Plating solution carrying out chemical palladium plating on copper surface and preparation method therefor

A copper surface and electroless plating technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problem of reducing copper wire balling, bonding performance and reliability, long plating time, cumbersome Eliminate issues such as sensitization and activation steps to achieve excellent bath stability, shorten induction time, and increase deposition rate

Inactive Publication Date: 2015-09-16
SHANGHAI INST OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the pollution and oxidation on the surface of the single crystal copper bonding wire lead to a decrease in soldering performance, and the oxide film reduces the ball forming, bonding performance and reliability of the copper wire. In order to prevent the oxidation of the copper wire and further improve the bonding performance, a certain Method Plating a layer of palladium film on the surface of copper wire is a better solution
[0003] The electroless palladium plating and electroplating palladium plating processes reported in the current literature and patents are relatively complicated, and the electroless palladium plating must go through cumbersome sensitization and activation steps, and requires a long pla...

Method used

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  • Plating solution carrying out chemical palladium plating on copper surface and preparation method therefor
  • Plating solution carrying out chemical palladium plating on copper surface and preparation method therefor
  • Plating solution carrying out chemical palladium plating on copper surface and preparation method therefor

Examples

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Effect test

Embodiment 1

[0051] A kind of plating solution that carries out electroless palladium plating on copper surface, by every liter, its raw material composition and content are as follows:

[0052] PdCl 2 1g

[0053]Concentrated ammonia water 80ml

[0054] NaH 2 PO 2 ·H 2 O 8g

[0055] NH 4 Cl 20g

[0056] Bismuth chloride 0mg

[0057] Isopropanolamine 15ml;

[0058] The balance is distilled water.

[0059] Above-mentioned a kind of preparation method of the plating solution that carries out electroless palladium plating on copper surface, step is as follows:

[0060] Add 20g of ammonium chloride and 15ml of isopropanolamine to 80ml of ammonia water to obtain an ammonia solution containing ammonium chloride and isopropanolamine, then slowly add 1g of palladium chloride under stirring, leave it for 24h, and then continue 8gNaH 2 PO 2 ·H 2 O is added therein slowly, then adds distilled water and is constant to 1L, obtains the plating solution that carries out elect...

Embodiment 2

[0081] A kind of plating solution that carries out electroless palladium plating on copper surface, by every liter, its raw material composition and content are as follows:

[0082] PdCl 2 2g

[0083] Concentrated ammonia water 160ml

[0084] NaH 2 PO 2 ·H 2 O 12g

[0085] NH 4 Cl 40g

[0086] Bismuth chloride 0mg

[0087] Isopropanolamine 25ml

[0088] The balance is distilled water.

[0089] Above-mentioned a kind of preparation method of the plating solution that carries out electroless palladium plating on copper surface, step is as follows:

[0090] Add 40g of ammonium chloride and 25ml of isopropanolamine to 160ml of ammonia water to obtain an ammonia solution containing ammonium chloride and isopropanolamine, then slowly add 2g of palladium chloride under stirring, leave it for 24h, and then continue 12gNaH 2 PO 2 ·H 2 O is added therein slowly, then adds distilled water and is constant to 1L, obtains the plating solution that carries out e...

Embodiment 3

[0111] A kind of plating solution that carries out electroless palladium plating on copper surface, by every liter, its raw material composition and content are as follows:

[0112] PdCl 2 3g

[0113] Concentrated ammonia water 180ml

[0114] NaH 2 PO 2 ·H 2 O 14g

[0115] NH 4 Cl 0g

[0116] Bismuth Chloride 65mg

[0117] Isopropanolamine 30ml;

[0118] The balance is distilled water.

[0119] Above-mentioned a kind of preparation method of the plating solution that carries out electroless palladium plating on copper surface, step is as follows:

[0120] Add 65mg of bismuth chloride and 30ml of isopropanolamine to 180ml of ammonia water to obtain an ammonia solution containing bismuth chloride and isopropanolamine, then slowly add 3g of palladium chloride under stirring conditions, leave it for 24h, and then continue to 14gNaH 2 PO 2 ·H 2 O is added therein slowly, then adds distilled water and is constant to 1L, obtains the plating solution that...

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Abstract

The invention discloses a plating solution carrying out chemical palladium plating on a copper surface and a preparation method therefor. A liter of the plating solution is composed of 1-5g of PdCl2, 60-200ml concentrated ammonia liquor, 2-20g of NaH2PO2.H2O, 0-40g of NH4Cl, 5-50ml of isopropanolamine and 0-100mg of bismuth chloride, the balance being distilled water. The preparation method is as follows: ammonium chloride, bismuth chloride and the isopropanolamine are added into concentrated ammonia liquor, then palladium chloride is added slowly with stirring, the mixture is allowed to stand for 24h, then NaH2PO2.H2O is added slowly with stirring, then distilled water is added, and a plating solution carrying out chemical palladium plating on a copper surface is obtained. The plating solution has a stable pH and excellent bath lotion stability, induction time and plating time are shortened, the deposition rate is raised, and the obtained plating is uniform, compact and smooth, and has no cracks or pores.

Description

technical field [0001] The invention relates to a plating solution for electroless palladium plating on a copper surface and a preparation method thereof, belonging to the metal surface treatment industry. Background technique [0002] In the field of electronics, copper is a very good conductive material. It is often used as the base material for circuit production. The application of copper wire bonding in the electronic packaging process also tends to replace gold wires as the price of gold wires rises. Large-scale packaging factories are increasing their Large investment in copper wire process. Compared with gold wire, copper wire has better electrical and mechanical properties, so the same product can use smaller diameter copper wire for bonding, and it is more suitable for small chip pads, narrow spacing and long bonding distance packaging products. However, the pollution and oxidation on the surface of the single crystal copper bonding wire lead to a decrease in sol...

Claims

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Application Information

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IPC IPC(8): C23C18/42
Inventor 万传云张甜甜何云庆
Owner SHANGHAI INST OF TECH
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