Method for manufacturing and repairing conducting circuits on surfaces of ceramic substrates

Abstract

The invention aims at providing a universal method for manufacturing and repairing electric circuits on the surfaces of two-dimensional or three-dimensional ceramic materials. The universal method includes the steps that the surfaces of the ceramic materials which are covered with ions or complex-ions of specific metal in advance are processed through laser beams according to pre-designed circuit patterns, then chemical plating is implemented, and then the required conducting circuits can be obtained. According to the technology, the various complex conducting circuits can be rapidly and directly manufactured or repaired on the surfaces of various ceramic substrates including the planar ceramic substrates and the three-dimensional ceramic substrates, and the universal method has no special requirements for the materials of the substrates, does not need vacuum, and is low in cost and high in flexibility degree and efficiency. The obtained conducting circuits are even and compact in surface, free of cracks and good in conductivity and combining force, and therefore the universal method has the universality.

Description

technical field [0001] The invention belongs to the technical field of fabrication and repair of conductive lines and the field of laser surface treatment, and relates to a general method for fabricating and repairing conductive lines on the surface of two-dimensional or three-dimensional ceramic materials. Specifically, laser surface treatment technology and electroless plating technology are combined for the fabrication and repair of conductive lines on the surface of two-dimensional or three-dimensional ceramic materials. Background technique [0002] In recent years, with the continuous development of electronic and electrical products in the direction of digitization, light weight, small batch, flexibility, multi-function, and low energy consumption, the problem of reliability has become more and more prominent. Ceramic materials have been widely used in power electronics, hybrid microelectronics and multi-chip modules due to their excellent thermal conductivity, air ti...

AI Technical Summary

Problems solved by technology

The advantage of this type of method is that the process is simple and does not require large-scale equipment, but there are three disadvantages: first, the metal paste needs to be sintered at high temperature to form a good combination with the ceramic substrate, which is a high energy-consuming industry; second, it needs to use screen printing metal paste Third, it belongs to the thick film conductive circuit manufacturing process, which must use a mask plate, which has a low degree of flexibility, and it is difficult to make conductive circuits on the surface of three-dimensional ceramic substrates, and it is difficult to complete conductive circuits. repair

The silver nitrate precursor used is easy to decompose when exposed to light, so it must be operated in a dark environment

And femtosecond laser equipment is expensive, low processing efficiency, poor stability, high maintenance costs and other characteristics limit the scope of application of this technology

[0012] At present, the manufacturing process of circuit boards has become a bottleneck restricting the rapid development of electronic manufacturing technology. Traditional manufacturing technologies require mask plates, which have a low degree of flexibility. It is difficult to realize the production of conductive lines on three-dimensional curved surfaces, and it is impossible to complete the repair of conductive lines. However, the highly flexible laser processing technology is difficult to achieve industrial application due to various problems.

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