Heat-resistant electric-conductive glue and preparation method thereof

A conductive adhesive and heat-resistant technology, applied in the field of conductive adhesives, can solve the problems of poor heat resistance and low electrical conductivity of conductive adhesives, and achieve the effects of good heat resistance, good electrical conductivity, and improved thermal stability.

Inactive Publication Date: 2016-10-26
覃树强
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing conductive adhesives generally have the disadvantages of poor heat resistance an

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Example 1, a heat-resistant conductive adhesive made of the following raw materials in parts by weight (kg): organic titanium modified epoxy resin 50, polypyrrole 16, calcium zincate 2, titanium dioxide 2, p-tert-butyl pyrocatecha Phenol 3, adipic acid hydrazide 2, amino-terminated liquid nitrile rubber 3, polyacetylene 25, barium stearate 4, epoxy soybean oil 3, dipentyl phthalate 1, silver-coated copper powder 8, three Ethylenediamine 1, Nano hafnium diboride 3, Malonic acid 2, Isoamyl p-methoxycinnamate 1, Acetone 5, Turpentine 2.

[0016] A preparation method of heat-resistant conductive adhesive, comprising the following steps:

[0017] (1) Weigh each raw material by weight;

[0018] (2) Mix organic titanium modified epoxy resin, calcium zincate and titanium dioxide, stir at 50°C and 200rpm for 15 minutes, then add p-tert-butylpyrocatechol, stir at 60°C and 150rpm for 12 minutes, Cool to room temperature;

[0019] (3) Mix the mixture prepared in step (1) with po...

Embodiment 2

[0022] Example 2, a heat-resistant conductive adhesive made of the following raw materials in parts by weight (kg): organic titanium modified epoxy resin 55, polypyrrole 17, calcium zincate 2, titanium dioxide 3, p-tert-butyl pyrocatecha Phenol 4, adipic acid hydrazide 3, amino-terminated liquid nitrile rubber 4, polyacetylene 30, barium stearate 5, epoxy soybean oil 4, dipentyl phthalate 2, silver-coated copper powder 10, three Ethylenediamine 2, nano hafnium diboride 4, malonic acid 3, isoamyl p-methoxycinnamate 2, acetone 6, turpentine 3.

[0023] A preparation method of heat-resistant conductive adhesive, comprising the following steps:

[0024] (1) Weigh each raw material by weight;

[0025] (2) Mix organic titanium modified epoxy resin, calcium zincate and titanium dioxide, stir at 55°C, 220rpm for 12 minutes, then add p-tert-butylpyrocatechol, stir at 65°C, 180rpm for 10 minutes, Cool to room temperature;

[0026] (3) Mix the mixture prepared in step (1) with polypyr...

Embodiment 3

[0029] Example 3, a heat-resistant conductive adhesive made of the following raw materials in parts by weight (kg): organic titanium modified epoxy resin 60, polypyrrole 18, calcium zincate 3, titanium dioxide 4, p-tert-butyl pyrocatecha Phenol 5, adipic acid hydrazide 4, amino-terminated liquid nitrile rubber 5, polyacetylene 35, barium stearate 6, epoxy soybean oil 5, dipentyl phthalate 3, silver-coated copper powder 12, three Ethylene diamine 3, nano hafnium diboride 5, malonic acid 4, isoamyl p-methoxycinnamate 3, acetone 7, turpentine 4.

[0030] A preparation method of heat-resistant conductive adhesive, comprising the following steps:

[0031] (1) Weigh each raw material by weight;

[0032] (2) Mix organic titanium modified epoxy resin, calcium zincate and titanium dioxide, stir at 60°C and 250rpm for 10 minutes, then add p-tert-butylpyrocatechol, stir at 70°C and 200rpm for 8 minutes, Cool to room temperature;

[0033] (3) Mix the mixture prepared in step (1) with p...

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PUM

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Abstract

The invention discloses heat-resistant electric-conductive glue and a preparation method thereof and relates to the technical field of electric-conductive glue. The heat-resistant electric-conductive glue is mainly prepared from: organic-titanium-modified epoxy resin, polypyrrole, calcium zincate, titanium dioxide, p-tert-butyl pyrocatechol, adipic hydrazide, amino-terminated liquid nitrile rubber, polyacetylene, barium stearate, epoxy soybean oil, dipentyl phthalate, silver-coated copper powder, triethylene diamine, nano hafnium diboride, malonic acid, isoamyl p-methoxycinnamate, acetone and turpentine. The organic-titanium-modified epoxy resin is compounded with the polyacetylene and the polypyrrole, so that the heat resistance and electric conductivity of the glue are improved greatly. Through combination of the dipentyl phthalate, the epoxy soybean oil and other plasticizers, the thermal stability of the electric-conductive glue is improved. The fillers, such as the silver-coated copper powder, calcium zincate and nano hafnium diboride, further improves the electric conductivity of the glue. The electric-conductive glue has good electric conductivity, high strength and good heat resistance.

Description

technical field [0001] The invention relates to the technical field of conductive adhesives, in particular to a heat-resistant conductive adhesive and a preparation method thereof. Background technique [0002] Conductive adhesive is an adhesive with a certain conductivity after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matrix resin to form a conductive adhesive. Pathway to realize the conductive connection of the adhered material. Since the matrix resin of the conductive adhesive is an adhesive, a suitable curing temperature can be selected for bonding. At the same time, due to the miniaturization and miniaturization of electronic components and the rapid development of high density and high integration of printed circuit boards, The conductive adhesive can be made into a paste to achieve high line resolution. Moreover, ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J179/04C09J149/00C09J9/02C09J11/08C09J11/06C09J11/04
CPCC09J163/00C08K2201/011C08L2201/08C08L2205/035C09J9/02C09J11/04C09J11/06C09J11/08C08L79/04C08L15/00C08L49/00C08L91/00C08K13/06C08K9/10C08K2003/085C08K2003/2241C08K3/24
Inventor 覃树强
Owner 覃树强
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