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Preparation method of filler for copper clad laminate, resin composition for copper clad laminate and copper clad laminate

A technology of resin and resin composition for copper-clad laminates, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve the problem of increased dielectric constant and dielectric loss of copper-clad laminates, dielectric constant and High dielectric loss, limited sources of special talcum powder, etc., to achieve the effect of good peel strength, low dielectric constant, and low production cost

Active Publication Date: 2018-01-23
SUZHOU GINET NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Talc powder is a 2:1 layered silicate mineral connected by van der Waals force between layers. It is easy to break the bond under the action of external force, so its Mohs hardness is low but the peel strength is poor at the same time.
However, because mica contains a large amount of iron oxide in its structure, iron oxide will increase the dielectric constant and dielectric loss of the copper clad laminate. The iron oxide existing between the mica sheets is extremely difficult to remove, and the removal cost is high.
CN101376734A discloses the use of a special talcum powder as a filler for copper-clad laminate resins. Although copper-clad laminates with good drilling properties and excellent electrical properties can be obtained, the source of the special talcum powder is limited, and copper-clad laminates prepared from it also contain copper clad laminates. The problem of easy detachment between foil and resin
A laminate made only of epoxy resin as a resin component, because epoxy resin contains epoxy groups, and epoxy groups are easily polarized in an electric field, resulting in high dielectric constant and dielectric loss, Unable to meet application requirements

Method used

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  • Preparation method of filler for copper clad laminate, resin composition for copper clad laminate and copper clad laminate
  • Preparation method of filler for copper clad laminate, resin composition for copper clad laminate and copper clad laminate
  • Preparation method of filler for copper clad laminate, resin composition for copper clad laminate and copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] A preparation method for fillers for copper clad laminates, comprising the following steps carried out in sequence:

[0069] (1) Manually select pure black coal series kaolin ore without variegated minerals;

[0070] (2) Carry out pickling and water washing to coal series kaolin ore:

[0071] a. Coal series kaolin ore is packed into a perforated plastic frame made of three kinds of plastics including polystyrene, polyethylene and polypropylene;

[0072] b Submerge the plastic frame containing the material in an aqueous solution of sulfuric acid or nitric acid, the pH value of the aqueous solution is 1-2;

[0073] c Soak the plastic frame with the material for 3 hours;

[0074] d Take out the plastic frame, soak in 6 clear water pools for 1 hour in turn, and finally detect that the pH of the soaked material is 5-7;

[0075] e The washed material is dried, and the surface moisture is 2%.

[0076] (3) Select the weight percent composition by chemical titration and atom...

Embodiment 2

[0089] This example provides a resin composition for copper clad laminates, its raw materials are as follows: bisphenol A epoxy resin (Wuxi Resin Factory, E-53D) 10%, polyethylene glycol epoxy resin (Dow Company, DER- 736) 10%, bisphenol F epoxy resin (Dainippon Ink Chemical Industry Co., Ltd., 830LVP) 10%, benzocyclobutene resin (Shanghai Puzhen Biotechnology Co., Ltd., Kramar) 23%, containing phosphorus Curing agent (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, DOPO, Shenzhen Jinlong Chemical Technology Co., Ltd.) 20.7%, curing accelerator (2-methylimidazole) 0.3%, diluent (N,N-dimethylformamide, DMF) 1%, filler 25%.

[0090] The preparation process of the resin composition for copper clad laminates is as follows:

[0091] (1) preparation filler: with embodiment 1;

[0092] (2) According to the formula ratio, add DOPO to the 2L high-speed shear emulsification kettle, then add 1% DMF, stir for 5 minutes to dissolve and disperse DOPO, then add 2-methylimidazole, stir ...

Embodiment 3

[0094] This example provides a copper clad laminate, the preparation method of which is as follows:

[0095] (1) preparation of resin composition glue: with embodiment 2;

[0096] (2) Impregnation: impregnate the glue and coat it on E glass fiber cloth (2116, the unit weight is 104g / m 2 ) and baked in an oven at 170°C for 5 minutes to obtain a prepreg with a resin content of 50%;

[0097] (3) Pressing: Take 8 sheet-shaped prepregs with a size of 350 mm X 350 mm as the core material, stack them neatly, and then cover the upper and lower sides of the core material with copper foil, and put them together into a vacuum hot press to prepare a ring Oxygen fiberglass cloth copper clad laminate, and conduct performance testing.

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Abstract

The invention relates to a preparation method of a filler for copper clad laminates, a resin composition for copper clad laminates and a copper clad laminate. The preparation method uses pure black coal-based kaolin ore without variegated ore as a raw material, and successively washes and removes impurities and screens the ores. , crushing, wet grinding, stage calcination and surface modification treatment to obtain fillers for copper clad laminates. When other conditions are the same, the copper clad laminate made of the filler prepared by the method of the invention has lower dielectric constant, smaller dielectric loss, reduced drill wear, good peel strength and low production cost.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminate preparation, in particular to a preparation method of a filler for copper clad laminates, a resin composition for copper clad laminates and a preparation method thereof. Background technique [0002] As we all know, filler is one of the key components of resin glue for copper clad laminates. The addition of fillers can improve the properties of the resin matrix such as flame retardancy, toughness, heat resistance, etc., and can also greatly reduce the production cost of copper clad laminates. But the addition of fillers also brings undesired negative effects. First of all, since fillers are usually non-conductive inorganic particles, the electrical properties of the substrate will usually be reduced after adding fillers; secondly, it may cause aggravated drill bit wear, resulting in cost increase instead of decrease, and reduced peel strength, which will cause copper foil to easily d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K13/06C08K9/00C08K9/06C08K3/34C08K3/36C08K3/22B32B27/04B32B27/20B32B27/38
Inventor 李宝智贾波胡林政夏古俊
Owner SUZHOU GINET NEW MATERIAL TECH CO LTD
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