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Compound ionic liquid braunification liquid for printed-circuit boards

A technology of printed circuit boards and ionic liquids, which is applied in the secondary treatment of printed circuits, the improvement of the metal adhesion of insulating substrates, and the coating process of metal materials. problem, to achieve the effects of low toxicity, excellent heat resistance, and increased chemical bonding force

Active Publication Date: 2015-09-23
SOUTH CHINA UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the existing browning process can solve the problem of short circuit caused by multiple pressing and villi fractures, the browning film formed on the copper surface has poor heat resistance after being processed by such traditional browning process products and cannot withstand subsequent processes The necessary multiple times of strong thermal expansion and cold contraction compression treatment will lead to browning film denaturation

Method used

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  • Compound ionic liquid braunification liquid for printed-circuit boards
  • Compound ionic liquid braunification liquid for printed-circuit boards
  • Compound ionic liquid braunification liquid for printed-circuit boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The technical route of browning process is as follows:

[0030] Pickling→water washing→alkaline degreasing→water washing→presoaking→browning→pure water washing→drying→pressing

[0031] The specific operation of the above technical route is as follows:

[0032] (1) Pickling: use 3%-5% dilute sulfuric acid as the cleaning agent, and wash away other metal impurities loaded on the copper surface at 30°C;

[0033] (2) Water washing: wash repeatedly at room temperature with deionized water until the lotion is basically neutral;

[0034] (3) Alkaline degreasing: Use TS-Alkclean 6215 alkaline degreasing agent produced by Guangdong Dongshuo Technology Co., Ltd. to wash the above-mentioned PCB board after washing at 60°C. Its purpose is to effectively remove dry film photoresist residues, grease, fingerprints and other pollutants on the copper surface and remove the surface oxide layer to prepare for later browning;

[0035] (4) Washing: use deionized water to wash repeatedly ...

Embodiment 2

[0053] The difference between this embodiment and embodiment 1 is:

[0054] (1) A compound ionic liquid browning solution for printed circuit boards, whose raw materials consist of:

[0055] Ionic liquid acid: 1-methyl-4-propanesulfonic acid imidazolium sulfate ionic liquid 100g;

[0056] Hydrogen peroxide 10g;

[0057] Ionic liquid corrosion inhibitor 1‐methyl‐2‐(4‐ethylimidazole)‐4‐butylnitrobenzimidazole chloride salt 10g;

[0058] Ionic liquid binding force promoter 1-methyl-4-acetamido imidazolium chloride 1.0g;

[0059] The ingredients were mixed and diluted to 1 L with deionized water.

[0060] (2) The browning temperature is 30°C, and the browning time is 50s.

[0061] After testing, the density of the browning solution is 1.15g / mL; the pH value is 3.2; the copper loading can reach 52g / L, and the micro-etching rate of the copper surface is 55μin / min; and the copper surface can be evenly rough after browning treatment The surface has a stable bonding force and exce...

Embodiment 3

[0063] The difference between this embodiment and embodiment 1 is:

[0064] (1) A compound ionic liquid browning solution for printed circuit boards, whose raw materials consist of:

[0065] Ionic liquid acid: 1‐methyl‐4‐butanesulfonic acid imidazolium dihydrogen phosphate ionic liquid 90g;

[0066] Hydrogen peroxide 15g;

[0067] Ionic liquid corrosion inhibitor 1‐methyl‐2‐(4‐octylimidazole)‐4‐butyl p-toluimidazole chloride 15g;

[0068] Ionic liquid binding force promoter 1-methyl-4-acetamidoimidazolium bromide 2.5g;

[0069] The above mixture was diluted to 1 L with deionized water.

[0070] (2) The browning temperature is 40°C, and the browning time is 60s.

[0071] The research results show that the density of the browning solution is 1.35g / mL; the pH value is 3.8; the copper loading can reach 38g / L, and the micro-etching rate of the copper surface is 54μin / min; Rough surface, stable bonding force with prepreg and excellent heat resistance, under the condition of 288...

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Abstract

The invention discloses compound ionic liquid braunification liquid for printed-circuit boards. The braunification liquid comprises the following raw materials according to the mass concentrations in the braunification liquid: 70-120 g / L acidic functionalized ionic liquid, 5-20 g / L hydrogen peroxide, 5-15 g / L an ionic liquid corrosion inhibitor and 0.5-5 g / L ionic liquid binding force accelerant, wherein the acidic functionalized ionic liquid is imidazole functionalized ionic liquid with substituted sulfonic group with the side chain length of C2-C8 or substituted carboxylic group, pyridine functionalized ionic liquid or quaternary ammonium salt functionalized ionic liquid; the compound ionic liquid braunification liquid adopts sulfate radical, trifluoro sulfoacid radical and dihydrogen phosphate as negative ions; the density of the obtained braunification liquid is within 1-1.45 g / mL, the pH value is smaller than 4, and the copper loading capacity can reach up to 60 g / L; the braunification liquid has stable binding force with prepregs and good heat resistance, and has remarkable environment-friendly superiority due to the environment-friendly property and nonvolatility of the ionic liquid.

Description

technical field [0001] The invention relates to a browning treatment liquid, in particular to a browning treatment liquid for improving the bonding force between the copper surface of the inner layer and the prepreg during the production process of a printed circuit board (PCB) multilayer board; it belongs to the new Material development technology development and utilization field. Background technique [0002] With the continuous improvement of thinner and lighter requirements of electronic products, printed circuit board high-density interconnection technology (High Density Interconnect‐HDI) has aroused great interest, especially the use of Any‐layer HDI process to manufacture electronic products Market recognition and consumer welcome. HDI is one of the core technologies of printed circuits, which mainly uses micro-blind buried hole technology. The resulting high-density interconnect circuit board (HDI board) is a printed circuit board with a high circuit density distr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C22/02C23F1/18H05K3/38
Inventor 李雪辉龙金星刘彬云黄辉祥梁坤王芙蓉于英豪王乐夫
Owner SOUTH CHINA UNIV OF TECH
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