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Preparation method for diamond wire saw utilizing composite binder

A composite binder and diamond wire saw technology, which is applied in stone processing equipment, manufacturing tools, fine working devices, etc., can solve the problems of limited cutting speed wire saw service life, insufficient diamond abrasive holding force, and large resin elasticity. , to improve heat resistance, strengthen adhesion and bond, and prolong service life

Active Publication Date: 2017-01-04
江苏益林金刚石工具有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the defect of resin bonded diamond wire saw is that due to the high elasticity and low strength of the resin, the holding force of the resin to the diamond abrasive is not strong enough, which limits the cutting speed and the service life of the wire saw.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A preparation method of a composite bond diamond wire saw, specifically the following steps:

[0032] Step 1. Surface pretreatment of the diamond wire saw substrate: take a high-carbon steel wire with a circular cross-section and a diameter of 0.13 mm, and polish the surface of the high-carbon steel wire with 400# to 600# sandpaper to remove the oxide layer and rust; Then put it in an aqueous solution of 8% sodium hydroxide and boil for 30 minutes to remove the oil stain on the surface of the high-carbon steel wire, rinse it with deionized water until the pH value is 7; put the rinsed high-carbon steel wire into an aqueous solution of hydrochloric acid with a mass concentration of 10% Etch in medium for 5 minutes to remove the residual oxide layer and rust on the high-carbon steel wire, rinse with deionized water until the pH value is 7; soak the cleaned high-carbon steel wire in acetone for 30 minutes to remove the organic matter on the surface of the high-carbon steel ...

Embodiment 2

[0049] A preparation method of a composite bond diamond wire saw, specifically the following steps:

[0050] Step 1. Surface pretreatment of the diamond wire saw substrate: take a high-carbon steel wire with a circular cross-section and a diameter of 0.14 mm, and polish the surface of the high-carbon steel wire with 400# to 600# sandpaper to remove the oxide layer and rust; Then put it into 9% sodium hydroxide aqueous solution, boil and soak for 25 minutes, remove the oil stain on the surface of the high-carbon steel wire, rinse it with deionized water until the pH value is 7; put the rinsed high-carbon steel wire into a 10% aqueous hydrochloric acid solution Etch in medium for 5 minutes to remove the residual oxide layer and rust on the high-carbon steel wire, rinse with deionized water until the pH value is 7; soak the cleaned high-carbon steel wire in acetone for 30 minutes to remove the organic matter on the surface of the high-carbon steel wire , and rinsed with deionized...

Embodiment 3

[0067] A preparation method of a composite bond diamond wire saw, specifically the following steps:

[0068] Step 1. Surface pretreatment of the diamond wire saw substrate: take a high-carbon steel wire with a circular cross-section and a diameter of 0.15mm, and polish the surface of the high-carbon steel wire with 400#~600# sandpaper to remove the oxide layer and rust; Then put it into 10% sodium hydroxide aqueous solution, boil and soak for 20 minutes, remove the oil stain on the surface of the high-carbon steel wire, rinse it with deionized water until the pH value is 7; put the rinsed high-carbon steel wire into a 10% aqueous hydrochloric acid solution Etch in medium for 5 minutes to remove the residual oxide layer and rust on the high-carbon steel wire, rinse with deionized water until the pH value is 7; soak the cleaned high-carbon steel wire in acetone for 30 minutes to remove the organic matter on the surface of the high-carbon steel wire , and rinsed with deionized wa...

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PUM

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Abstract

The invention discloses a preparation method for a diamond wire saw utilizing a composite binder. The method comprises following steps: step 1, surface pre-preparation of a wire saw matrix; step 2, surface processing of a diamond abrasive; step 3, preparation of the diamond abrasive and the composite binder into a combined coating; step 4, coating; step 5, primary curing; step 6, secondary curing. The preparation method for the diamond wire saw utilizing the composite binder has following advantages: the composite binder contains thermosetting resin and light-cured resin and is added with high-performance liquid rubber, a coupling agent, nano-ceramic powder and nano-copper powder so that adhesion intensity of the composite binder is improved, hear resistance of the composite binder is enhanced and holding force of the composite binder and the diamond abrasive is improved; the diamond abrasive is prevented from falling down during saw cutting so that the service lifetime of the diamond wire saw is prolonged; and meanwhile, two curing processes help strengthen the combination and adhesion among light-cured resin, thermosetting resin and the diamond abrasive and helps holding force of the composite binder and the diamond abrasive.

Description

technical field [0001] The invention relates to a preparation method of a diamond tool, in particular to a preparation method of a composite bond diamond wire saw. Background technique [0002] In recent years, in the cutting of large-scale semiconductor substrates and functional crystals, the consolidated superabrasive wire saw is considered to be one of the best cutting materials. Diamond wire saw is a cutting tool made by solidifying and holding high-hardness and high-wear-resistance diamond abrasives on a wire matrix. The consolidation methods of diamond abrasives in diamond wire saws include rolling embedding, extrusion or stamping, metal bond consolidation (brazing), metal bond consolidation (electroplating), and resin bond consolidation. At present, the commonly used methods of preparing bonded abrasive diamond wire saws in the market are mainly brazing method, electroplating method and resin bond consolidation method. The brazing method is a method of achieving hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04
Inventor 吴益易宏峰
Owner 江苏益林金刚石工具有限公司
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