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Ultra-low-temperature adhesive and preparation method

An adhesive, ultra-low temperature technology, applied in the direction of adhesives, adhesive types, polyether adhesives, etc., can solve the problems of many ingredients, bond strength and curing time sacrifice, and achieve advanced technology, good fluidity, The effect of convenient storage, transportation and construction

Inactive Publication Date: 2015-12-30
太仓市金锚新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing adhesives have a large proportion of components, and when pursuing better low-temperature performance, the bond strength and curing time are sacrificed

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] In the reactor, add 10 parts of acrylic acid, 6 parts of ethyl acetate, 1 part of butyl acrylate, 5 parts of sodium phosphite, 15 parts of polyethylene glycol methacrylate, 3 parts of polyoxyethylene octylphenol ether, 5 parts of 5% potassium persulfate aqueous solution, 10 parts of sodium diphenylsulfonate, reflux reaction under the protection of nitrogen, then add 0.5 parts of benzoyl peroxide, 20 parts of diluent toluene, and react at 60 ° C for 3 hours to obtain It is a viscous liquid with a solid content of 34.5% and a viscosity of 4.5Pa.s.

Embodiment 2

[0023] In the reactor, add 11 parts of acrylic acid, 3 parts of ethyl acetate, 2 parts of butyl acrylate, 1 part of sodium phosphite, 17 parts of polyethylene glycol methacrylate, 4 parts of polyoxyethylene octylphenol ether, 5 parts of 5% potassium persulfate aqueous solution, 8 parts of sodium diphenylsulfonate, reflux reaction under the protection of nitrogen, and then add 0.6 parts of benzoyl peroxide. 22 parts of diluent toluene were reacted at 65°C for 3 hours to obtain a viscous liquid with a solid content of 34.6% and a viscosity of 4.6 Pa.s.

Embodiment 3

[0025] In the reactor, add 12 parts of acrylic acid, 4 parts of ethyl acetate, 5 parts of butyl acrylate, 2 parts of sodium phosphite, 20 parts of polyethylene glycol methacrylate, 5 parts of polyoxyethylene octylphenol ether, 6 parts of 5% potassium persulfate aqueous solution, 9 parts of sodium diphenylsulfonate, reflux reaction under the protection of nitrogen, then add 0.7 parts of benzoyl peroxide, 25 parts of diluent toluene, and react at 70 ° C for 3.5 hours , to obtain a viscous liquid with a solid content of 34.7% and a viscosity of 4.8 Pa.s.

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Abstract

The invention relates to an ultra-low-temperature adhesive and a preparation method. The adhesive is prepared from 10-14 parts of acrylic acid, 2-6 parts of ethyl acetate, 1-5 parts of butyl acrylate, 0.8-5 parts of sodium phosphate, 15-25 parts of ethylene glycol methacrylate, 3-7 parts of polyoxyethylene octylphenol ether, 5-7 parts of 5% potassium sulfate aqueous solution, 8-10 parts of diphenyl sodium sulfonate, 0.5-1 part of benzoyl peroxide and 20-30 parts of diluent toluene. The adhesive has the advantages that the formula is scientific, the technology is advanced, performance is excellent, adhesion strength is high, construction is easy and convenient and the application range is wide, and great convenience is brought to winter storage, transport and construction in high-latitude regions.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to ultra-low temperature adhesives and a preparation method. Background technique [0002] Ultra-low temperature adhesive is a type of adhesive that has bonding properties under ultra-low temperature conditions. It can be used under conditions such as liquid nitrogen (-269°C) and has a certain bonding strength. It is mainly used for missile aircraft, using liquid nitrogen and liquid hydrogen. Bonding on medical and laboratory equipment. Commonly used ultra-low temperature adhesives are usually formulated with polyurethane or polyurethane modified with epoxy resin, polyurethane, nylon modified epoxy resin, etc., and some polyurethane adhesives with good low temperature performance can also be used. For example, the high-quality ultra-low temperature adhesive successfully developed by Beijing University of Aeronautics and Technology uses epoxy resin as the main material, and uses a...

Claims

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Application Information

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IPC IPC(8): C09J171/08C09J133/02
Inventor 施兆武
Owner 太仓市金锚新材料科技有限公司
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