Surface electrode silver paste for chip type resistor and preparation method for surface electrode silver paste

A surface electrode and resistance technology, which is applied in the field of surface electrode silver paste for chip resistors and its preparation, can solve the problem of resistance accuracy, working voltage temperature coefficient, and voltage coefficient stability not meeting the requirements, irreplaceable, and backward technology, etc. Problems, achieve good solderability and low contact resistance characteristics, anti-discoloration ability of silver layer, and improve the effect of silver layer strength

Active Publication Date: 2017-05-17
广东羚光新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the paste used in chip resistors comes from European, American and Japanese companies. The product technology is mature and stable, and the price is relatively high. However, the domestic paste is not yet fully mature and the technology is backward. The product technical goals such as: resistance accuracy, working voltage, The temperature

Method used

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  • Surface electrode silver paste for chip type resistor and preparation method for surface electrode silver paste
  • Surface electrode silver paste for chip type resistor and preparation method for surface electrode silver paste

Examples

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Effect test

Embodiment 1

[0040]The surface electrode silver paste for chip resistors of this embodiment is made up of the following raw materials in weight percent: silver powder with a particle size less than 5 μm: 70%; palladium powder: 0.5%; metal powder: 1.5%; glass powder: 5%; organic carrier: twenty three%. Among them, the purity of the silver powder is greater than 99.9%, calculated as a percentage of the total weight of the silver paste for the surface electrode of the chip resistor, and consists of the following components: 52% of spherical silver powder with a particle size of 0.5-3.0 μm; Shape silver powder 14%; Nano silver powder 4%. Palladium powder is pure palladium powder, its particle size D 90 0.1 to 0.8 μm. The metal powder is copper powder with a particle size of 0.5-3.0 μm. Glass powder, B without lead and cadmium 2 o 3 -SiO 2 -Bi 2 o 3 -TiO 2 Glass system, particle size less than 5μm, D 50 1.0~2.0μm, glass softening temperature is 650~750℃, converted into oxides, includi...

Embodiment 2

[0042] The surface electrode silver paste for chip resistance of embodiment 1, its preparation method is as follows:

[0043] (1) Preparation of glass powder

[0044] B by weight percentage 2 o 3 10%, SiO 2 10%, Bi 2 o 3 51%, TiO 2 20%, Al 2 o 3 5%, La 2 o 3 2%, CaO 1.5%, and ZnO 0.5% are mixed evenly with a pot mill, preheated at 450°C for 20 minutes, melted at 1300°C for 60 minutes, quenched, ball milled until the particle size is less than 5 μm, filtered and dried, and set aside;

[0045] (2) Preparation of organic carrier

[0046] 18% of ethyl cellulose, 32% of terpineol, 20% of diethylene glycol butyl ether, 20% of DuPont DBE mixed dibasic acid dimethyl ester, 5% of lecithin, and 5% of polyacrylate by mass percentage After mixing, heat and dissolve completely in a water bath at 90-100°C, and filter through 300 mesh to obtain a transparent glue;

[0047] (3) Preparation of surface electrode silver paste for chip resistors

[0048] 52% spherical silver powde...

Embodiment 3

[0050] The surface electrode silver paste for chip resistors of this embodiment is made up of the following raw materials in weight percent: silver powder with a particle size less than 5 μm: 68%; palladium powder: 1%; metal powder: 1%; glass powder: 6%; organic carrier: twenty four%. Among them, the purity of the silver powder is greater than 99.9%, calculated as a percentage of the total weight of the silver paste for the surface electrode of the chip resistor, and consists of the following components: 50% of spherical silver powder with a particle size of 0.5-3.0 μm; Shape silver powder 15%; Nano silver powder 3%. Palladium powder is pure palladium powder, its particle size D 90 0.1 to 0.8 μm. The metal powder is titanium powder with a particle size of 0.5-3.0 μm. Glass powder, B without lead and cadmium 2 o 3 -SiO 2 -Bi 2 o 3 -TiO 2 Glass system, particle size less than 5μm, D 50 1.0~2.0μm, glass softening temperature is 650~750℃, converted into oxides, including...

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Abstract

The invention discloses surface electrode silver paste for a chip type resistor. The surface electrode silver paste is prepared from the following raw materials based on weight percentages: 65-74% of silver powder with grain diameter of smaller than 5[mu]m, 0.5-5% of palladium powder, 0.5-5% of metal powder, 1-6% of glass powder, and 10-33% of organic carrier. The invention also discloses a preparation method for the surface electrode silver paste for the chip type resistor. The surface electrode silver paste for the chip type resistor can effectively solve the problems on the aspects of adhesive force, electroplating property, acid resistance, printing property and the like; the main technological goals of the products comprise resistance value precision, working voltage, temperature coefficient, voltage coefficient, stability and the like, and technologic indexes of the like products in Europe and America can be reached; and all the adopted materials can satisfy environment protection demands of foreign countries.

Description

technical field [0001] The invention relates to the technical field of metal powder materials, in particular to a surface electrode silver paste for chip resistors and a preparation method thereof. Background technique [0002] In recent years, the global resistor chip rate has increased year by year. In 2012, the global output of chip resistors accounted for more than 90% of the total output of resistors. The development of chip resistors has played a vital role in the overall development of the resistor industry. Thanks to the global mobile phone entering the era of 3G, 4G, multimedia and smart phones, computers entering the era of 64-bit and dual-core CPUs, and color TVs entering the era of large-screen flat-panel color TVs, the passive components used in the above-mentioned stand-alone machines include chip capacitors, Chip resistors, chip inductors, etc. have increased by 50% or even several times compared with the previous generation of the whole machine, and the deman...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B1/02H01C7/00
CPCH01B1/02H01B1/22H01C7/003
Inventor 王惠敏冯辉谭汝泉宋先刚娄红涛梁炳联
Owner 广东羚光新材料股份有限公司
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