Preparation method of carbon-clad copper electronic paste

A technology of copper electronic paste and carbon coating, which is applied in the direction of cable/conductor manufacturing, circuit, electrical components, etc., can solve the problems of affecting the life of electronic components, reducing the conductivity of conductive paste, limiting the scope of application, etc., reaching the price Low cost, low equipment requirements, and the effect of reducing production costs

Inactive Publication Date: 2015-02-18
XI'AN POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, among the precious metal electronic pastes, silver paste is widely used, and its electrical and thermal conductivity is stable, but the expensive price limits its application scope, and Ag + It has migration phenomenon, which will reduce the conductivity of the conductive paste, thereby affecting the life of electronic components
[0005] The cost of base metal conductive paste is relatively low. In China, copper, nickel, and aluminum are mainly used to

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0037] The preparation method of the carbon-coated copper electronic paste of the present invention is specifically implemented according to the following steps:

[0038] Step 1. First mix formaldehyde and micron copper powder to prepare mixed solvent A, then use a constant temperature magnetic stirrer to heat mixed solvent A, and keep stirring mixed solvent A until the supernatant turns black, then pour it out after standing Clear liquid, leave sediment, dry after washing sediment with deionized water finally, prepare pretreatment copper powder, specifically implement according to the following steps:

[0039] Step 1.1, weigh formaldehyde and micron copper powder respectively according to the mass ratio of 2-5:1-3;

[0040] Step 1.2, mixing the formaldehyde weighed in step 1.1 with micron copper powder to obtain mixed solvent A;

[0041] Step 1.3. Use a constant temperature magnetic stirrer to heat the mixed solvent A obtained in step 1.2 to 60 ° C ~ 80 ° C, and keep stirrin...

Embodiment 1

[0055] Weigh formaldehyde and micron copper powder according to the mass ratio of 2:1, mix the weighed formaldehyde and micron copper powder to obtain mixed solvent A, use a constant temperature magnetic stirrer to heat mixed solvent A to 80 ° C, during the heating process Stir the mixed solvent A continuously in the medium until the supernatant turns black, pour off the supernatant after standing for 10min, and obtain a precipitate; wash the obtained precipitate with deionized water for 3 times and then put it into a vacuum oven. Adjust the drying temperature to 100°C and the drying time to 120 minutes to prepare pretreated copper powder;

[0056] Weigh glucose and pretreated copper powder respectively according to the mass ratio of 1:2, mix the weighed glucose and pretreated copper powder to prepare mixed solvent B, place mixed solvent B in a vacuum furnace, and heat up the vacuum furnace to After holding at 450°C for 60 minutes, carbon-coated copper powder was obtained;

...

Embodiment 2

[0060] Weigh formaldehyde and micron copper powder according to the mass ratio of 3:2, mix the weighed formaldehyde and micron copper powder to obtain mixed solvent A; use a constant temperature magnetic stirrer to heat mixed solvent A to 75 ° C, during the heating process Stir the mixed solvent A in the medium until the supernatant turns black, pour off the supernatant after standing for 15min, and obtain a precipitate; wash the obtained precipitate with deionized water for 3 times and put it in a vacuum oven. Adjust the drying temperature to 90°C and the drying time to 140 minutes to prepare pretreated copper powder;

[0061] Weigh glucose and pretreated copper powder respectively according to the mass ratio of 1.5:4, mix the weighed glucose / copper powder with pretreated to prepare mixed solvent B, place mixed solvent B in a vacuum furnace, and heat up the vacuum furnace After reaching 400°C, keep it warm for 80 minutes to obtain carbon-coated copper powder;

[0062] The vo...

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PUM

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Abstract

The invention discloses a preparation method of carbon-clad copper electronic paste. The preparation method includes: mixing formaldehyde and micron copper powder into mixed solvent A, heating and stirring nonstop the mixed solvent A with a magnetic sitter till supernate is black, pouring the supernate after standing, performing washing with deionized water, and performing drying to obtain pretreated copper powder; mixing glucose/saccharose and the pretreated copper powder to obtain mixed solvent B, and treating the mixed solvent B to obtain carbon-clad copper powder; mixing terpilenol, ethyl cellulose, ethyl acetate, polyether defoamer, silane coupling agent and sorbitan trioleate into mixed solution, and heating the mixed solution to obtain organic carrier; mixing glass powder, the carbon-clad copper powder and the organic carrier into the carbon-clad copper electronic paste. The preparation method has the advantages that production cost is effectively lowered since no special equipment for production is required, and the prepared carbon-clad copper electronic paste has excellent conductivity and has long shelf life.

Description

technical field [0001] The invention belongs to the technical field of preparation methods of electronic packaging materials, and in particular relates to a preparation method of carbon-coated copper electronic paste. Background technique [0002] In recent years, with the rapid development of electronic industry integration and digitalization, electronic paste has been widely used in modern technical fields such as aviation, aerospace and electronic components. People not only require the electronic paste to be particularly small in resistance, but also have particularly high requirements on the stability of the electronic paste. [0003] Generally, electronic pastes can be divided into noble metal conductive pastes and base metal conductive pastes according to different conductive phases. [0004] At present, among the precious metal electronic pastes, silver paste is widely used, and its electrical and thermal conductivity is stable, but its expensive price limits its sc...

Claims

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Application Information

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IPC IPC(8): H01B13/00
Inventor 苏晓磊王艳萍贾艳王俊勃屈银虎贺辛亥徐洁付翀刘松涛
Owner XI'AN POLYTECHNIC UNIVERSITY
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