High dielectric thermosetting resin composition and laminated board for substrate

Abstract

The invention discloses a high dielectric thermosetting resin composition and laminated board for substrate. The thermosetting resin composition comprises 300 to 550 parts of filling material with a high dielectric constant and 100 parts of organic solid constituent; wherein the 100 parts of organic solid constituent comprise: 30 to 50 parts of epoxy resin composition, 18 to 35 parts of active ester curing agent, 4 to 15 parts of bismaleimide resin, 4 to 20 parts of cyanate ester modified polyphenyl ether resin, and 0.01 to 2 parts of promoter namely dimethylamino pyridine. The provided thermosetting resin composition has the advantages of high dielectric constant, excellent heat-resistant performance, and high glass-transition temperature, and can meet the requirements of miniaturization development of wireless navigation equipment.

Description

technical field [0001] The invention relates to a resin adhesive for copper clad laminates with high Tg, high dielectric and low loss performance, a laminate made of the adhesive and a manufacturing method of the laminate. Background technique [0002] With the continuous improvement of the level of science and technology, the rapid development of radio navigation, the mobile communication market is increasingly open. In 2015, my country's Beidou satellite navigation system reached global coverage, which promoted the rapid development of various positioning and navigation systems, such as vehicle positioning, communication positioning, remote mapping, electronic navigation, etc., and continued to change to miniaturization. However, the size of RF front-end devices and The dielectric constant of the substrate is inversely proportional, so the development of high dielectric constant substrates is imperative. At the same time, high-frequency communication equipment, frequency c...

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Problems solved by technology

[0007] Patent CN103351581A uses active esters, epoxy resins, allyl-modified bismaleimides, and cyanate resins to make compositions. The use of cyanate resins can improve the Tg of the substrate and the mediation of the substrate. Electrical properties, but cyanate resin has a large water absorption rate, and a large amount of use in the formula will make the base material's heat and humidity resistance poor, and the processability will deteriorate

[0008] Patent CN103101252A uses the conventional curing system of active ester epoxy resin and the composite high dielectric filler after surface treatment. The use of this special filler can greatly improve the dielectric constant of the substrate while ensuring a lower dielectric constant. Electrical loss, but after the high dielectric filler is compounded and surface treated, the peel strength of the prepared copper clad laminate will be lowered, and the dip soldering resistance will be deteriorated

[0009] Patent CN101934619A uses polyimide resin, high dielectric filler, and a copper clad laminate is prepared through a special preparation method. This kind of substrate has the characteristics of high dielectric and high glass transition temperature, but it is only suitable for single One-sided or double-sided boards, the applicable blind spots of multi-layer boards in practical applications make the prospect market have great limitations

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