Copper-nickel alloy powder for ultralow-resistance chip resistor

A chip resistor and alloy powder technology, which is applied in the direction of resistors, thick film resistors, non-adjustable metal resistors, etc., can solve the problem of poor linearity of resistance of copper-manganese alloy powder, high control standard of oxygen content in the atmosphere, and the use of temperature range Narrow and other problems, to achieve the effect of improving the temperature coefficient of resistance, low price, and wide temperature range

Inactive Publication Date: 2017-02-22
JIANGSU BOQIAN NEW MATERIALS
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copper-manganese alloy powder is also used in the resistance material of ultra-low resistance chip resistors, but its stability is poor, and the process control is responsible. At the same time, the surface of copper-manganese alloy powder needs to be coated with antioxidants, resulting in high production costs; The resistance linearity is not good, the resistivity control is responsible, and the use temperature range is narrow, and the sintering process has a high control standard for the oxygen content of the atmosphere

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Copper-nickel alloy powder for ultralow-resistance chip resistor
  • Copper-nickel alloy powder for ultralow-resistance chip resistor
  • Copper-nickel alloy powder for ultralow-resistance chip resistor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Example 1. Preparation of Cu59Ni40Mn0.5Fe0.5 copper-nickel alloy powder with a particle size of 2 μm.

[0033] Firstly, according to the required molar ratio of the above-mentioned copper-nickel alloys, the mass of Cu, Ni, Mn and Fe is prepared, placed in an induction furnace and smelted into copper-nickel alloys.

[0034] Put the alloy block into the crucible of the high-temperature metal evaporator, and install the plasma generating device (for details, please refer to ZL201110119245.2, Metal Evaporation Device and the Method for Using the Device to Prepare Ultrafine Metal Powder, and the specific preparation will not be described in detail here. process), and check the airtightness, evacuate well, pour nitrogen into the system to make the whole system under the inert gas atmosphere, control the pressure in the crucible, start the plasma generator, set the power at 30KW, and increase the power of the plasma gun after 2 hours of heat preservation To 90KW, start the con...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
oxygen contentaaaaaaaaaa
melting pointaaaaaaaaaa
Login to view more

Abstract

The invention provides copper-nickel alloy powder for an ultralow-resistance chip resistor. The copper-nickel alloy powder is characterized by being prepared from following components of 35-45 wt% of Ni, smaller than 1 wt% of Mn, smaller than 1 wt% of Fe and the balance Cu. The grain diameter of the copper-nickel alloy powder is uniform, and the average grain diameter ranges from 0.3 micrometer to 3 micrometers; and through further screening and high-precision gas phase classification, granularity distribution of the powder can be adjusted and controlled, upgrading of the printing process of a thick film of a low chip resistor can be promoted, the thickness is close to that achieved through a thin film evaporation process, and therefore the electrical performance of the ultralow-resistance chip resistor is improved.

Description

technical field [0001] The invention relates to the technical field of chip resistors, in particular to a copper-nickel alloy powder for ultra-low resistance (below 500 mΩ) chip resistors. Background technique [0002] Chip resistors are one of the most commonly used electronic components and have the property of controlling direct current or alternating current. Utilizing this property, the resistor reduces the voltage inside the circuit or keeps the current constant. Its resistance basically obeys Ohm's law. At the same time, it uses materials with high conductivity and substances with low conductivity to achieve resistance values. SiO2, RuO2, and Cu are used. As the main resistance material of chip resistors, alloys can produce high-resistance, low-resistance, ultra-low-resistance and other product series, which are widely used in mobile phones, computers and other communication equipment, with huge commercial value. [0003] Ultra-low resistance alloy chip resistors, al...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06B22F1/00B22F9/12H01B1/02H01C7/00
CPCC22C9/06B22F1/0003B22F9/12H01B1/026H01C7/003
Inventor 谢上川陈钢强宋书清高书娟
Owner JIANGSU BOQIAN NEW MATERIALS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products