A rapid method for preparing carbon/carbon composites with high thermal conductivity

Abstract

The invention discloses a method for rapidly preparing carbon/carbon composite materials with high thermal conductivity. Water and a dispersant are uniformly stirred according to a mass percentage of 100: (0.1-0.5), and then 10-60wt of water is added .% of the mesophase pitch-based chopped carbon fiber is mixed, and ultrasonic vibration is used to promote the dispersion of the fiber; the prepared chopped carbon fiber aqueous solution is poured into a graphite mold and placed below 0°C to freeze into a solid block, and the moisture is removed by freeze-drying And the porosity in the chopped carbon fiber reinforcement is reduced by pressure forming; the prepared chopped carbon fiber reinforcement is repeatedly impregnated with pitch-carbonization, and subjected to high-temperature graphitization treatment to obtain a carbon/carbon composite material with high thermal conductivity. The raw materials involved in the present invention are easy to obtain, the process is simple, the production cycle is short, and the production cost is low. The density and thermal conductivity of the prepared carbon/carbon composite material are high, and the thermal conductivity in the vertical pressure forming direction at room temperature is 322- 368W/m×K, significantly higher than traditional heat dissipation materials such as aluminum and copper.

Description

Technical field: [0001] The invention relates to a preparation method of a carbon / carbon composite material, in particular to a rapid preparation method of a chopped carbon fiber reinforced high thermal conductivity carbon / carbon composite material. Background technique: [0002] With the advancement and in-depth development of science and technology, the application of high power density electronic devices is becoming more and more extensive, and the development of high power density electronic devices is also tending to be miniaturized, lightweight and integrated. The higher the integration of high-power-density devices, the more heat they generate during operation. If the heat cannot be dissipated in time, it will seriously affect the normal operation of electronic devices and the stability and reliability of the system. Due to the limitations of factors such as high density, high thermal expansion coefficient, and low purity, traditional heat dissipation materials (alumi...

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Problems solved by technology

In the above method, the mesophase pitch-based chopped carbon fiber is mixed with the mesophase pitch in proportion, and a high thermal conductivity carbon / carbon composite material is obtained through a hot press molding process through cyclic impregnation-carbonization and graphitization, but the length of 1-10mm Mesophase pitch-based chopped carbon fibers are easy to agglomerate and unevenly dispersed in mesophase pitch, resulting in large dispersion and instability of material properties