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Method for carrying out surface treatment on electrolytic copper foil by virtue of high-heat-resistance organosiloxane film-forming material

An organosiloxane, film-forming material technology, applied in the direction of metal material coating process, etc., can solve the problem of inability to guarantee the dense protective layer structure of the galvanized layer, false alarms, and inability to prepare high-reliability copper foils for printed circuit boards, etc. problems, to achieve good high temperature oxidation resistance, simplify the preparation process, and reduce the cost of process management.

Inactive Publication Date: 2016-06-22
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] According to the content disclosed in patent 1, the acidity of the trivalent chromium electroplating solution is strong (pH value is 2.6~3.8), which will affect the structure of the galvanized layer, because zinc is a kind of more active metal, it will The reaction releases hydrogen gas, resulting in micropores, and the original dense protective layer structure of the galvanized layer cannot be guaranteed, so it is almost impossible to prepare high-reliability copper foil for printed circuit boards according to the content disclosed in this patent
In addition, waste trivalent chromium may be converted to hexavalent chromium if not handled properly, or may be falsely reported when the analytical method is improperly expressed

Method used

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  • Method for carrying out surface treatment on electrolytic copper foil by virtue of high-heat-resistance organosiloxane film-forming material
  • Method for carrying out surface treatment on electrolytic copper foil by virtue of high-heat-resistance organosiloxane film-forming material
  • Method for carrying out surface treatment on electrolytic copper foil by virtue of high-heat-resistance organosiloxane film-forming material

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Maleic anhydride structure type silicone material.

[0032]Material preparation: add 9.8g (0.1mol) maleic anhydride and 100ml dehydrated acetone to a 250ml three-necked bottle, stir and dissolve at room temperature, add 16.1g (0.1mol) hexamethyldisilamine (HMDS) dropwise, Continue to stir for 30 minutes after the addition, then drop 0.2 mol of water, and precipitates will form immediately. After the system is cooled to room temperature, filter with suction, remove water and wash the filter cake with acetone three times, and dry it to obtain a light yellow powder of maleic acid Amine 7.87g, yield 81%.

[0033] Under nitrogen atmosphere, add 9.7g (0.1mol) maleic imide and 100ml dehydrated DMSO to a 250ml three-necked flask, raise the temperature to 110°C, then add 100ml dehydrated ethanol solution containing 5.61g potassium hydroxide dropwise , a white precipitate is formed. Maintain 110°C for 90 minutes, filter while hot, wash the filter cake three times with dehydrate...

Embodiment 2

[0038] Phthalic anhydride structure type silicone material.

[0039] Material preparation: under nitrogen atmosphere, add 14.8g (0.1mol) phthalic anhydride and 150ml glacial acetic acid into a 250ml three-necked flask, and add 5.7g (0.1mol) allyl Ammonia was reacted at room temperature for 1h, and then the temperature was raised to 120°C for reflux for 3h. Stop the reaction, and after cooling to room temperature, pour it into 300ml of water, immediately a white precipitate precipitates out, filter with suction, wash the filter cake with water three times, and dry to obtain the white powder product 2-allylisoindoline-1,3 - 15.8 g of diketone, the yield is 85%.

[0040] Under nitrogen atmosphere, add 9.35g (0.05mol) 2-allylisoindoline-1,3-dione and 150ml toluene into a 250ml three-neck flask, stir to dissolve, add about 0.2ml Karstedt catalyst, activate at 50°C 30min, then add 8.2g (0.05mol) triethoxysilane, heat up to 70°C, react for 10h and evaporate the solvent to obtain of...

Embodiment 3

[0044] 1,2,3,6-tetrahydrophthalic anhydride structure type silicone material.

[0045] Material preparation: Add 15.2g (0.1mol) 1,2,3,6-tetrahydrophthalic anhydride and 150ml glacial acetic acid into a 250ml three-neck flask under ice bath conditions, then add 5.7g (0.1mol) dropwise Allyl ammonia, remove the ice bath and stir for 1 hour, then raise the temperature to 120°C and reflux for 5 hours, after cooling to room temperature, pour it into 500ml of water, a large amount of white solid precipitates, wash the filter cake with water for three times by suction filtration, and dry at 40°C After drying, 15.86 g of a white imidation product was obtained, and the yield was 83%.

[0046] Under a nitrogen atmosphere, add 8.5g (0.0445mol) of the imidation product of the previous step and 150ml of toluene to a 250ml three-neck flask, stir and dissolve and heat up to 50°C, then drop in 0.2ml of Karstedt catalyst, maintain 50°C for 30min, then drop in trimethyl Oxysilane 5.43g trimetho...

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Abstract

The invention discloses a method for carrying out surface treatment on an electrolytic copper foil by virtue of a high-heat-resistance organosiloxane film-forming material. The method is characterized by comprising the following steps: mixing the high-heat-resistance organosiloxane film-forming material with water and an alcohol solvent in a volume ratio of (1 to 10): (1 to 20): (20 to 120), and stirring for 10 to 30 minutes; adjusting a pH value to 4.5 to 5.5, and standing for 6 hours to 7 days to prepare a hydrolyzed film-forming solution; coating the surfaces of the rough surface and the polished surface of the electrolytic copper foil with the hydrolyzed film-forming solution respectively; and heating and curing for 10 minutes to 2 hours at 150 to 200 DEG C to form a layer of compact high-heat-resistance organosiloxane film. According to the method disclosed by the invention, the original chromium-plating passivation link is replaced, the use of hexavalent chromium is abandoned, and the environment protection performance is greatly improved. The method combines the original process link of coating the rough surface with a silane coupling agent, and simplifies the production process. Meanwhile, improvement for the binding force of the electrolytic copper foil and matrix resin is promoted.

Description

technical field [0001] The invention relates to a chromium-free electrolytic copper foil surface treatment and a manufacturing method thereof. In particular, it relates to a surface-treated electrolytic copper foil for printed circuit boards that uses a new type of high heat-resistant silicone material for surface treatment, does not contain chromium, and has good performance. Background technique [0002] Electrolytic copper foil is an important raw material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCB). In the rapid development of today's electronic information industry, electrolytic copper foil has become a key conductive material for signal and power transmission and communication of electronic products. At present, chromium is used as the main passivation component of electrolytic copper foil for printed circuit boards, and its function is to ensure that electrolytic copper foil is not oxidized and corroded in the high-temperature ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C22/52
CPCC23C22/52C23C2222/20
Inventor 刘峰付志强齐海霞
Owner NANCHANG UNIV