Imitation gold electroplate liquid and electroplating method thereof
An electroplating solution and imitation gold technology, which is applied in the field of alloy electroplating solution, can solve the problem that it cannot fundamentally replace cyanide imitation gold electroplating solution, and achieve the effect of excellent covering ability, golden color and easy maintenance
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Embodiment 1
[0019] First, pretreat the substrate of the plated part according to the conventional pretreatment method. The substrate of the plated part is a low-carbon stainless steel substrate. After polishing with sandpaper, put it into acetone for ultrasonic cleaning for 5 minutes, immerse it in absolute ethanol for 1 minute, and deionize it. Rinse with water, then put in HF2v / v% and H 2 SO 4 Corrosion and activation in a 10v / v% mixed solution for 10s, finally rinsed with deionized water for 3 times, soaked in ultrapure water once, dried naturally, then placed in an oven at 80°C for drying.
[0020] Utilize high-vacuum radio frequency magnetron sputtering technology to deposit metal copper coating on the surface of the plated substrate after drying; the specific parameters are: the target material is high-purity metal copper, the sputtering power is 120W, the flow rate of argon gas is 20 sccm, the gas The pressure is 0.2Pa, the base material temperature is normal temperature, the sput...
Embodiment 2
[0025] First, pretreat the base material of the plated part according to the conventional pretreatment method. The base material of the plated part is a low-carbon stainless steel base material. Rinse with water, then put in HF3v / v% and H 2 SO 4 Corrosion and activation in a 10v / v% mixed solution for 10s, finally rinsed with deionized water for 3 times, soaked in ultrapure water once, dried naturally, then placed in an oven at 110°C for drying.
[0026] Utilize high-vacuum radio frequency magnetron sputtering technology to deposit metal copper coating on the surface of the plated substrate after drying; the specific parameters are: the target material is high-purity metal copper, the sputtering power is 120W, the flow rate of argon gas is 20 sccm, the gas The pressure is 0.2Pa, the base material temperature is normal temperature, the sputtering time is 10min, and the bright copper layer on the surface of the plated piece base material is 5 μm.
[0027] Put the bright copper ...
Embodiment 3
[0031] First, pretreat the substrate of the plated part according to the conventional pretreatment method. The substrate of the plated part is a low-carbon stainless steel substrate. After polishing with sandpaper, put it into acetone for ultrasonic cleaning for 5 minutes, immerse it in absolute ethanol for 1 minute, and deionize it. Rinse with water, then put in HF2v / v% and H 2 SO 4 Corrosion and activation in a 10v / v% mixed solution for 5s, finally rinsed with deionized water for 3 times, soaked in ultrapure water once, dried naturally, then placed in an oven at 70°C for drying.
[0032] Use vacuum evaporation to plate bright copper on the surface of the pretreated plated substrate. The conditions of vacuum evaporation are: the vapor deposition pressure is 0.5×10 -3 Pa, the evaporation temperature during evaporation is 1050°C. The bright copper layer on the surface of the plated piece substrate is 5 μm.
[0033] Put the bright copper plated parts into the plating tank fil...
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Abstract
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