4 :H 2 o 2 =70:30, V / V), treated at room temperature for 1 hour, ultrasonically cleaned with deionized water, placed in a dust-proof device, and dried in an oven.
[0034] Next, immerse the treated silicon wafer in the prepared aminosilane solution and let it st...
Embodiment 3
[0038] The raw materials used include: graphene oxide: graphene oxide produced by a certain company; aminosilane: 3-aminopropyl-triethoxysilane (APTES) sold by Shanghai Jingchun Reagent Co., Ltd.; rare earth modifier according to the following weight Percent preparation:
[0039] Cerium Oxide: 2%, Ethanol: 95%, EDTA 0.5%, Ammonium Chloride: 1%, Nitric Acid 0.5%, Urea: 1%
[0040] The preparation of the reduced graphene oxide composite film comprises the following steps:
[0041] (1) First, pretreat the silicon wafers with PN junctions, soak the silicon wafers in aqua regia, heat the aqua regia in an electric furnace for 6 hours, cool naturally at room temperature, take out the silicon wafers, and use Rinse repeatedly with deionized water, dry in a drying dish, and then soak in Pirahan solution (H 2 SO 4 :H 2 o 2 =70:30, V / V), treated at room temperature for 1 hour, ultrasonically cleaned with deionized water, placed in a dust-proof device, and dried in an oven at 90°C for...
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