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Cardanol based epoxy resin containing maleimide structure and preparation method of cardanol based epoxy resin

A cardanol-based epoxy resin, maleimide technology, applied in the direction of organic chemistry, can solve the problems of low water absorption, low crosslinking density, low glass transition temperature, etc., and achieves heat and humidity resistance and adhesive properties Excellent, easy to operate, excellent overall performance

Inactive Publication Date: 2016-01-20
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the cardanol-based epoxy resin has the advantages of high toughness and low water absorption compared with ordinary epoxy resins, its shortcomings of low crosslinking density, low glass transition temperature, and poor thermal stability still need to be improved.

Method used

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  • Cardanol based epoxy resin containing maleimide structure and preparation method of cardanol based epoxy resin
  • Cardanol based epoxy resin containing maleimide structure and preparation method of cardanol based epoxy resin
  • Cardanol based epoxy resin containing maleimide structure and preparation method of cardanol based epoxy resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] (1) Under the protection of nitrogen, add 7.94 g (0.042 mol) of N-p-hydroxyphenylmaleimide to 6.00 g (0.02 mol) of cardanol (molecular weight: 300), and keep the temperature at 200°C under the protection of nitrogen . N-p-hydroxyphenylmaleimide melts gradually, forms a uniform solution with cardanol, and continues to react for 8 hours under stirring. After the reaction was completed, it was cooled to room temperature to obtain 13.94 g of cardanol (CA-2.1HPM) containing N-p-hydroxyphenylmaleimide structure.

[0038] (2) Under the protection of nitrogen, heat and stir 2.25 grams of CA-2.1HPM, 20 milliliters of epichlorohydrin and 10 milliliters of isopropanol to form a homogeneous phase, add 1.5 grams of anhydrous potassium carbonate, and reflux at 120 ° C for 10 hours . The reaction system gradually changed from dark red to dark purple. After the reaction was completed, after the solution was cooled to room temperature, it was extracted and washed three times with 100...

Embodiment 2

[0042](1) Under the protection of nitrogen, add 5.67 g (0.03 mol) of N-p-hydroxyphenylmaleimide to 9.00 g (0.03 mol) of cardanol (molecular weight: 300), and keep the temperature at 200°C under the protection of nitrogen . N-p-hydroxyphenylmaleimide melts gradually, forms a uniform solution with cardanol, and continues to react for 8 hours under stirring. After the reaction was completed, it was cooled to room temperature to obtain 14.67 g of cardanol (CA-1HPM) containing N-p-hydroxyphenylmaleimide structure.

[0043] (2) Under the protection of nitrogen, 2.44 g of CA-1HPM, 20 ml of epichlorohydrin and 10 ml of isopropanol were heated and stirred to dissolve into a homogeneous phase, and 1.5 g of anhydrous potassium carbonate was added, and the reaction was refluxed at 120 ° C for 10 hours. The reaction system gradually changed from dark red to dark purple. After the reaction was completed, after the solution was cooled to room temperature, it was extracted and washed three ...

Embodiment 3

[0047] (1) Under the protection of nitrogen, add 7.94 g (0.042 mol) of N-p-hydroxyphenylmaleimide to 6.00 g (0.02 mol) of cardanol (molecular weight: 300), and keep the temperature at 180°C under the protection of nitrogen . N-p-hydroxyphenylmaleimide melts gradually, forms a homogeneous solution with cardanol, and continues to react for 12 hours under stirring. After the reaction was completed, it was cooled to room temperature to obtain 13.94 g of cardanol (CA-2.1HPM) containing N-p-hydroxyphenylmaleimide structure.

[0048] (2) Under the protection of nitrogen, heat and stir 2.25 g of CA-2.1HPM, 20 ml of epichlorohydrin and 10 ml of isopropanol to dissolve into a homogeneous phase, add 1.5 g of sodium hydroxide, and reflux at 120 ° C for 10 hours. The reaction system gradually changed from dark red to dark purple. After the reaction was completed, after the solution was cooled to room temperature, it was extracted and washed three times with 100 ml of deionized water. Th...

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Abstract

The invention belongs to the field of high polymer materials and particularly discloses cardanol based epoxy resin containing a maleimide structure and a preparation method of the cardanol based epoxy resin. The preparation method of the cardanol based epoxy resin comprises steps as follows: cardanol is taken as a raw material, maleimide containing hydroxyl or carboxyl is added, cardanol containing the maleimide structure is obtained through the Alder-ene reaction and the diene addition reaction, the product and epoxy haloalkane have the epoxidation reaction in the presence of a solvent, a basic catalyst and inert gas, and the cardanol based epoxy resin containing the maleimide structure is prepared. The prepared cardanol based epoxy resin containing the maleimide structure has a maleimide ring structure and a cardanol C15 long carbon chain simultaneously, the toughness, the thermal stability, the wet-heat resistant property and the adhesive property of the cardanol based epoxy resin are better than those of conventional epoxy resin, and further, the preparation method of the cardanol based epoxy resin is simple and convenient to operate and suitable for industrial production.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a cardanol-based epoxy resin containing a maleimide structure and a preparation method thereof. Background technique [0002] Epoxy resin refers to an organic compound containing one or more epoxy groups in its molecular structure. It can interact with various curing agents such as acid anhydride curing agents, amine curing agents, imidazole curing agents, and phenolic curing agents. Combined reaction to form a thermosetting three-dimensional network structure polymer. Epoxy resins are widely used in aerospace, aviation, electronics, transportation, building materials and advanced composite materials due to their excellent mechanical properties, thermal properties, electrical properties and corrosion resistance. [0003] Polyimide is a kind of special engineering plastic known for its high temperature resistance. Its excellent thermal stability comes from the highly ...

Claims

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Application Information

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IPC IPC(8): C08G59/02C07D405/14
Inventor 刘濯宇余英丰
Owner FUDAN UNIV
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