Surface-treated copper foil, copper foil with carrier, printed wiring board, copper-clad laminate, laminate and method for producing printed wiring board
A technology of surface treatment layer and carrier-attached copper foil, which is applied in the manufacture of printed circuits, the manufacture of printed circuit precursors, printed circuits, etc., can solve the problems of the difficulty of forming micro-circuits by subtractive methods, and achieve excellent micro-wiring formability Effect
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[0233] Embodiments of the present invention are disclosed below, but these embodiments are provided for a clearer understanding of the present invention and its advantages, and are not intended to limit the invention.
[0234] The following copper foil main body layers (raw foil) were prepared as Examples 1-11 and Comparative Examples 1-4.
[0235] ·General electrolytic primary foil
[0236] Copper sulfate electrolyte with a copper concentration of 80-120g / L, a sulfuric acid concentration of 80-120g / L, a chloride ion concentration of 30-100ppm, a gel concentration of 1-5ppm, and an electrolyte temperature of 57-62°C is used as the electrolytic copper plating bath. The linear velocity of the electrolyte flowing between the anode and the cathode (metal roller for electrodeposition of copper foil) is 1.5-2.5m / s, and the current density is 70A / dm 2 Production thickness 12μm (weight thickness 95g / m 2 ) general electrolytic primary foil.
[0237] ·Both sides flat electrolytic pri...
Embodiment 8
[0500] Embodiment 8; The barrier layer (brass plating) formation condition of comparative example 3,4:
[0501] Use a brass plating bath with a copper concentration of 50-80g / L, a zinc concentration of 2-10g / L, a sodium hydroxide concentration of 50-80g / L, a sodium cyanide concentration of 5-30g / L, and a temperature of 60-90°C. Density 5~10A / dm 2 (Multi-stage treatment) Apply a plating charge of 30As / dm to the M surface on which the roughening treatment layer is formed 2 .
[0502] 〔Anti-rust treatment〕
[0503] Antirust treatment (chromic acid treatment) was performed under the following conditions to form an antirust treatment layer.
[0504] (chromate condition) in CrO 3 : 2.5g / L, Zn: 0.7g / L, Na 2 SO 4 : 10g / L, pH4.8, chromate bath at 54℃, 0.7As / dm 2 power. In addition, immediately after finishing the antirust treatment in the chromate bath, the piping is sprayed with a liquid, and the same chromate bath is used to spray the entire roughened surface.
[0505] 〔Sila...
Embodiment 9
[0507] In Example 9, after the antirust treatment and the coating of the silane coupling material, a resin layer was further formed under the following conditions.
[0508] (Resin synthesis example)
[0509] 117.68g (400mmol) of 3,4,3',4'-biphenyltetracarboxylic dianhydride, 87.7g (300mmol) of 1,3-bis(3-aminophenoxy)benzene, γ-valerolactone 4.0g (40mmol), 4.8g (60mmol) of pyridine, 300g of N-methyl-2-pyrrolidone (hereinafter referred to as NMP), and 20g of toluene were added to a stainless steel anchor-type stirring rod, nitrogen introduction tube and tube latch. A 2-liter three-necked flask with a reflux condenser equipped with a bulb condenser was installed on the separator, heated at 180°C for 1 hour, cooled to around room temperature, and then added 3,4,3',4'-biphenyltetracarboxylate Acid dianhydride 29.42g (100mmol), 2,2-bis{4-(4-aminophenoxy)phenyl}propane 82.12g (200mmol), NMP200g, toluene 40g, after mixing at room temperature for 1 hour, at 180 °C for 3 hours to obta...
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