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Modified conductive filling material, preparation method thereof and application

A conductive filler and modified technology, applied in conductive adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problem of electrical conductivity, low oxidation resistance, limit the application of silver-coated copper powder, increase current resistance, etc. problems, to achieve the effect of improving electrical conductivity, improving connection, and increasing contact area

Active Publication Date: 2016-07-06
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still some problems in the silver-coated copper powder prepared in the industry: the surface of the copper powder is not completely covered by the silver film, and its conductivity and oxidation resistance are still lower than that of pure silver powder; and some organic lubricants are added to the conductive filler during the preparation process. agent, which is conducive to the dispersion of conductive fillers in the polymer, reducing the viscosity of the conductive adhesive and facilitating the implementation of the conductive adhesive; but the presence of this layer of lubricant will make the contact between the fillers a metal-lubricant-metal state, so that Increase the resistance of current passing through the conductive filler; at the same time, the conductive filler will be oxidized during storage, and an oxide layer will be formed on the surface of the conductive filler, which also increases the resistance of the current passing through
These problems limit the application of silver-coated copper powder in the field of conductive adhesive

Method used

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  • Modified conductive filling material, preparation method thereof and application
  • Modified conductive filling material, preparation method thereof and application
  • Modified conductive filling material, preparation method thereof and application

Examples

Experimental program
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Effect test

Embodiment 1

[0044] 1) Preparation of modified conductive filler:

[0045]In terms of parts by mass, 100 parts of silver-coated copper powder, 0.06 parts of terephthalaldehyde, and 0.002 parts of iodine were added to 1000 parts of ethanol for mixing, ultrasonicated at an ultrasonic power of 100W for 20 minutes, and then treated on a magnetic stirrer for 3 hours. Wash 3 times with ethanol until the modifier remaining on the silver-coated copper powder is removed. Finally, it was dried in a vacuum oven at room temperature for 24 hours to obtain a modified conductive filler.

[0046] 2) Preparation of conductive adhesive

[0047] Mix epoxy resin, curing agent, accelerator, etc. according to the following parts by weight:

[0048] Epoxy resin 828100 parts

[0049] 85 parts of curing agent methyl hexahydrophthalic anhydride

[0050] Accelerator 1-cyano-2-ethyl-4 methylimidazole 1~2 parts

[0051] Modified silver-coated copper powder 555 parts

[0052] Thinner acetone 50~100 parts

[0053...

Embodiment 2

[0071] 1) Preparation of modified conductive filler

[0072] The preparation method of the modified conductive filler of silver powder is as follows, and each material of weight part is taken according to the following ratio: 100 parts of silver powder, 100 parts of ethanol, 0.06 part of hydrobromic acid and hydroiodic acid mixture are ultrasonically mixed at an ultrasonic power of 100W for 20 minutes, Then it was processed on a magnetic stirrer for 3h. Wash with ethanol several times until the excess modifier on the silver powder is removed. Dry in a vacuum oven at room temperature for 24 h.

[0073] 2) Preparation of conductive adhesive

[0074] It mainly consists of the following steps:

[0075] Mix high elastic polyurethane, untreated silver powder, etc. according to the following parts by weight:

[0076] PU100 copies

[0077] Solvent DMF300 parts

[0078] Modified silver powder 555 parts

[0079] Thinner acetone 50~100 parts

[0080] Additive TNNP2~10 parts

[0...

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Abstract

The invention discloses a modified conductive filling material, a preparation method thereof and application. The modified conductive filling material mainly includes micrometer metal powder which is modified by a substituting agent and a reducing agent and from which surface an organic lubricant is removed. The substituting agent includes polyaldehyde or / and short chain polyprotic acid. The reducing agent is selected from inorganic and / or organic reducing agents. The preparation method includes the steps of: carrying out treatment on the micrometer metal powder by using the substituting agent and the reducing agent, and modifying the micrometer metal powder and removing the organic lubricant from the micrometer metal powder surface. According to the invention, the connection between the conductive filling materials is improved by removing the organic lubricant from the filling material surface in the modification of the conductive filling material. Metal particles with a small particle size are generated in situ. The metal particles increase the filling material surface roughness and contact areas of the filling materials, enhance the connection between the conductive filling materials, fill in the blank of the filling materials, thereby improving the conductive performances of the conductive filling material and a conductive adhesive.

Description

technical field [0001] The invention relates to the technical field of conductive filler preparation, in particular to a modified conductive filler with good electrical conductivity, its preparation method and application. Background technique [0002] In the field of microelectronic packaging, toxic tin-lead solder not only endangers the health of operators, but also causes more and more environmental problems. And the application of Pb / Sn solder is limited to the connection with a pitch below 0.65mm and the connection temperature meets the conditions of 200°C; while the development trend of miniaturization and high density of electronic packaging materials means that components are getting smaller and smaller, I / The number of O pins is further increased, and the lead spacing is further reduced. The temperature resistance of most electronic products does not exceed 100°C, which urgently requires the development of new conductive connecting materials to meet the ever-incre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J11/04C09J9/02C09J163/00C09J175/04
Inventor 姚亚刚李朝威龚希珂
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI