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Thixotrope for packaging LED (light emitting diode ) chip

A technology of LED chips and thixotropes, applied in the field of thixotropes, can solve the problems of increasing cost, reducing light transmittance, uneven color temperature, etc., and improving the resistance to cold and thermal shock, improving elongation at break, elongation at break, etc. high rate effect

Active Publication Date: 2016-09-21
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It has been reported in the literature that organic bentonite is used as a thixotropic agent to prepare thixotropic glue. Due to the difficulty in dispersing bentonite with a flake structure, the light transmittance is reduced, and it is not conducive to the dispersion of phosphor powder in the later stage, which will cause uneven color temperature.
There are also reports in the literature on single-component thixotropes. Although they do not need to be further mixed before use and are easy to handle, the storage stability of the thixotropes is poor, requiring frozen storage, which increases the cost of storage and transportation.
[0004] According to public information, the mechanical properties of thixotropes are generally low. The basic range is that the tensile strength is 3-6MPa, the tear strength is 3KN / m, and the elongation at break is basically 100%-200%. Using this type of thixotrope The packaged filament has poor resistance to cold and heat shocks, and the rate of glue cracks and dead lights is high, which weakens the protective effect of thixotropic glue on LED chips.

Method used

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  • Thixotrope for packaging LED (light emitting diode ) chip
  • Thixotrope for packaging LED (light emitting diode ) chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Component A consists of 60 parts by weight of 5000mPa.s vinyl-terminated silicone oil, 5 parts by weight of polyvinyl silicone oil with a viscosity of 5000mPa.s and a vinyl content of 5wt%, 5 parts by weight of a thixotropic agent, and 0.1 part by weight of a catalyst, and mix Uniform; B component consists of 50 parts by weight of vinyl MQ silicone resin with a vinyl content of 0.9wt% and MQ resin content of 60wt%, 15 parts by weight of a chain extender with a viscosity of 1500mPa.s, and 3 parts by weight of a hydrogen content of 1.5wt%. It is composed of hydrogen-containing silicone oil, 2 parts by weight of KH560, and 0.01 part by weight of inhibitor, and mixed uniformly; A:B components are mixed uniformly according to the ratio of 1:1 by weight, and after vacuum defoaming, the thixotropic compound for LED chip packaging can be obtained. glue. The vulcanization temperature of the thixotropic rubber is 80°C for 5 hours.

Embodiment 2

[0025] Component A consists of 30 parts by weight of vinyl-terminated silicone oil with a viscosity of 300mPa.s, 20 parts by weight of vinyl-terminated silicone oil with a viscosity of 5000mPa.s, 10 parts by weight of vinyl-terminated silicone oil with a viscosity of 100000mPa.s, 2 parts by weight of vinyl-terminated silicone oil with a viscosity of 10000mPa.s and ethylene Polyvinyl silicone oil with a base content of 10wt%, 8 parts by weight of a thixotropic agent, and 0.1 part by weight of a catalyst, and mixed uniformly; component B consists of 30 parts of vinyl-terminated silicone oil with a viscosity of 3500mPa.s, 25 parts by weight of a vinyl group with a content of 0.9 The content of wt% and MQ resin is 60wt% vinyl MQ silicone resin, 12 parts by weight of chain extender with a viscosity of 1000mPa.s, 2.5 parts by weight of hydrogen-containing silicone oil with a hydrogen content of 1.23wt%, 1 part by weight of KH560, agent; A:B components are uniformly mixed according to...

Embodiment 3

[0027] Component A consists of 40 parts by weight of 1000mPa.s vinyl-terminated silicone oil, 20 parts by weight of vinyl-terminated silicone oil of 10000mPa.s, 5 parts by weight of polyvinyl silicone oil with a viscosity of 5000mPa.s and a vinyl content of 5wt%, 5 parts by weight Thixotropic agent, 0.3 parts by weight of catalyst, and mixed uniformly; Component B consists of 30 parts of vinyl-terminated silicone oil with a viscosity of 5000mPa.s, 20 parts by weight of vinyl with a vinyl content of 1.3wt% and MQ resin with a content of 50wt%. MQ silicone resin, 13 parts by weight of a chain extender with a viscosity of 1200mPa.s, 5 parts by weight of hydrogen-containing silicone oil with a hydrogen content of 0.8 wt%, 2 parts by weight of allyl glycidyl ether, and 0.05 parts by weight of an inhibitor, and mix uniformly; A : Component B is uniformly mixed according to the ratio of 1:1 by weight, and after vacuum defoaming, the thixotrope for LED chip packaging is obtained. The ...

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Abstract

The invention discloses thixotrope for packaging an LED (light emitting diode ) chip. The thixotrope is prepared from a component A and a component B, wherein the component A is prepared from 60 parts by weight of vinyl-terminated silicone oil, 2-7 parts by weight of polyvinyl silicone oil, 3-8 parts by weight of a thixotropic agent and 0.1-0.3 part by weight of a catalyst, and is obtained by evenly mixing the raw materials; the component B is prepared from 0-30 parts by weight of the vinyl-terminated silicone oil, 20-50 parts by weight of MQ-type vinyl silicone resin, 10-20 parts by weight of a chain extender, 2-5 parts by weight of hydrogen-containing silicone oil, 1-2 parts by weight of a thickening agent and 0.01-0.05 part by weight of an inhibitor; the thixotrope is prepared by evenly mixing the component A and the component according to the weight ratio of 1: 1, and defoaming under the vacuum condition. The thixotrope provided by the invention is high in thixotropic index, can be adjusted and controlled, is high in elasticity, tensile strength and tear strength after vulcanization, and is good in light transmittance. The thixotrope is applicable to a dispensing packaging technology of the chip of an LED lamp filament, and has good shape preserving capacity after dispensing and during curing.

Description

technical field [0001] The invention relates to the field of addition-type organic silicon encapsulation glue, in particular to a thixotrope used for LED chip encapsulation. Background technique [0002] Common encapsulation adhesives include epoxy, polyurethane, and silicone. Addition-type liquid silicone rubber has the advantages of convenient processing and molding, no by-products in vulcanization, no corrosion, low shrinkage, and aging resistance and weather resistance. Applied to the packaging of electronic and electrical components, it can protect against moisture, corrosion, and shock. At the same time, the service life of electronic appliances is improved, and it is recognized globally as a new material that can be used in the field of electronics industry. Addition-type liquid silicone rubber is widely used in the packaging of chips in LED lamps. For example, the filament of LED filament lamps is a bracket that connects LED chips in series, and is packaged with sil...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/06C09J11/04H01L33/56
CPCC08L2205/025C08L2205/035C09J11/04C09J11/06C09J183/04H01L33/56C08L83/04C08K9/00C08K3/36
Inventor 韩志远江昊张利安高传花林天翼
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
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