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Ni-Co-P chemical plating solution and method thereof

A ni-co-p, chemical plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of unsuitable chemical plating, low brightness of the coating, and high energy consumption

Inactive Publication Date: 2013-11-27
SHANDONG JIANZHU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the working temperature is high (generally 85-95°C), the plating solution evaporates quickly, more energy needs to be provided, the energy consumption is large, the equipment investment is increased, and the plating process is difficult to control; the operation at high temperature will cause some materials to be plated. The deformation and modification of the substrate lead to low brightness and poor leveling of the coating, which is not suitable for decoration, nor is it suitable for chemical plating on plastics, and the resulting coating has poor corrosion resistance

Method used

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  • Ni-Co-P chemical plating solution and method thereof

Examples

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Embodiment 1

[0076] A solution for low-temperature chemical plating of Ni-Co-P, its formula is: nickel sulfate 35g / L, cobalt sulfate 2.5g / L, cerium nitrate 0.15g / L, sodium hypophosphite 25g / L, sodium citrate 50g / L , lactic acid 5ml / L, boric acid 30g / L, succinic acid 8g / L, propionic acid 5ml / L, potassium iodide 2mg / L, thiourea 1.5mg / L; the solvent is distilled water, and the solution volume is the total of solute and solvent after mixing volume.

[0077] The concrete configuration steps of solution of the present invention are:

[0078] (1) Accurately weigh each solid drug according to the above solution formula and dissolve it with a small amount of distilled water;

[0079] (2) Pour the solution of nickel sulfate, cobalt sulfate and cerium nitrate into the solution containing complex complexing agent (sodium citrate, lactic acid), compound accelerator (succinic acid, propionic acid) and buffer (boric acid) under constant stirring. in solution;

[0080] (3) Pour reducing agent (sodium h...

Embodiment 2

[0092] A solution for low-temperature chemical plating of Ni-Co-P, its formula is: nickel sulfate 30g / L, cobalt sulfate 1.0g / L, cerium nitrate 0.2g / L, sodium hypophosphite 30g / L, sodium citrate 40g / L , lactic acid 3ml / L, boric acid 40g / L, succinic acid 5g / L, propionic acid 3ml / L, potassium iodide 2mg / L, thiourea 1.5mg / L; the solvent is distilled water, and the solution volume is the total of solute and solvent after mixing volume.

[0093] The concrete configuration steps of solution of the present invention are:

[0094] (1) Accurately weigh each solid drug according to the above solution formula and dissolve it with a small amount of distilled water;

[0095] (2) Pour the solution of nickel sulfate, cobalt sulfate and cerium nitrate into the solution containing complex complexing agent (sodium citrate, lactic acid), compound accelerator (succinic acid, propionic acid) and buffer (boric acid) under constant stirring. in solution;

[0096] (3) Pour reducing agent (sodium hy...

Embodiment 3

[0108] A solution for low-temperature chemical plating of Ni-Co-P, its formula is: nickel sulfate 33g / L, cobalt sulfate 2.0g / L, cerium nitrate 0.15g / L, sodium hypophosphite 27g / L, sodium citrate 45g / L , lactic acid 4ml / L, boric acid 35g / L, succinic acid 7g / L, propionic acid 4ml / L, potassium iodide 2mg / L, thiourea 1.5mg / L; the solvent is distilled water, and the solution volume is the total of solute and solvent after mixing volume.

[0109] The concrete configuration steps of solution of the present invention are:

[0110] (1) Accurately weigh each solid drug according to the above solution formula and dissolve it with a small amount of distilled water;

[0111] (2) Pour the solution of nickel sulfate, cobalt sulfate and cerium nitrate into the solution containing complex complexing agent (sodium citrate, lactic acid), compound accelerator (succinic acid, propionic acid) and buffer (boric acid) under constant stirring. in solution;

[0112] (3) Pour reducing agent (sodium h...

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Abstract

The invention relates to material surface chemical plating, and concretely relates to a solution for realizing the rapid plating of Ni-Co-P on the surface of a low carbon steel substrate under a low temperature condition, and a method thereof. Compared with the prior art, the solution and the method have the advantages of substantial chemical plating temperature reduction, solving of a problem that the plating speed of a low-temperature Ni-Co-P chemical plating process is low, and energy consumption reduction. The addition of earth elements improves the alloy deposition speed, increases the compactness of the finally obtained alloy plating layer and allows the alloy plating layer to have a high corrosion resistance.

Description

technical field [0001] The invention relates to chemical plating on the surface of materials, in particular to a solution and method for plating Ni-Co-P on the surface of a low-carbon steel base material under low temperature conditions. Background technique [0002] The performance of the multi-element alloy coating is better than that of a single nickel-phosphorus coating. Since cobalt has the same self-catalysis properties as nickel, cobalt ions can be introduced on the basis of Ni-P alloy to form a Ni-Co-P ternary alloy coating. Compared with Ni-P coating, Ni-Co-P alloy coating can refine the crystallization and increase the anisotropy of magnetic particles, and is mainly used in various magnetic recording systems. With the high functionalization of computers and electronic communication equipment, the miniaturization, high performance and high frequency of magnetic devices are required, so the requirements for the characteristics of the magnetic materials used are also ...

Claims

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Application Information

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IPC IPC(8): C23C18/50
Inventor 孙华马洪芳冯立明郭晓斐王玥蔡元兴
Owner SHANDONG JIANZHU UNIV
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