Modified acrylate heat-dissipation powder coating as well as preparation method and application thereof

A powder coating and acrylate technology, applied in the field of its preparation and modified acrylate heat dissipation powder coating, can solve the problems of unfavorable heat conduction and heat dissipation, affecting the heat dissipation effect, and excessive particle diameter, so as to increase the effective heat dissipation area and facilitate the heat dissipation. The effect of conduction and improving heat dissipation efficiency

Active Publication Date: 2012-08-01
HISENSE VISUAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] For example, the heat dissipation coatings disclosed in patent applications ZL 200810146607.5, ZL 200510056010.8, and CN 200610080211.6 all directly mix heat dissipation particles and polymers through physical mixing. The disadvantage is that when the diameter of heat dissipation particles is as small as nanometers Sometimes, the particles will be difficult to disperse evenly in the polymer due to the "cluster" ef

Method used

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  • Modified acrylate heat-dissipation powder coating as well as preparation method and application thereof
  • Modified acrylate heat-dissipation powder coating as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] 0.2g azobisisobutyronitrile and 30g xylene are formulated into initiator solution, and 1.5g carboxyl content is the multi-walled carbon nanotube (diameter 40nm, length 400nm) of 0.4% and 8.5g carbon fiber (carboxyl content is 0.02%) Carboxylated pitch-based carbon fiber, diameter 7000nm, length 5000nm), 10g styrene, 35g methyl methacrylate, 30g glycidyl methacrylate, 15g 2-ethylhexyl acrylate, 300g xylene formulated as a monomer solution;

[0063] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution is raised to 65 ° C, and the initiator solution is added dropwise to the monomer solution for polymerization reaction in 4 times, and the time of each drop is 15 minutes. After the addition, the reaction was continued for 1 hour. When all the initiator solution was added to the polymerization system, the reaction was continued for 1 hour, and the synthesis reaction was completed to obtain a coating solution. ...

Embodiment 2

[0070] 0.2g azobisisobutyronitrile and 50g toluene are mixed with initiator solution, and 1.5g carboxyl content is the multi-walled carbon nanotube (diameter 40nm, length 400nm), 1g nano-alumina (diameter 300nm), 1.5 g nano silicon carbide (diameter 300nm) and 16g carbon fiber (carboxyl content is 0.02% carboxylated pitch-based carbon fiber, diameter 7000nm, length 5000nm), 8g styrene, 32g methyl methacrylate, 26g glycidyl methacrylate, 14g acrylate-2-ethylhexyl ester, 250g toluene is mixed with monomer solution;

[0071] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution was raised to 72°C, and the initiator solution was added dropwise to the monomer solution in 4 times to carry out the polymerization reaction. The time for each drop was 15 minutes. After the addition, the reaction was continued for 1 hour. When all the initiator solution was added to the polymerization system, the reaction was continued for ...

Embodiment 3

[0076] 0.3g azobisisoheptanonitrile and 40g dimethylbenzene are formulated into initiator solution, and 1g hexagonal boron nitride (diameter 400nm), 1g nano-silicon carbide (diameter 200nm), 0.5g carboxyl content are 0.4% multi-walled carbon Nanotubes (diameter 40nm, length 400nm), and 12.5g carbon fiber (carboxyl group content is 0.04% carboxylated pitch-based carbon fiber, diameter 7000nm, length 5000nm), 10g styrene, 30g methyl methacrylate, 30g methacrylic acid shrink Glycerides, 15g of 2-ethylhexyl acrylate, and 300g of xylene are prepared into a monomer solution;

[0077] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution was raised to 72°C, and the initiator solution was added dropwise to the monomer solution in 4 times to carry out the polymerization reaction. The time for each drop was 15 minutes. After the addition, the reaction was continued for 1 hour. When all the initiator solution was added to t...

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Abstract

The invention provides a modified acrylate heat-dissipation powder coating material which is prepared in a way that heat-dissipation agent is dispersed in a monomer solution, subjected to in-situ polymerization and then treated through desolventizing agent, wherein the weight ratio of the heat-dissipation agent to monomer is (1-25) to (7.5-9); the heat-dissipation agent comprises 82-90 percent of carbon fiber and 10-20 percent of nanometer material; and the monomer is one or more of styrene, methacrylic acid, glycidyl ester, acrylic acid-2-ethyl hexyl ester, methyl methacrylate and methyl acrylate. According to the invention, as the heat-dissipation coating material dispersed uniformly and added with the carbon fiber and nanometer material compound heat-dissipation particles is obtained by adopting solution in-situ polymerization, the heat transmission efficiency and the heat dissipation efficiency can be increased; and the heat-dissipation coating material can be coated as a heat-dissipation coating on the surface of a back plate of an LED LCM (liquid crystal model) to dissipate part of the heat generated by LEDs in a infrared radiation manner, so that the heat dissipation performance of the LED LCM is enhanced, and the heat dissipating capacity and the heat dissipation efficiency are improved in the same heat dissipation area.

Description

technical field [0001] The invention relates to a heat-dissipating coating, in particular to a modified acrylate heat-dissipating powder coating, its preparation method and application. Background technique [0002] At present, with the rapid development of microelectronics technology and assembly technology, modern electronic equipment is increasingly becoming a highly integrated system formed by high-density assembly and micro-assembly. The heat flux density of electronic equipment is also increasing, and its life is directly related to its operating temperature. The temperature gradient during use will generate thermal stress and thermal deformation, which will eventually lead to product fatigue failure. It can be seen that improper heat dissipation design is an important reason for the failure of modern electronic products. Therefore, some heat-dissipating materials are used in electrical and electronic components such as displays or integrated circuits in order to prev...

Claims

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Application Information

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IPC IPC(8): C09D133/12C09D133/14C09D133/08C09D7/12C09D5/03C08F220/14C08F212/08C08F220/32C08F220/18C08F2/44F21V29/00F21Y101/02F21V29/87F21Y115/10
Inventor 邢哲
Owner HISENSE VISUAL TECH CO LTD
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