Chemical amplification-type positive photoresist, preparation method and application thereof in two-photon fine processing
A technology of positive photoresist and chemical amplification, which is applied in the direction of photomechanical equipment, pattern surface photolithography, optics, etc., can solve the difficulties in the preparation of chemically amplified positive photoresist, low processing energy threshold, processing Problems such as high resolution, achieve the effect of low processing energy threshold, good electron donating ability, and high processing resolution
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Embodiment 1
[0047] A chemically amplified positive photoresist containing a two-photon sensitized acid-generating system, comprising the following raw materials in parts by weight:
[0048] In the general formula M1, A1, A2, A3, and A4 are all hydrogen atoms, is the dye S1 of cyclopentanone as a two-photon sensitizer;
[0049]
[0050] Under dark conditions, dissolve 20mg of S1 and 120mg of N-hydroxyphthalimide triflate in 15g of N,N dimethylformamide, after the dissolution is complete, add 4g of t-BOC Protected poly-4-hydroxystyrene, placed in the dark for 4h, and stirred evenly. Coat the prepared two-photon polymerization resin on a glass sheet, bake at 90°C for 5 minutes to remove solvent residue, use Ti-Sapphire femtosecond as a laser light source, pulse width 80 femtoseconds, repetition frequency 80MHz, wavelength 780nm, output power 0.35mw , the laser beam is focused into the two-photon chemically amplified positive photoresist film through a microscope with a magnification of...
Embodiment 2
[0052] A chemically amplified positive photoresist containing a two-photon sensitized acid-generating system, comprising the following raw materials in parts by weight:
[0053] In the general formula M1, A1 and A2 are hydrogen atoms, A3 and A4 are methyl groups, is the dye S2 of cyclobutanone as a two-photon sensitizer;
[0054]
[0055] Under dark conditions, dissolve 10mg S2 and 100mg N-hydroxyphthalimide trifluoromethanesulfonate in 15g diethylene glycol dimethyl ether, after the dissolution is complete, add 4g part of t-BOC to protect poly-4-hydroxystyrene, placed in the dark for 4h, and stirred evenly. Coat the prepared two-photon polymerization resin on a glass sheet, bake at 90°C for 5 minutes to remove solvent residue, use Ti-Sapphire femtosecond as the laser light source, pulse width 80 femtosecond, repetition frequency 80MHz, wavelength 750nm, output power 0.5mw , the laser beam is focused into the two-photon chemically amplified positive photoresist film thro...
Embodiment 3
[0057] A chemically amplified positive photoresist containing a two-photon sensitized acid-generating system, comprising the following raw materials in parts by weight:
[0058] In the general formula M2, A1 and A2 are both methyl groups, A3 is a hydrogen atom, is the dye S3 of cyclobutanone as a two-photon sensitizer;
[0059]
[0060] Under light-shielding conditions, 15 mg of S3 and 60 mg of bis(trichloromethyl) triazine were dissolved in 15 g of acetic acid ethylene glycol methyl ether. After the dissolution was complete, 5 g of t-BOC-protected poly-4-hydroxystyrene was added. Place it under dark conditions for 4h, and stir well. Coat the prepared two-photon polymerization resin on a glass sheet, bake at 90°C for 5 minutes to remove solvent residue, use Ti-Sapphire femtosecond as a laser light source, pulse width 80 femtosecond, repetition frequency 80MHz, wavelength 800nm, output power 0.30mw , the laser beam is focused into the two-photon chemically amplified posit...
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