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Metallized iron powder core and preparation method thereof

A technology for metallizing iron powder and iron powder core, which is applied in chemical instruments and methods, metal layered products, metal material coating processes, etc. Expensive and other problems, to achieve the effect of good weldability, fast sputtering film formation speed and low cost

Active Publication Date: 2016-03-30
SHENZHEN KANGCI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the embodiment of the present invention provides a metallized iron powder core magnetic core and its preparation method to solve the problem of high energy consumption, heavy pollution, high cost and the resulting metallization of the existing iron powder core magnetic core metallization process. Poor film reliability and poor performance

Method used

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  • Metallized iron powder core and preparation method thereof
  • Metallized iron powder core and preparation method thereof
  • Metallized iron powder core and preparation method thereof

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preparation example Construction

[0033] see Figure 4 , the embodiment of the present invention provides a method for preparing the metallized iron powder core magnetic core, comprising the following steps:

[0034] (1) Take the iron powder core, install it on the substrate frame through the mask tooling, and only expose the electrode area, then push it into the vacuum sputtering equipment to evacuate; then input argon gas into the vacuum chamber, And maintain the pressure of argon in the vacuum chamber at 2×10 -1 Pa-8×10 -1 Pa range;

[0035] The purpose of using the mask is to prevent short circuit caused by metal sputtering on the edge of the magnetic core during the sputtering process;

[0036] (2) The iron powder core magnetic core is provided with an electrode area; the metal coating layer is prepared on the surface of the electrode area by magnetron sputtering to obtain a metallized iron powder core magnetic core, and the metal coating layer includes sequentially stacked and formed A chromium layer...

Embodiment 1

[0045] A method for preparing a metallized iron powder core magnetic core, comprising the following steps:

[0046] Take an iron powder core magnetic core, the iron powder core magnetic core is provided with an electrode area; adopt the mode of magnetron sputtering to prepare a metal coating on the surface of the electrode area, and obtain a metallized iron powder core magnetic core, and the metal coating It includes a chromium layer, a nickel-copper alloy layer and a silver layer formed sequentially on the surface of the electrode region.

[0047] (1) Sputtering chromium layer: Arrange the magnetic cores and place them in a special jig, fix them, and only expose the electrode area, then install them on the film rack for vacuum coating, push the vacuum machine, vacuum, and the background The vacuum degree is greater than 5×10 -3 Pa turns on the power supply of the metal chromium target, fills it with argon gas, and starts sputtering. The current of the chromium target is set to...

Embodiment 2

[0052] A method for preparing a metallized iron powder core magnetic core, comprising the following steps:

[0053] Take an iron powder core magnetic core, the iron powder core magnetic core is provided with an electrode area; adopt the mode of magnetron sputtering to prepare a metal coating on the surface of the electrode area, and obtain a metallized iron powder core magnetic core, and the metal coating It includes a chromium layer, a nickel-copper alloy layer and a silver layer formed sequentially on the surface of the electrode region.

[0054] (1) Sputtering chromium layer: Arrange the magnetic cores and place them in a special jig, fix them, and only expose the electrode area, then install them on the film rack for vacuum coating, push the vacuum machine, vacuum, and the background The vacuum degree is greater than 5×10 -3 Pa turns on the power supply of the metal chromium target, fills it with argon gas, and starts sputtering. The current of the chromium target is set ...

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Abstract

The embodiment of the invention provides a metallized iron powder core, comprising an iron powder core, wherein an electrode area is arranged on the iron powder core; a metal coating connected with other devices is formed on the electrode area; the metal coating comprises a chromium layer, a nickel-copper alloy layer and a silver layer sequentially stacked on the electrode area; the chromium layer, the nickel-copper alloy layer and the silver layer are prepared by magnetron sputtering. The metal coating of the metallized iron powder core provided by the invention has the advantages of high adhesive force, strong heat resistance, good weldability and low cost. The embodiment of the invention also provides a preparation method of the metallized iron powder core, which is rapid in film forming speed, free of pollution during whole technical process, and low in cost.

Description

technical field [0001] The invention relates to the field of patch power magnetic core processing, in particular to a metallized iron powder core magnetic core and a preparation method thereof. Background technique [0002] Under the current tide of smart phones and tablet computers, the requirements for miniaturization and patching of electronic components are becoming stronger and stronger, and power inductors are the first to bear the brunt. Moreover, the environmental protection requirements of products are getting higher and higher, and all products must pass various tests such as ROSH and halogen. [0003] The traditional iron powder core SMD power core metallization process mainly includes processes such as dipping the ends of the magnetic core with silver paste, high-temperature sintering, electroplating nickel, tin, etc., which has the disadvantages of high energy consumption, large pollution, high cost, and poor reliability. The current construction of a conservat...

Claims

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Application Information

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IPC IPC(8): H01F17/00H01F27/255B32B15/01H01F41/18C23C14/35C23C14/16
CPCB32B15/01C23C14/16C23C14/35H01F17/0006H01F27/255H01F41/18H01F2017/006H01F2017/0066
Inventor 朱小东
Owner SHENZHEN KANGCI ELECTRONICS CO LTD
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