High-strength PCB conductive silver paste and preparing method thereof

Abstract

High-strength PCB conductive silver paste is prepared from, by weight, 10 parts to 20 parts of antimony tin oxide, 2 parts to 4 parts of calcium sulphate whisker, 50 parts to 60 parts of micron-order silver powder, 4 parts to 6 parts of tantalum carbide whisker, 1 part to 2 parts of methenamine, 7 parts to 10 parts of glass powder, 1 part to 2 parts of isopropyl tri(dioctylpyrophosphate)titanate, 8 parts to 12 parts of E-12 epoxy resin, 2 parts to 3 parts of isocyanate, 3 parts to 5 parts of diethylene glycol, 5 parts to 7 parts of glyceryl triacetate, 1 part to 2 parts of itaconic acid and 4 parts to 6 parts of terpineol. According to the silver paste, by adding the calcium sulphate whisker and the tantalum carbide whisker, the strength of a printed circuit is increased, and the printed circuit is not prone to falling off and being broken; by adding the antimony tin oxide, the using amount of the silver powder is reduced while the excellent conductivity is guaranteed, and the prepared silver paste is low in cost, excellent in conductivity and good in dispersibility; by using the glass powder, the high-strength PCB conductive silver paste is low in melting point and can be formed easily through curing, and the conductivity is not influenced.

Description

Technical field [0001] The invention belongs to the technical field of electronic pastes, and in particular relates to a high-strength PCB circuit board conductive silver paste and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people's requirements for electronic components are getting higher and higher, and production is mostly carried out by process and standardization to reduce costs. Printed circuit boards (PCB) are born to meet the needs of the microelectronics industry. Correspondingly, electronic pastes such as conductive paste, electrode paste, dielectric paste, resistance paste, and grouting paste are required to match the printed circuit board (PCB) with new requirements, and conduct research on new conductive pastes It is imperative. [0003] Generally speaking, the main components of electronic pastes include functional phases such as metals and precious metal powders, inorganic binders such as glass powders, oxide...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance