High-temperature semiconductor solid crystal solder paste and preparation method thereof

A semiconductor and die-bonding technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of high thermal expansion coefficient, low welding strength, poor wettability, etc., achieve good wettability, low porosity, meet The effect of multiple reflows

Inactive Publication Date: 2014-10-22
SHANGHAI PLUS NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to overcome the technical problems of high coefficient of thermal expansion, poor wettability to gold-plated, silver-plated and nickel-plated devices, low welding strength and high void rate in the prior art, the inventor has completed a large number of in-depth researches. this invention

Method used

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  • High-temperature semiconductor solid crystal solder paste and preparation method thereof
  • High-temperature semiconductor solid crystal solder paste and preparation method thereof

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Embodiment 1

[0029] This embodiment relates to the preparation of a high-temperature semiconductor die-bonding solder paste, comprising the following steps:

[0030] Step (1), preparation of solder paste

[0031] Take the following components by weight percentage: 35% polymerized rosin resin, 6% malonic acid, 4.5% hydrogenated castor oil, 1.5% methylamine, 3.5% pentaerythritol 2-hexyldecanoate, 1.5% antioxidant BHT, Organosilane coupling agent KH-5502%, the rest of diethylene glycol octyl ether, then mix the above components evenly, heat until completely dissolved, then cool naturally to room temperature, and then refrigerate the composition at 5°C get solder paste;

[0032] Step (2), preparation of solder paste

[0033] Select the PbInAg spherical metal alloy powder whose weight percentage is Pb:In:Ag=92.5:5:2.5, the particle size is 29 μm, and the spherical rate is 98%, according to the weight percentage of PbInAg spherical metal alloy powder and solder paste 87:13 , put the two in a ...

Embodiment 2

[0035] This embodiment relates to the preparation of a high-temperature semiconductor die-bonding solder paste, comprising the following steps:

[0036] Step (1), preparation of solder paste

[0037] Weigh the following components by weight percentage: 30% hydrogenated rosin resin, 5% succinic acid, 5% ethylene bis stearamide, 1% trimethylamine, 3.5% decyl myristate, 2% antioxidant DLTP, organic Silane coupling agent KH-5601%, the balance of diethylene glycol hexyl ether, and then mix the above components evenly, heat until completely dissolved, then naturally cool to room temperature, and then refrigerate the composition at 2°C to prepare solder paste;

[0038] Step (2), preparation of solder paste

[0039] Select the PbInAg spherical metal alloy powder whose weight percentage is Pb:In:Ag=92.5:5:2.5, the particle size is 25 μm, and the spherical rate is 99%, according to the weight percentage of PbInAg spherical metal alloy powder and solder paste 82:18 , put the two in a ...

Embodiment 3

[0041] This embodiment relates to the preparation of a high-temperature semiconductor die-bonding solder paste, comprising the following steps:

[0042] Step (1), preparation of solder paste

[0043] Weigh the following components by weight percentage: petroleum modified resin 32%, adipic acid 6%, polyamide resin 4%, aniline 1.5%, rosin alcohol ether surfactant 4%, antioxidant 10101%, organosilane Joint agent KH-5702%, the rest of 2-ethyl-1,3-hexanediol, and then mix the above components evenly, heat until completely dissolved and then cool to room temperature naturally, then put the composition at 3°C Refrigerate to prepare solder paste;

[0044] Step (2), preparation of solder paste

[0045] Select the PbInAg spherical metal alloy powder whose weight percentage is Pb:In:Ag=92.5:5:2.5, the particle size is 35 μm, and the spherical rate is 95%, according to the weight percentage of PbInAg spherical metal alloy powder and solder paste 91:9 , put the two in a disperser and stir...

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Abstract

The invention relates to a high-temperature semiconductor solid crystal solder paste and a preparation method of the high-temperature semiconductor solid crystal solder paste. The high-temperature semiconductor solid crystal solder paste is composed of soldering flux and lead silver indium alloy powder, wherein the weight percent of the soldering flux is (9-18):(82-99) and the lead silver indium alloy powder is evenly distributed in the soldering flux, and the lead silver indium alloy powder is PbInAg spherical metal alloyed powder with the particle size ranging from 20 micrometers to 38 micrometers. The preparation method includes the following steps that (1) all components of the soldering flux are evenly mixed according to the selected proportion, are heated till the mixture is fully dissolved and then naturally cooled to the room temperature; (2) the composition obtained in the step (1) is refrigerated at the temperature ranging from 2 DEG C to 8 DEG C to obtain the soldering flux ; (3) the lead silver indium alloy powder and the soldering flux are put into a disperser to be stirred evenly, and the high-temperature semiconductor solid crystal solder paste is obtained. The high-temperature semiconductor solid crystal solder paste is extremely low in thermal expansion coefficient, easy to prepare, good in performance of wetting the welded layer, extremely low in porosity, excellent in welding strength and capable of meeting the requirement for multiple times of backflow.

Description

technical field [0001] The invention belongs to the technical field of soldering materials for semiconductor power device packaging, and more specifically relates to a high-temperature semiconductor crystal-bonding solder paste and a preparation method thereof. Background technique [0002] At present, solder paste is widely used in high-precision electronic components. Semiconductor power devices, LED packages, high-density integrated circuit packages and some precision integrated circuit assemblies that work at high temperature require the second or even third reflow soldering process. Solder paste with high lead content is used for soldering, mainly including 92.5Pb / 5Sn / 2.5Ag, 95.5Pb / 2Sn / 2.5Ag, Sn10 / Pb88 / Ag2, Sn5 / Pb95, Sn5 / Pb85 / Sb10 and other alloys. [0003] For example, CN102785039A (published on November 21, 2012) discloses a solder paste, which consists of 100% of the following raw materials in mass percentage: solder powder 87%-91%, flux 9%-13%; Wherein, the binary ...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/363B23K35/40
CPCB23K35/268B23K35/3613B23K35/362
Inventor 芮俊峰董勤正符实
Owner SHANGHAI PLUS NEW MATERIAL TECH CO LTD
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