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High temperature resistant silver coated substrates

A substrate, silver layer technology, applied in the direction of coating, metal material coating process, layered products, etc., can solve problems such as oxidation and adhesion problems that cannot be overcome, and achieve the effect of inhibiting adhesion failure and less adhesion failure

Active Publication Date: 2013-04-10
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In general, conventional methods used to enhance the adhesion of silver to nickel, such as silver strike plating and nickel surface catalysis, cannot overcome the oxidation and adhesion problems in high temperature applications

Method used

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  • High temperature resistant silver coated substrates
  • High temperature resistant silver coated substrates
  • High temperature resistant silver coated substrates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Embodiment 1 (comparative example)

[0046] Three cleaned copper-based samples (copper or copper / zinc) of 2 cm x 5 cm were placed in a nickel electroplating solution having the formulation described in Table 1.

[0047] Table 1

[0048] components

content

Nickel sulfate hexahydrate providing nickel ions

60g / L

Nickel chloride hexahydrate providing nickel ions

10g / L

boric acid

45g / L

Sodium saccharin

0.5g / L

Fatty Alcohol Ethoxylate Sulfate

2ml / L

[0049] The sample was connected to a rectifier and the counter electrode was a platinized titanium electrode. During the nickel plating process, keep the temperature of the nickel bath at 30 degrees Celsius. The current density is 1ASD. Electroplating was stopped when a nickel layer with a thickness of 2 μm was deposited on the surface of each copper sample. The samples were removed from the bath and rinsed with deionized water at room temperature.

...

Embodiment 2

[0058] Embodiment 2 (comparative example)

[0059] Three copper-based samples were prepared as described in Example 1, except that the nickel layer was plated with a gold strike instead of a silver strike. The composition of the gold strike plating solution is shown in Table 3.

[0060] table 3

[0061] components

content

Potassium gold cyanide providing gold ions

2g / L

Cobalt carbonate providing cobalt ions

0.5g / L

Tripotassium Citrate

50g / L

[0062] The gold strike bath was kept at 40°C, and the current density used was 0.2ASD. Gold plating was stopped when the gold layer deposited on the nickel layer reached 0.1 μm.

[0063] Each sample was then electroplated with a 5 μm thick layer of silver using the silver cyanide bath described in Table 2. The parameters used for silver plating were the same as in Example 1.

[0064] The silver-plated samples were taken out from the silver-plating solution, rinsed with deionized wa...

Embodiment 3

[0067] Embodiment 3 (comparative example)

[0068] Three copper-based samples were prepared as described in Example 1, except that the nickel layer was plated with a palladium-nickel alloy strike instead of a silver strike. The formulation of the palladium-nickel alloy strike plating solution is shown in Table 4.

[0069] Table 4

[0070] components

content

palladium tetraamine sulfate

20g / L

nickel sulfate

8g / L

Ammonium hydroxide

50g / L

[0071] The palladium-nickel alloy plating solution is kept at 60° C., and the current density is 0.2ASD. Stop electroplating when the thickness of the palladium-nickel alloy reaches 0.1 μm.

[0072] Each sample was then electroplated with a 5 μm thick layer of silver using the silver cyanide bath described in Table 2. The parameters used for silver plating were the same as in Example 1.

[0073] The silver-plated samples were removed from the silver-plating bath, rinsed with deionized ...

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Abstract

A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

Description

technical field [0001] The invention relates to a high-temperature-resistant silver-coated copper-containing substrate. More specifically, the present invention relates to a high temperature resistant silver-coated copper-containing substrate and improved adhesion of the silver coating to the copper-containing substrate. Background technique [0002] Electroplating and electroless silver plating have been widely used, such as manufacturing electrical connectors, printed circuit boards, light-emitting diodes, and silver plating on plastic or decorative parts by taking advantage of silver's excellent deposition properties. When silver is plated on a copper or copper alloy substrate, a nickel undercoat is usually applied to the copper or copper alloy prior to silver plating. The role of nickel here is to act as a barrier to prevent the diffusion of copper into the silver, and also to provide better surface morphology. To attach the silver layer to the nickel layer, a thin sil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/01C25D5/12
CPCC25D3/30C23C18/1651C25D3/32C25D3/60C23C18/1644C23C18/34C23C18/32C22C9/04C23C18/1671B32B15/018C25D5/12C23C18/36C25D3/46C23C18/42C23C28/023C23C18/31C25D3/562C25D3/12C23C18/1653C22C5/06C23C18/48C23C18/52Y10T428/12715C25D5/627B32B15/01C25D7/06
Inventor W·张-伯格林格M·克劳斯M·P·托本
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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