Ni-Co-P chemical plating solution and method thereof

A ni-co-p, electroless plating technology, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of high energy consumption, difficult plating process control, unsuitable for chemical plating, etc., to achieve Effects of reducing environmental pollution, improving working environment conditions, and protecting safety

Inactive Publication Date: 2013-11-27
SHANDONG JIANZHU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the working temperature is high (generally 85-95 ℃), the plating solution evaporates quickly, more energy needs to be provided, the energy consumption is large, the investment in equipment is increased, and the plating process is difficult to

Method used

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  • Ni-Co-P chemical plating solution and method thereof
  • Ni-Co-P chemical plating solution and method thereof
  • Ni-Co-P chemical plating solution and method thereof

Examples

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Example Embodiment

[0071] Example 1

[0072] A solution for rapid Ni-Co-P plating on the surface of low-carbon steel substrate under medium and low temperature conditions:

[0073] The formula of this solution is: nickel sulfate 35g / L, cobalt sulfate 2.5g / L, sodium hypophosphite 25g / L, sodium citrate 50g / L, lactic acid 5ml / L, boric acid 30g / L, succinic acid 8g / L, Propionic acid 5ml / L, potassium iodide 2mg / L, thiourea 1.5mg / L; the solvent is distilled water, and the solution volume is the total volume of the solute and solvent after mixing.

[0074] The specific configuration steps of the solution of the present invention are:

[0075] (1) Accurately weigh each solid medicine according to the above solution formula and dissolve it with a small amount of distilled water;

[0076] (2) Pour the solution of nickel sulfate and cobalt sulfate into the solution containing complex complexing agent (sodium citrate, lactic acid), complex accelerator (succinic acid, propionic acid) and buffer (boric acid) under cons...

Example Embodiment

[0082] Example 2

[0083] A solution for rapid Ni-Co-P plating on the surface of low-carbon steel substrate under medium and low temperature conditions:

[0084] The formula of this solution is: nickel sulfate 30g / L, cobalt sulfate 1.0g / L, sodium hypophosphite 30g / L, sodium citrate 40g / L, lactic acid 5ml / L, boric acid 35g / L, succinic acid 5g / L, Propionic acid 3ml / L, potassium iodide 2mg / L, and thiourea 1.5mg / L; the solvent is distilled water, and the solution volume is the total volume of the solute and solvent after mixing.

[0085] The specific configuration steps of the solution of the present invention are:

[0086] (1) Accurately weigh each solid medicine according to the above solution formula and dissolve it with a small amount of distilled water;

[0087] (2) Pour the solution of nickel sulfate and cobalt sulfate into the solution containing complex complexing agent (sodium citrate, lactic acid), complex accelerator (succinic acid, propionic acid) and buffer (boric acid) under ...

Example Embodiment

[0093] Example 3

[0094] A solution for rapid Ni-Co-P plating on the surface of low-carbon steel substrate under medium and low temperature conditions:

[0095] The formula of this solution is: nickel sulfate 33g / L, cobalt sulfate 1.8g / L, sodium hypophosphite 28g / L, sodium citrate 47g / L, lactic acid 4.5ml / L, boric acid 30g / L, succinic acid 7g / L , Propionic acid 4ml / L, potassium iodide 2mg / L, thiourea 1.5mg / L; solvent is distilled water, solution volume is the total volume of solute and solvent after mixing.

[0096] The specific configuration steps of the solution of the present invention are:

[0097] (1) Accurately weigh each solid medicine according to the above solution formula and dissolve it with a small amount of distilled water;

[0098] (2) Pour the solution of nickel sulfate and cobalt sulfate into the solution containing complex complexing agent (sodium citrate, lactic acid), complex accelerator (succinic acid, propionic acid) and buffer (boric acid) under constant stirring...

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Abstract

The invention relates to material surface chemical plating, and concretely relates to a solution for realizing the rapid plating of Ni-Co-P on the surface of a low carbon steel substrate under medium-low temperature conditions, and a method thereof. The solution and the method have the advantages of helpfulness for the energy consumption reduction, apparatus investment reduction, plating solution evaporation amount reduction, easy maintenance, less energy consumption, environmental pollution reduction, labor environment condition improvement and operator safety protection; and the obtained plated layer has an improved heat stability, and the hardness of the plated layer is close to that of a high-temperature chemically-plated Ni-P layer.

Description

technical field [0001] The invention relates to chemical plating on the surface of materials, in particular to a solution and a method for quickly plating Ni-Co-P on the surface of a low-carbon steel base material under medium and low temperature conditions. Background technique [0002] The performance of the multi-element alloy coating is better than that of a single nickel-phosphorus coating. Since cobalt has the same self-catalysis properties as nickel, cobalt ions can be introduced on the basis of Ni-P alloy to form a Ni-Co-P ternary alloy coating. Compared with Ni-P coating, Ni-Co-P alloy coating can refine the crystallization and increase the anisotropy of magnetic particles, and is mainly used in various magnetic recording systems. With the high functionalization of computers and electronic communication equipment, the miniaturization, high performance and high frequency of magnetic devices are required, so the requirements for the characteristics of the magnetic mat...

Claims

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Application Information

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IPC IPC(8): C23C18/50
Inventor 孙华马洪芳冯立明郭晓斐王玥蔡元兴
Owner SHANDONG JIANZHU UNIV
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