Method for manufacturing and repairing conducting circuits on surfaces of ceramic substrates

A technology of ceramic substrates and conductive circuits, which is applied in the manufacture of printed circuits, the improvement of the metal adhesion of insulating substrates, printed circuits, etc., can solve the problems of low graphic accuracy, difficult industrial application, low degree of flexibility, etc., and achieve repeatability and The effect of high quality stability, large-format three-dimensional processing, and high degree of flexibility

Active Publication Date: 2014-05-07
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage of this type of method is that the process is simple and does not require large-scale equipment, but there are three disadvantages: first, the metal paste needs to be sintered at high temperature to form a good combination with the ceramic substrate, which is a high energy-consuming industry; second, it needs to use screen printing metal paste Third, it belongs to the thick film conductive circuit manufacturing process, which must use a mask plate, which has a low degree of flexibility, and it is difficult to make conductive circuits on the surface of three-dimensional ceramic substrates, and it is difficult to complete conductive circuits. repair
The silver nitrate precursor used is easy to decompose when exposed to light, so it must be oper

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  • Method for manufacturing and repairing conducting circuits on surfaces of ceramic substrates
  • Method for manufacturing and repairing conducting circuits on surfaces of ceramic substrates
  • Method for manufacturing and repairing conducting circuits on surfaces of ceramic substrates

Examples

Experimental program
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Effect test

Embodiment 1

[0045] The whole 99% alumina ceramic sheet was soaked in an aqueous solution containing 0.1 mol / L nickel ions, the soaking temperature was room temperature, and the soaking time was 5 minutes, and then it was taken out and dried. After that, the 99% alumina ceramic sheet was fixed on the table of the three-axis CNC machine tool, and the pulse CO with the maximum output power of 100W was used. 2 The laser and laser scanning galvanometer scan the surface of the substrate according to the 1.2mm×23mm rectangular electrode pattern designed and generated by the CAD software. The laser power is 20W, the pulse frequency is 5KHz, the scanning speed is 600mm / s, the width of the single scanning line is 100μm, and the spacing between the scanning lines is 100 μm. 100μm (at this time, the laser power density is 2.55×10 5 W / cm 2 ). Next, the substrate was ultrasonically cleaned in deionized water to remove nickel ions from the surface of the non-laser treated areas. After that, the above...

Embodiment 2

[0047] An aqueous solution containing 0.5 mol / L palladium ion and palladium ammine ion was coated on the position of the designed circuit pattern on the surface of 96% alumina ceramic, and dried. Afterwards, the 96% alumina ceramic was fixed on the table of the three-axis linkage CNC machine tool, and the surface of the substrate was scanned according to the circuit pattern generated by the CAD software using a continuous fiber laser with a maximum output power of 20W and a wavelength of 1064nm and a laser scanning galvanometer. The laser power is 10w, the scanning speed is 200mm / s, the width of the single scanning line is 20μm, and the spacing between the scanning lines is 20μm (at this time, the laser power density is 3.18×10 6 W / cm 2 ). Next, the substrate is placed in deionized water and ultrasonically cleaned to remove palladium ions and palladium ammonia ions on the surface of the untreated area. After that, the above-mentioned substrate was put into an electroless pla...

Embodiment 3

[0049] The ring-shaped strontium titanate ceramic was soaked in an aqueous solution of 0.3 mol / L iron ions, the soaking temperature was room temperature, and the soaking time was 5 minutes, and then it was taken out and dried. Then, the ring-shaped strontium titanate ceramic was fixed on the table of the three-axis CNC machine tool, and the pulsed Nd:YVO with the maximum output power of 10W and the wavelength of 355nm was used. 4 The laser and laser scanning galvanometer scan the surface of the substrate according to the circuit pattern generated by the CAD software. The laser power is 3W, the scanning speed is 800mm / s, the width of the single scanning line is 10μm, and the spacing between the scanning lines is 10μm (the power density of the laser is 3.82 at this time). ×10 6 W / cm 2 ). The substrate is next cleaned to remove iron ions from the surface of the unlasered areas. After that, the above-mentioned substrate was put into an electroless plating solution for electrole...

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Abstract

The invention aims at providing a universal method for manufacturing and repairing electric circuits on the surfaces of two-dimensional or three-dimensional ceramic materials. The universal method includes the steps that the surfaces of the ceramic materials which are covered with ions or complex-ions of specific metal in advance are processed through laser beams according to pre-designed circuit patterns, then chemical plating is implemented, and then the required conducting circuits can be obtained. According to the technology, the various complex conducting circuits can be rapidly and directly manufactured or repaired on the surfaces of various ceramic substrates including the planar ceramic substrates and the three-dimensional ceramic substrates, and the universal method has no special requirements for the materials of the substrates, does not need vacuum, and is low in cost and high in flexibility degree and efficiency. The obtained conducting circuits are even and compact in surface, free of cracks and good in conductivity and combining force, and therefore the universal method has the universality.

Description

technical field [0001] The invention belongs to the technical field of fabrication and repair of conductive lines and the field of laser surface treatment, and relates to a general method for fabricating and repairing conductive lines on the surface of two-dimensional or three-dimensional ceramic materials. Specifically, laser surface treatment technology and electroless plating technology are combined for the fabrication and repair of conductive lines on the surface of two-dimensional or three-dimensional ceramic materials. Background technique [0002] In recent years, with the continuous development of electronic and electrical products in the direction of digitization, light weight, small batch, flexibility, multi-function, and low energy consumption, the problem of reliability has become more and more prominent. Ceramic materials have been widely used in power electronics, hybrid microelectronics and multi-chip modules due to their excellent thermal conductivity, air ti...

Claims

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Application Information

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IPC IPC(8): H05K3/20H05K3/38
Inventor 吕铭刘建国曾晓雁
Owner HUAZHONG UNIV OF SCI & TECH
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