Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of porous copper full-impregnated film of three-dimensional network structure

A technology of network structure and porous copper, which is applied in the field of preparation of three-dimensional network structure porous copper full-permeable membrane, can solve the problems of inability to peel off the three-dimensional network structure of metal copper membrane, low bonding strength, loose metal membrane structure, etc. Toughness, good filtration separation, uniform pore size effect

Inactive Publication Date: 2015-08-05
TONGJI UNIV
View PDF12 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the problem of additives, the bonding strength between the apertures is low, which leads to the loose structure of the metal film.
Tang Yong et al. (a micro-nano composite porous copper surface structure and its preparation method and device, Chinese invention patent, CNIO3046088A, 2013.04.17) also used hydrogen bubbles as a dynamic template to prepare three-dimensional porous copper, but the product was based on copper. As a result, the metal copper film with a complete three-dimensional network structure cannot be peeled off, so its essence is only a surface structure based on copper, not a real metal film

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of porous copper full-impregnated film of three-dimensional network structure
  • Preparation method of porous copper full-impregnated film of three-dimensional network structure
  • Preparation method of porous copper full-impregnated film of three-dimensional network structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] After mixing the basic plating solution with the additives, stir the electrolyte with a magnetic stirrer to make it uniformly mixed. The additive is 5mmol / LNH 4 Cl, 0g / L polyethylene glycol, appropriate amount of saccharin sodium (C 7 H 4 0 3 NSNaH 2 0) And buffering agent boric acid. The cathode aluminum foil is sequentially put into acetone and absolute ethanol for ultrasonic cleaning to complete the degreasing treatment. Then put it in 10%wt NaOH solution and soak for 15min to remove the oxide layer on the surface of the aluminum foil, and finally polish by electrochemical method. The electrolyte is made of absolute ethanol and perchloric acid in a volume ratio of 4:1, with graphite as the cathode. , The aluminum foil is the anode, polished 15min under 20V voltage. After the preliminary work is completed, put the cathode and anode into the electrolytic cell, ensure that the aluminum foil is on the bottom and the graphite is on the top and the two are parallel and oppo...

Embodiment 2

[0025] After mixing the basic plating solution with the additives, stir the electrolyte with a magnetic stirrer to make it uniformly mixed. The additive is 10mmol / LNH 4 Cl, 1g / L polyethylene glycol additive, appropriate amount of saccharin sodium (C 7 H 4 0 3 NSNaH 2 0) And buffering agent boric acid. The electrode was pretreated as in Example 1 and the preparations before electrochemical deposition were completed. The current density in the control loop of the electrochemical workstation is 2A / cm 2 , The deposition time is 30s. After the deposition is completed, take out the aluminum foil, rinse with deionized water and ethanol 3-4 times, and then dry with nitrogen to prepare for the subsequent annealing treatment. First, control the heating rate to 5°C / min to increase the temperature to 300°C, and then keep the temperature at 300°C for 30 minutes to eliminate the internal stress generated during the heating process. After that, continue to heat up to 400℃ for 60 minutes and t...

Embodiment 3

[0027] After mixing the basic plating solution with the additives, stir the electrolyte with a magnetic stirrer to make it uniformly mixed. The additive is 10mmol / LNH 4 Cl, 2g / L polyethylene glycol additive, appropriate amount of saccharin sodium (C 7 H 4 0 3 NSNaH 2 0) And buffering agent boric acid. The electrode was pretreated as in Example 1 and the preparations before electrochemical deposition were completed. The current density in the control loop of the electrochemical workstation is 2.5A / cm2, and the deposition time is 40s. After the deposition is completed, the aluminum foil is taken out, rinsed with deionized water and ethanol 3-4 times, and then dried with nitrogen to prepare for the subsequent annealing treatment. Control the heating rate to 5°C / min to increase the temperature to 300°C, and then keep it at 300°C for 30 minutes to eliminate the internal stress generated during the heating process. After that, continue to heat up to 500℃ for 60 minutes and then cool ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a preparation method of a porous copper full-impregnated film of a three-dimensional network structure. The method comprises the following steps that (1), a basic plating solution is prepared, wherein the basic plating solution comprises 1.0mol / L of H2SO4 and 0.2mol / L of CuSO4; (2), electrochemical deposition is carried out, wherein in a depositing cell, a graphite sheet serves as a positive electrode, aluminum foil serves as a negative electrode, the basic plating solution serves as electrolytes, and an electrochemistry working station is used for carrying out constant-current density electrolytic deposition to form the porous copper film on the aluminum foil; (3), vacuum annealing treatment is carried out on the porous copper film on the aluminum foil; (4), an aluminum substrate is removed, wherein aluminum foil obtained after vacuum annealing treatment is placed in alkali liquor to have a reaction, the aluminum foil is removed, and the porous copper full-impregnated film of the three-dimensional network structure is obtained. Compared with the prior art, the porous copper full-impregnated film of the three-dimensional network structure is even in bore diameter and stable in structure and has the good filtering separation function, and meanwhile due to the large specific area, and the good toughness, the film can be used as a good catalyst carrier.

Description

Technical field [0001] The invention relates to a method for preparing porous copper, in particular to a method for preparing a porous copper fully permeable membrane with a three-dimensional network structure. Background technique [0002] In recent decades, porous membrane materials have played an increasingly important role in water purification, porous electrodes and reaction catalysis. In particular, porous metal membranes have excellent physical, chemical and mechanical properties, such as low specific gravity. , Large specific surface area, good energy absorption and other characteristics, and are widely used in many fields such as petrochemical industry, energy environmental protection, national defense and military industry. Compared with porous precious metal film systems, porous copper films undoubtedly have broader application prospects. At present, there are many traditional methods for preparing porous copper materials, such as track etching, powder metallurgy, dea...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D3/38C25D5/50
Inventor 陆伟牛俊超夏卡达
Owner TONGJI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com