Photosensitive resin composition, protection film or insulation film, touch panel and method for manufacturing same

A photosensitive resin and composition technology, applied in the field of photosensitive resin composition, can solve the problems of material deterioration, substrate adhesion, chemical resistance reduction, etc., and achieve high hardness, adhesion and chemical resistance without reduction , good storage stability

Inactive Publication Date: 2015-12-02
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Furthermore, if the coating solution of the photosensitive transparent material is stored at room temperature, the material deteriorates during storage, and the adhesion to the substrate and chemical resistance decrease.

Method used

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  • Photosensitive resin composition, protection film or insulation film, touch panel and method for manufacturing same
  • Photosensitive resin composition, protection film or insulation film, touch panel and method for manufacturing same
  • Photosensitive resin composition, protection film or insulation film, touch panel and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0187] Hereinafter, although an Example and a comparative example are given and this invention is demonstrated more concretely, this invention is not limited to these ranges. In addition, when using the abbreviation in the compound used, the name is shown below.

[0188] AcOH: acetic acid

[0189] AD-TMP: ditrimethylolpropane tetraacrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.)

[0190] Al-A: Aluminum chelate compound A (manufactured by Kawaken Fine Chemical Co., Ltd.; tris(acetylacetonato)aluminum(III))

[0191] BDG: Butyl diethylene glycol, diethylene glycol mono-n-butyl ether

[0192] BYK-333: Silicone-based surfactant (manufactured by Bick Chemical Japan Co., Ltd.)

[0193] DAA: diacetone alcohol

[0194] DMSO: Dimethylsulfoxide

[0195] DPHA: KAYARAD (registered trademark) DPHA (manufactured by Nippon Kayaku Co., Ltd.; dipentaerythritol hexaacrylate)

[0196] EtOH: ethanol

[0197] HCl: hydrochloric acid

[0198] HNO 3 : nitric acid

[0199]...

Synthetic example 1

[0232] Synthesis example 1 Synthesis of acrylic resin solution (A-01)

[0233] 0.821 g (1 mol%) of 2,2'-azobis(isobutyronitrile) and 34.64 g of PGMEA were added to the flask. Next, add 26.43g (30mol%) of benzyl methacrylate, 21.52g (50mol%) of methacrylic acid, tricyclo[5.2.1.0 2,6 ] Decane-8-yl ester 22.03g (20mol%), stirred at room temperature for a while, and after the inside of the flask was fully replaced with nitrogen by bubbling, heated and stirred at 70°C for 5 hours. Next, 14.22 g (20 mol%) of glycidyl methacrylate, 0.676 g (1 mol%) of dimethylbenzylamine, 0.186 g (0.3 mol%) of 4-methoxyphenol, and PGMEA70 were added to the resulting solution. .33 g, heated and stirred at 90° C. for 4 hours to obtain an acrylic resin solution (A-01). PGMEA was added to the obtained acrylic resin solution (A-01) so that the solid content concentration might be 35% by weight. The Mw of the acrylic resin was 30,000, the carboxylic acid equivalent was 480, and the double bond equivalen...

Synthetic example 10

[0250] Synthesis example 10 Synthesis of acrylic resin solution (A-10)

[0251] Using 2,2'-azobis(isobutyronitrile) 0.821g (1mol%), PGMEA35.27g, methacrylic acid 13.77g (32mol%), methacrylic acid tricyclo[5.2.1.0 2,6 ]decane-8-yl ester 41.86g (38mol%), styrene 15.62g (30mol%), glycidyl methacrylate 1.42g (2mol%), dimethyl benzylamine 0.676g (1mol%), 0.186 g (0.3 mol%) of 4-methoxyphenol and 71.61 g of PGMEA were superposed|polymerized similarly to the synthesis example 1, and the acrylic resin solution (A-10) was obtained. PGMEA was added to the obtained acrylic resin solution (A-10) so that the solid content concentration would be 35% by weight. The Mw of the acrylic resin was 13,000, the carboxylic acid equivalent was 490, and the double bond equivalent was 6,580.

[0252] Synthesis Example 11 Synthesis of Acrylic Resin Solution (A-11)

[0253] 0.821 g (1 mol%) of 2,2'-azobis(isobutyronitrile) and 27.36 g of PGMEA were added to the flask. Next, add methacrylic acid 21.52...

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Abstract

The purpose of the present invention is to provide an alkali developable photosensitive resin composition which has multiple performances, i.e., being capable of providing a cured film that has high hardness, high transparency, high resistance to moist heat, high adhesiveness and high chemical resistance, and, when stored in the form of a coating solution, showing high storage stability and the adhesiveness and chemical resistance thereof not being deteriorated during storage. Provided is a photosensitive resin composition comprising: an alkali-soluble resin (A); a metal chelate compound (D); and a silane compound (E), wherein the alkali soluble resin (A) is an alkali soluble resin having a double bond equivalent within a specific range, the metal chelate compound (D) is a compound having a specific structure, and the silane compound (E) is a tetrafunctional silane or silane oligomer having a specific structure.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a protective film or an insulating film, a touch panel, and a method for producing the same. Background technique [0002] In recent years, with the spread of smartphones and tablet terminals, capacitive touch panels have attracted attention. In general, the sensor substrate of the capacitive touch panel has the following structure: ITO (Indium Tin Oxide, Indium Tin Oxide) and metal (silver, molybdenum, or aluminum, etc.) Intersections of the lines have an insulating film and a protective film for protecting ITO and metal. Generally speaking, the protective film is made of high hardness inorganic SiO 2 or SiN x , or a photosensitive transparent material (Patent Document 1), and the insulating film is often formed of a photosensitive transparent material. However, inorganic materials have the following problems: SiO 2 、SiN x It is formed by high-temperature film formation by CVD ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/038C08F290/00G03F7/004G03F7/075G06F3/041
CPCC08F290/00C08F230/08C08F2230/085G02B1/04G02B1/14G03F7/004G03F7/038G03F7/075G06F3/041G03F7/0388G03F7/0755G06F2203/04103C08F230/085C08L33/10C08L33/08C08F220/06C08F220/1807C08F220/1818C08F220/325C08F212/08
Inventor 谷垣勇刚藤原健典
Owner TORAY IND INC
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