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A method for preparing polyamide-based thermally conductive composite materials by in-situ polymerization

A heat-conducting composite material, polyamide-based technology, applied in the field of preparation of polymer/inorganic nanocomposite materials, can solve the problems of difficult molding and processing, uneven dispersion of inorganic nanoparticles, etc., and achieve excellent mechanical properties, good appearance gloss, high The effect of thermal conductivity

Inactive Publication Date: 2015-12-09
HANGZHOU QIANSHI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The problem to be solved by the present invention is to solve the problem of uneven dispersion of inorganic nanoparticles in the polymer matrix and difficulty in molding and processing by in-situ polymerization, and to provide a preparation with moderate filling amount, high thermal conductivity, comprehensive mechanical properties and processing properties. Excellent, and can be applied to the preparation method of polyamide-based heat-conducting composite materials used as raw materials for the preparation of heat dissipation components of electronic appliances

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The heat-conducting particles prepared by polymerization of caprolactam monomer / nanocomposite inorganic particles / ring-opening initiator with a mass ratio of 70 / 20 / 10 were placed in a vacuum drying oven at 75°C for 4 hours, wherein nano-alumina and carbon fiber The mass ratio of the compound is 5:1, and the amount of the coupling agent is 1% of the total mass of the nanocomposite inorganic particles; then, it is mixed and extruded in a twin-screw extruder together with an antioxidant, a lubricant, and an anti-ultraviolet light stabilizer. For thermally conductive composite materials, the barrel temperature is controlled at 210-240°C, and the vacuum device is kept open. The amounts of antioxidant, lubricant, and anti-ultraviolet light stabilizer are 0.5%, 3%, and 1.5% of the total mass of the thermally conductive composite material, respectively.

[0022] The performance test results of the thermally conductive composite material prepared above are as follows: thermal con...

Embodiment 2

[0024] The heat-conducting particles prepared by polymerization of caprolactam monomer / nanocomposite inorganic particles / ring-opening initiator with a mass ratio of 70 / 20 / 10 were placed in a vacuum drying oven at 75°C for 4 hours, wherein nano-alumina and carbon fiber The mass ratio of the compound is 8:1, and the amount of the coupling agent is 1% of the total mass of the nanocomposite inorganic particles; then it is mixed and extruded in a twin-screw extruder together with an antioxidant, a lubricant, and an anti-ultraviolet light stabilizer. For composite materials, the temperature of the barrel is controlled at 210-240 °C, and the vacuum device is kept open. The amounts of antioxidant, lubricant, and anti-ultraviolet light stabilizer are respectively 0.5%, 3%, and 1.5% of the total mass of the thermally conductive composite material.

[0025] The performance test results of the thermally conductive composite material prepared above are as follows: the thermal conductivity i...

Embodiment 3

[0027] The heat-conducting particles prepared by polymerization of caprolactam monomer / nanocomposite inorganic particles / ring-opening initiator with a mass ratio of 70 / 25 / 5 were placed in a vacuum drying oven at 75°C for 4 hours, wherein nano-alumina and carbon fiber The mass ratio of the compound is 5:1, and the amount of the coupling agent is 0.5% of the total mass of the nanocomposite inorganic particles; then, it is mixed and extruded in a twin-screw extruder together with an antioxidant, a lubricant, and an anti-ultraviolet light stabilizer. For thermally conductive composite materials, the barrel temperature is controlled at 210-240°C, and the vacuum device is kept open. The amounts of antioxidant, lubricant, and anti-ultraviolet light stabilizer are 0.5%, 3%, and 1.5% of the total mass of the thermally conductive composite material, respectively.

[0028] The performance test results of the thermally conductive composite material prepared above are as follows: thermal co...

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Abstract

The invention discloses a method for preparing a polyamide-base heat-conducting composite material by in-situ polymerization, which comprises the following steps: adding polymerization reaction monomer, initiator, ring-opening initiator, coupling-agent-treated nano aluminum oxide and nano carbon fiber composite heat-conducting filler into a stainless steel polymerization reaction kettle, and carrying out polymerization reaction; after the reaction finishes, cooling, crystallizing, carrying out centrifugal separation, washing, and filtering to obtain polyamide-base heat-conducting plastic granules; and mixing and extruding the heat-conducting plastic granules, antioxidant, lubricant and anti-ultraviolet stabilizer with a double screw extruder to obtain the heat-conducting composite material. The polyamide-base heat-conducting composite material prepared by the method has the advantages of high heat conductivity and favorable mechanical strength; and after being subjected to injection molding, the polyamide-base heat-conducting composite material can be widely used in electronic and electric apparatuses, mobile phone shells and LED (light-emitting diode) lamp products to enhance the heat dissipation property of the product at high temperature and prolong the service life.

Description

technical field [0001] The invention relates to a polymer-based composite material with relatively high thermal conductivity prepared by an in-situ polymerization method, in particular to a method for preparing a polymer / inorganic nanocomposite material suitable for heat dissipation shells of electronic and electrical products. Background technique [0002] Metal materials are used in the main body of electronic and electrical equipment, radiation heat sinks and other components due to their high mechanical strength, thermal conductivity and electrical conductivity. However, metal materials have disadvantages such as heavy weight, high processing energy consumption, and high pollution. Gradually replaced by plastics, especially in the field of electronic appliances that require insulation and heat dissipation. In recent years, electronic components and electronic equipment have been developing in the direction of "thin, light, and small". It has become inevitable to develop ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/02C08K13/06C08K9/04C08K3/22C08K7/06C08K3/04C08G69/16
Inventor 董玉欣王鑫蔡伟王勇杰乔梁车声雷姜力强郑精武
Owner HANGZHOU QIANSHI TECH