Plasma-assisted glass or quartz chip microstructure alignment and pre-bonding method

A plasma and pre-bonding technology, applied in the fields of chip micromachining and bonding, glass or quartz chip microstructure alignment and pre-bonding, can solve the problems of increasing the difficulty of the alignment process, reducing the success rate, etc. The full use of resources, the solution is easy to fit, and the effect of ensuring safety

Active Publication Date: 2015-12-16
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the substrate and cover sheet cleaned by Piranha solution are very easy to fit, which increases the difficulty of the alignment process and reduces the success rate

Method used

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  • Plasma-assisted glass or quartz chip microstructure alignment and pre-bonding method
  • Plasma-assisted glass or quartz chip microstructure alignment and pre-bonding method
  • Plasma-assisted glass or quartz chip microstructure alignment and pre-bonding method

Examples

Experimental program
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Effect test

Embodiment 1

[0030] S1 Plasma Assisted Microstructure Alignment and Pre-bonding of Sodium Glass Substrate Chips:

[0031] 1) After wet etching, first use acetone to dissolve the photoresist on the surface of the 2.3mm thick sodium glass substrate, then use isopropanol to wash away the excess acetone, and after fully cleaning with a large amount of water, put the glass substrate into the Complete chromium removal is carried out in the chromium removal solution composed of ammonium cerium nitrate, acetic acid and ultrapure water.

[0032] 2) Fully clean the soda glass substrate and cover slip treated in step 1) with detergent, and use a large amount of ultrapure water to clean to remove organic matter, solid particles and dust on the surface.

[0033] 3) After drying most of the water with a high-pressure air gun, use air to stimulate plasma, and perform surface cleaning and activation in a plasma cleaner for 3-10 minutes to form a highly hydrophilic surface. The instrument used is a plasma...

Embodiment 2

[0043] S1 Plasma-assisted microstructure alignment and pre-bonding of boron glass chips:

[0044] 1) After wet etching, use acetone to dissolve the photoresist on the surface of the boron glass substrate with a thickness of 1.1 mm, then use isopropanol to wash away excess acetone, and after fully cleaning with a large amount of water, put the boron glass substrate into Complete chromium removal is carried out in a chromium removal solution composed of cerium ammonium nitrate, acetic acid and ultrapure water.

[0045] 2) Fully clean the boron glass substrate and cover sheet treated in step 1) with detergent, and use a large amount of ultrapure water to clean and remove organic matter, solid particles and dust on the surface.

[0046] 3) After drying most of the water with a high-pressure air gun, use air to stimulate plasma, and perform surface cleaning and activation in a plasma cleaner for 3-10 minutes to form a highly hydrophilic surface. The instrument used is a plasma cle...

Embodiment 3

[0055] S1 Plasma Assisted Microstructure Alignment and Pre-bonding of Quartz Chips:

[0056] 1) After wet etching, first use acetone to dissolve the photoresist on the surface of the 1.1mm thick quartz substrate, then use isopropanol to wash away the excess acetone, and after fully cleaning with a large amount of water, put the quartz substrate into the nitric acid The chromium removal is completely carried out in the chromium removal solution composed of ammonium cerium, acetic acid and ultrapure water.

[0057] 2) Fully clean the quartz substrate and cover sheet treated in step 1) with detergent, and use a large amount of ultrapure water to clean and remove organic matter, solid particles and dust on the surface.

[0058] 3) After drying most of the water with a high-pressure air gun, use air to stimulate plasma, and perform surface cleaning and activation in a plasma cleaner for 3-10 minutes to form a highly hydrophilic surface. The instrument used is a plasma cleaner prod...

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Abstract

The invention provides a plasma-assisted glass or quartz chip microstructure alignment and pre-bonding method and belongs to the chip micromachining and bonding technology. The method comprises the following steps: removing a glass or quartz chip optical cement layer and a chromium layer, and fully cleaning the surface by utilizing detergent and a lot of ultrapure water; carrying out surface cleaning and activation by utilizing a plasma cleaner to enable the surface to have high hydrophilia; under an anhydrous condition, carrying out observation with a microscope, and moving the cleaned substrate and cover plate to finish perfect alignment; dripping minute quantity of ultrapure water in edge cracks to carry out bonding, and after carrying out full pressing to squeeze out the excessive water, discharging all of the water in the chip by utilizing a vacuum function of the plasma cleaner, and finishing glass or quartz chip microstructure alignment and pre-bonding; and furthermore, finishing permanent bonding of the chip by utilizing a thermal bonding method. The method enables the overall alignment and pre-bonding operation to be finished within 30 min; and the method is quick and efficient, simple and convenient to carry out, safe to operate and wide in application.

Description

technical field [0001] The invention relates to a glass or quartz chip microstructure alignment and pre-bonding method, which can realize simple and fast pre-bonding of chips, avoid the use of some dangerous cleaning reagents, and further significantly increase the thermal bonding of glass or quartz chips The success rate is achieved, and the chip can be permanently bonded, and the chip can be used for chemical analysis, biological analysis, etc. It belongs to chip micromachining and bonding technology. Background technique [0002] In the 1990s, Manz and Widmer proposed a micro-total analysis system or lab-on-a-chip. Due to its high analysis efficiency, low reagent consumption, miniaturization and integration of analysis devices, and high-throughput analysis of various substances, it has become a One of the research hotspots in the field of analytical chemistry. Commonly used materials for making chips include glass, quartz, and high molecular polymers. Among them, glass...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L21/68
CPCH01L21/68H01L21/682H01L24/03H01L24/04H01L2221/67B81C2203/051B81C3/001B81C1/00928B81C3/002B81C2201/0102B81C2201/0128B81C2201/0133B81C2201/019H01L21/67028
Inventor 郭广生王思雨蒲巧生汪夏燕
Owner BEIJING UNIV OF TECH
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