Low dielectric constant glass plate and preparation method thereof

Abstract

The invention discloses a low dielectric constant glass plate and a preparation method thereof. The glass batch of the glass plate comprises the following components in percentage by mass: 55-75 % of SiO2, 5-15 % of Al2O3, 0-10 % of MgO, 1-15 % of K2O, 0-10 % of Na2O, 0-5 % of Li2O, 0-10 % of CaO, 0-10 % of B2O3, 5-20 % of ZrO2 and 0.5-2 % of clarifier, wherein the total mass percentage is 100 %; the clarifier is a mixture of SnO2 and CeO2, wherein the CeO2 accounts for 20-50 % of the total quantity of the clarifier. The low dielectric constant glass plate disclosed by the invention can be directly used as a circuit board, obtains higher heat stability and is suitable for working in electronic components under a severe environment for a long time; through the adding of a zirconium element, the dielectric constant can be adjusted, so that dielectric constant and dielectric loss at a lower level are achieved; through the integral formula composition of the glass and the adoption of a composite clarifier, the glass plate obtains better clarifying quality; moreover, the characteristics of the low dielectric constant glass plate disclosed by the invention are suitable for large-scale production in a floating or overflow down draw process; and the manufacturing cost is reduced.

Description

technical field [0001] The present invention relates to the field of glass manufacturing, more specifically to a glass plate with low dielectric constant and its manufacturing method, which can be used on the protective glass of mobile phone touch screen and integrated circuit substrate, and can be used by float process or overflow down-drawing The process realizes large-scale industrial production. Background technique [0002] With the rapid development of electronic industry technology, the miniaturization and miniaturization of electronic equipment has become one of the development trends. The frequency of electromagnetic waves used in the transmission process has reached MHz and GHz levels. The smaller the dielectric constant of the material, the greater the transmission of the signal. The faster the rate; the smaller the dielectric tangent of the material, the smaller the propagation loss at a fixed propagation frequency. Therefore, the circuit board is required to ha...

AI Technical Summary

Problems solved by technology

In the prior art, glass fiber and glass ceramics are often used as low-dielectric materials, which increases the material process and increases the manufacturing cost.

However, the current aluminosilicate glass with high thermal stability generally has a dielectric constant greater than 7, which cannot meet the needs of the electronics industry.